1. A golf tee leveling device consisting of a solid body having an: enlarged section at its upper end and a tapered section at its lower end, said lower end having a recess therein for receiving a head of a golf tee therein and to be held therein by the fingers of a player, said upper end of said body having a flat surface including a ring thereon, said ring having a sight glass thereon with a domed surface, said sight glass having a liquid therein including a bubble floating in said liquid, said bubble moving to a center position within said dome when said leveling device is in a perfect horizontal position, whereby said golf tee will be placed into the ground in a perfect vertical position when said leveling device is in a perfect horizontal position.
2. The golf tee leveling device of claim 1 including a depth gauge attached to a lateral side of said body.
3. A device adapted to place a golf tee into the ground comprising a body having an enlarged upper section and a tapered lower section, said body having a lateral extension attached thereto, said lateral extension having a downwardly extending sleeve mounted thereon, said sleeve receiving an elongated depth pin therein, said golf tee placing device, when pushing a golf tee into the ground, will limit the extent of said tee being pushed into ground.
4. The device of claim 3 including depth determining markings on said depth pin.
5. The device of claim 3 including a friction fit between said sleeve and said depth pin.
6. The placing device of claim 3 including an enlarged head at the bottom of said depth pin to limit an insertion of said depth pin into the ground.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A test assembly for an integrated circuit package, the test assembly comprising:
a package substrate having a plurality of first contact pads linked in a first daisy chain pattern; and
a test board having a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads, all of the second contact pads being divided into a plurality of groups each connected to one pair of test pads wherein all of the second contact pads in any group are arranged in a line,
wherein all of the second contact pads in any group are in a series electrical connection to one another through the first and second daisy chain patterns when the package substrate is mounted on the test board, and all of the second contact pads in any group form a closed circuit when the corresponding pair of test pads are probed.
2. The test assembly as claimed in claim 1, wherein the test board comprises a pair of major test pads such that all of the second contact pads form a closed circuit when the pair of major test pads is probed.
3. The test assembly as claimed in claim 1, wherein the package substrate is a ball grid array substrate.
4. A method of testing an integrated circuit package having a substrate with a plurality of first contact pads linked in a first daisy chain pattern, the method comprising:
providing a test board having a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads, all of the second contact pads being divided into a plurality of groups each connected to one pair of test pads wherein all of the second contact pads in any group are arranged in a line;
mounting the integrated circuit package on the test board by reflowing solder bumps provided on the integrated circuit package to the second contact pads of the test board wherein all of the second contact pads in any group are in a series electrical connection to one another through the first and second daisy chain patterns; and
performing an electrical test after conducting the mounting step,
wherein all of the second contact pads in any group form a closed circuit when the corresponding pair of test pads are probed.
5. The method as claimed in claim 4, wherein the test board comprises a pair of major test pads such that all of the second contact pads form a closed circuit when the pair of major test pads is probed.