1. An antireflective coating composition comprising,
(i) a thermal acid generator;
(ii) a crosslinkable copolymer comprising at least one unit with structure (1) and at least one unit with structure (2) and further where the crosslinkable polymer is free of acrylate groups and where structure (1) and (2) are,
where, R is selected from H and C1-C6 alkyl and R1 is independently selected from H, hydroxyl, C1-C6 alkyl, C1-C6 alkylenehydroxy, C1-C6 ester and C1-C6 carboxylic acid, and n=1-5; and
where, R and R10 are independently selected from H and (C1-C6)alkyl, and m is 1-5; and
(iii) a polymeric crosslinker comprising at least one unit of structure (6),
where R11 to R13 are independently selected from H, (C1-C6)alkyl and aromatic group, and, R14 and R15 are independently (C1-C10) alkyl.
2. The composition of claim 1, where the unit of structure (1) is further defined by structure (5),
where, R is selected from H and C1-C6 alkyl and R1 is independently selected from H, hydroxyl, C1-C6 alkyl, C1-C8 alkylenehydroxy, C1-C6 ester and C1-C6 carboxylic acid, and p=1-4.
3. The composition of claim 1, where R14 and R15 are methyl.
4. The composition of claim 1, where the polymeric crosslinker further comprises a styrenic or (meth)acrylate unit.
5. The composition of claim 1, where the thermal acid generator is selected from iodonium salts, tosylates, derivatives of benzene sulfonic acid salts, and derivatives of naphthalene sulfonic acid salts.
6. The composition of claim 1 where the carbon content of the composition after curing is greater than 75% by weight.
7. A process for imaging a photoresist comprising the steps of,
a) forming a antireflective coating from an antireflective coating composition of claim 1 on a substrate;
b) forming a coating of a photoresist over an antireflective coating;
c) imagewise exposing the photoresist with an exposure equipment; and,
d) developing the coating with an aqueous alkaline developer.
8. The process according to claim 1 where radiation for imagewise exposure is selected from 248 nm, 193 nm and 157 nm.
9. The process according to claim 1 where the developer in an aqueous solution of tetramethyl ammonium hydroxide.
10. An antireflective coating composition comprising,
(i) a thermal acid generator;
(ii) a crosslinkable acrylate polymer comprising units of structure (3) and (4),
where, R2 to R7 are independently selected from H, C1-C6 alkyl and C1-C6 alkylenehydroxy, R8 is an nonaromatic, and R9 comprises an aromatic moiety group selected from unsubstituted phenyl; and,
(iii) a polymeric crosslinker comprising at least one unit of structure (6),
where R11 to R13 is independently selected from H, (C1-C6) alkyl and aromatic group, and, R14 and R15 are independently (C1-C10) alkyl.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer implemented method for integrated ciruit design and simulation, comprising:
generating a virtual model of a circuit using a model for each component of the circuit, wherein at least one model comprises a lumped equivalent circuit representation of an integrated circuit transformer structure having stacked primary and secondary conductors over a groud planewith, in which conductor length is a user-specified parameter;
performing a simulation of the circuit based on one or more user-specified parameter values for conductor length; and
presenting results of the simulation.
2. The method of claim 1, wherein the lumped equivalent circuit representation of the integrated transformer comprises an RLC filter network.
3. The method of claim 2, wherein generating a virtual model comprises:
providing a user interface that allows a user to build a schematic depiction of the circuit using schemtic icon depictions of the circuit components; and
obtaining a model corresponding to each schematic icon depiction from a libray of predefined models.
4. The method of claim 2, wherein generating a virtual model comprises:
providing a user interface that allows a user to build a 3D circuit layout representation of the circuit;
performing a 3D EM analysis of the 3D circuit; and
generating a equivalent model for each circuit component using results of the 3D EM analysis.