1. An antenna module, suitable for an electronic system, the electronic system comprising a metal shielding case, the antenna module comprising:
s a waterproof protective cover removably assembled on an opening of the metal shielding case, the water-proof protective cover having a housing slot;
a transparent cap mounted on the waterproof protective cover;
a printed circuit board, a first part of the printed circuit board being inserted into the housing slot, a second part of the printed circuit being located within the metal shielding case;
a wireless communication unit disposed on the second part of the printed circuit board; and
an antenna unit disposed on the first part of the printed circuit board and electrically connected with the wireless communication unit.
2. The antenna module as claimed in claim 1, further comprising a sealing ring, wherein the sealing ring is hold between the waterproof protective cover and the metal shielding case when the waterproof protective cover is assembled on the opening of the metal shielding case.
3. The antenna module as claimed in claim 1, wherein the antenna module further comprises a light-emitting unit configured for generating an indicative light representing a system condition of the electronic system, and the indicative light is projected through the transparent cap.
4. The antenna module as claimed in claim 3, wherein the light-emitting unit disposed on the first part of the printed circuit board.
5. The antenna module as claimed in claim 3, wherein the transparent cap comprises a light-guiding cap and at least one light-guiding plugs, and the light-guiding plugs is inserted into the waterproof protective cover for holding the transparent cap and bypassing the indicative light.
6. The antenna module as claimed in claim 1, wherein the wireless communication unit is electrically connected to a mainboard of the electronic system.
7. An electronic system, comprising:
a metal shielding case;
a mainboard disposed within the metal shielding case;
an electronic circuit disposed on the mainboard;
an antenna module, a part of the antenna module being exposed outside the metal shielding case, the antenna module comprising:
a waterproof protective cover removably assembled on an opening of the metal shielding case, the water-proof protective cover having a housing slot;
a transparent cap mounted on the waterproof protective cover;
a printed circuit board, a first part of the printed circuit board being inserted into the housing slot, a second part of the printed circuit being located within the metal shielding case;
a wireless communication unit disposed on the second part of the printed circuit board, the wireless communication unit being electrically connected to the mainboard of the electronic system; and
an antenna unit disposed on the first part of the printed circuit board and electrically connected with the wireless communication unit, the antenna unit being located outside a shielding space formed by the metal shielding case.
8. The electronic system as claimed in claim 7, wherein the antenna module further comprises a sealing ring, and the sealing ring is hold between the waterproof protective cover and the metal shielding case when the waterproof protective cover is assembled on the opening of the metal shielding case.
9. The electronic system as claimed in claim 7, wherein the antenna module further comprises a light-emitting unit disposed on the first part of the printed circuit board.
10. The electronic system as claimed in claim 9, wherein the light-emitting unit is configured for generating an indicative light representing a system condition of the electronic system, the indicative light is projected through the transparent cap.
11. The electronic system as claimed in claim 9, wherein the transparent cap comprises a light-guiding portion, and the light-guiding portion is inserted into the waterproof protective cover for holding the transparent cap and bypassing the indicative light.
12. The electronic system as claimed in claim 9, wherein the electronic system is installed outdoors.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A semiconductor device comprising:
a chip;
an opened fuse formed on the chip and having an end;
an output pad formed on the chip and connected to the end of the opened fuse; and
a package encapsulating the chip and having an output lead, wherein the output lead is electrically connected to the output pad.
2. The semiconductor device of claim 1, further comprising a probing pad formed on the chip, wherein the opened fuse has another end connected to the probing pad.
3. The semiconductor device of claim 2, wherein the output pad has a first exposed portion and the probing pad has a second exposed portion and the first exposed portion is located closer to the opened fuse than the second exposed portion.
4. The semiconductor device of claim 1, wherein the output pad is formed irregularly on the chip.
5. The semiconductor device of claim 1, wherein the output pad is located at a central portion of the chip.
6. The semiconductor device of claim 1, wherein the chip has an internal circuit located adjacent to the output pad and the internal circuit is a circuit selected from the group consisting of an inputoutput circuit, a power source line, a ground line and a control circuit.
7. The semiconductor device of claim 2, wherein the probing pad is located at a peripheral area of the chip.
8. The semiconductor device of claim 1, wherein the output pad is connected to the output lead through a conductive bump.
9. The semiconductor device of claim 1, wherein the output pad is connected to the output lead through a conductive wire.
10. The semiconductor device of claim 1, wherein the package is a flip chip type package.
11. A semiconductor chip comprising:
a fuse formed on the chip and having two ends;
an output pad formed on the chip and connected to an end of the fuse; and
a probing pad formed on the chip and connected to the other end of the fuse,
wherein the output pad has a first exposed portion and the probing pad has a second exposed portion and the first exposed portion is located closer to the fuse than the second exposed portion.
12. The semiconductor device of claim 11, wherein the output pad is located at a central portion of the chip.
13. The semiconductor device of claim 11, wherein the chip has an internal circuit located adjacent to the output pad and the internal circuit is a circuit selected from the group consisting of an inputoutput circuit, a power source line, a ground line and a control circuit.
14. The semiconductor device of claim 11, wherein the probing pad is located at a peripheral area of the chip.
15. A method of fabricating a semiconductor device comprising:
providing chips having a plurality of probing pads, a plurality of output pads and a plurality of fuses, wherein each of the plurality of probing pads is connected to a corresponding one of the plurality of output pads though a corresponding one of the plurality of fuses;
cutting all of the plurality of fuses in a portion of the chips; and
encapsulating the portion of the chips using a package having a plurality of output leads, wherein each of the output leads is electrically connected to each of the output pads.
16. The method of the semiconductor device of claim 15, wherein the cutting is performed by a laser beam.
17. The method of the semiconductor device of claim 15, further comprising electrically testing the chips to identify the portion of the chips, wherein the testing is performed by contacting a plurality of probing tips on to the plurality of probing pads.
18. The method of the semiconductor device of claim 15, wherein the portion of the chips consists of good chips and repairable chips.
19. The method of the semiconductor device of claim 18, further comprising repairing the repairable chips, wherein the cutting is performed during the repairing.
20. A method of fabricating a semiconductor device comprising:
providing a plurality of chips having a probing pad, a output pad and a fuse, wherein the probing pad is electrically connected to the output pad though the fuse;
electrically testing the plurality of chips to identify a portion of the chips; and
cutting the fuse of the portion of the chips by a laser beam.
21. The method of the semiconductor device of claim 20, wherein the output pad has a first exposed portion and the probing pad has a second exposed portion and the first exposed portion is located closer to the fuse than the second exposed portion does to the fuse.
22. A method of fabricating a semiconductor device comprising:
providing a wafer;
forming a first layer on the wafer;
forming a second layer on the first layer; and
patterning the second layer, thereby exposing a portion of the first layer and forming a first pad and an second pad, wherein the first pad is electrically connected to the second pad through the exposed portion of the first layer.
23. The method of the semiconductor device of claim 22, wherein the first pad is a probing pad and the second pad is an output.
24. The method of the semiconductor device of claim 23, further comprising:
electrically testing the wafer by using the probing pad; and
cutting the exposed portion of the first layer by a laser beam.
25. The method of the semiconductor device of claim 23, further comprising:
forming a passivation layer on the probing pad and the output pad; and
pattering the passivation layer, thereby exposing a portion of the probing pad and a portion of the output pad, wherein the exposed portion of the first layer is closer to the exposed portion of the output pad than the exposed portion of the probing pad.
26. The method of the semiconductor device of claim 23, wherein the first layer is a barrier metal layer.
27. The method of the semiconductor device of claim 23, wherein the first layer comprises:
a titanium layer formed on the wafer; and
a titanium nitride layer formed on the titanium layer.
28. The method of the semiconductor device of claim 23, wherein the second layer comprises an aluminum alloy layer.