What is claimed is:
1. A current detector utilizing the Hall-effect for detection or measurement of electric current, comprising:
(a) a current-path conductor for carrying current to be detected or measured;
(b) a Hall generator disposed in prescribed positional relationship to the current-path conductor for generating a Hall voltage proportional to the strength of a magnetic field due to the current flowing through the current-path conductor; and
(c) a magnetic overlay in the form of a sheet or film of magnetic material covering part of the current-path conductor for a higher sensitivity of current detection through enhancement of flux density acting on the Hall generator.
2. The current detector of claim 1 wherein the current-path conductor is formed to include a pair of opposite terminal portions and a midsection therebetween, wherein the Hall generator is so positioned relative to the current-path conductor as to be acted upon by a magnetic field due to the current flowing through the midsection of the current-path conductor, and wherein the magnetic overlay covers at least part of the midsection of the current-path conductor.
3. The current detector of claim 2 wherein the midsection of the current-path conductor extends around the Hall generator in a plane not containing the Hall generator, wherein the midsection of the current-path conductor is rectangular in cross sectional shape, having a first major surface directed toward the Hall generator, a second major surface directed away from the Hall generator, an inside surface directed toward the Hall generator, and an outside surface directed away from the Hall generator, and wherein the magnetic overlay covers the second major surface of the current-path conductor.
4. The current detector of claim 2 wherein the midsection of the current-path conductor extends around the Hall generator in a plane not containing the Hall generator, wherein the midsection of the current-path conductor is rectangular in cross sectional shape, having a first major surface directed toward the Hall generator, a second major surface directed away from the Hall generator, an inside surface directed toward the Hall generator, and an outside surface directed away from the Hall generator, and wherein the magnetic overlay covers the outside surface of the current-path conductor.
5. The current detector of claim 2 wherein the midsection of the current-path conductor extends around the Hall generator in a plane not containing the Hall generator, wherein the midsection of the current-path conductor is rectangular in cross sectional shape, having a first major surface directed toward the Hall generator, a second major surface directed away from the Hall generator, an inside surface directed toward the Hall generator, and an outside surface directed away from the Hall generator, and wherein the magnetic overlay covers both second major surface and outside surface of the current-path conductor.
6. The current detector of claim 2 wherein the Hall generator is formed in a semiconductor substrate having a first major surface directed toward the current-path conductor, and a second major surface directed away from the current-path conductor, and wherein the current detector has a second magnetic overlay held against the second major surface of the semiconductor substrate.
7. The current detector of claim 1 further comprising:
(a) a casing of electrically insulating material enveloping the Hall generator and at least part of the current-path conductor with the magnetic overlay thereon; and
(b) a second magnetic overlay covering part of the casing.
8. The current detector of claim 1 wherein the magnetic overlay is of Permalloy.
9. A current detector utilizing the Hall-effect for detection or measurement of electric current, comprising:
(a) a current-path conductor in the form of a piece of sheet metal having a slit cut therein for providing a U-shaped path for the flow of current to be detected or measured, the sheet-metal current-path conductor having a pair of opposite major surfaces, an inside surface contiguous to the slit, and an outside surface facing away from the slit;
(b) a Hall generator for generating a Hall voltage proportional to the strength of an applied magnetic field;
(c) an encapsulation of electrically insulating material integrally enveloping the Hall generator and held against one of the major surfaces of the current-path conductor, with the Hall generator positioned inside the slit therein, as seen in a direction normal to the sheet-metal current-path conductor, for generating a Hall voltage indicative of the magnitude of the current flowing through the U-shaped current path; and
(d) a magnetic overlay in the form of a sheet or film of magnetic material covering at least either of the other major surface and outside surface of the current-path conductor for a higher sensitivity of current detection through enhancement of flux density acting on the Hall generator.
10. The current detector of claim 9 wherein the Hall generator is formed in a semiconductor substrate overlying a baseplate, and wherein the current detector further comprises a second magnetic overlay formed on the baseplate.
11. The current detector of claim 9 further comprising
(a) a casing of electrically insulating material enveloping the encapsulation, together with the Hall generator therein, and at least part of the current-path conductor together with the magnetic overlay thereon; and
(b) a second magnetic overlay covering at least part of the casing.
12. A current detector utilizing the Hall-effect for detection or measurement of electric current, comprising:
(a) a pair of current-path conductors each in the form of an elongate piece of sheet metal for carrying current to be detected or measured, the pair of current-path conductors extending in parallel spaced, coplanar relationship to each other, each sheet-metal current-path conductor having a pair of opposite major surfaces, an inside surface directed toward the other current-path conductor, and an outside surface directed away from the other current-path conductor;
(b) a Hall generator for generating a Hall voltage proportional to a difference between the magnitudes of currents flowing through the respective current-path conductors;
(c) a casing of electrically insulating material holding the Hall generator opposite the pair of current-path conductors and inside the space therebetween, as seen in a direction normal to the plane of the sheet-metal current-path conductors, the Hall generator being directed toward one of the major surfaces of each current-path conductor; and
(d) a magnetic overlay in the form of a sheet or film of magnetic material covering at least either of the other major surface and outside surface of each current-path conductor for a higher sensitivity of current detection through enhancement of flux density acting on the Hall generator.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A device, comprising:
an electronic circuit that includes a support to which are attached at least two circuit portions, each including at least one integrated circuit chip;
a wafer of a semiconductor material spaced apart from the support;
a conductive layer arranged parallel to the support and covering a surface of the wafer that faces the support; and
conductive pillars connecting the wafer to the support and extending from the conductive layer to the support, the conductive pillars being distributed around each circuit portion and in contact with the conductive layer.
2. The device of claim 1, wherein several adjacent conductive pillars are spaced apart, the device further comprising an insulating region arranged at least between the wafer and the support and covering each circuit portion.
3. The device of claim 1, wherein the support comprises:
a planar insulating portion;
first conductive tracks arranged on a first surface of the planar insulating portion, the first conductive tracks being connected to at least some of the conductive pillars;
second conductive tracks arranged on a second surface of the planar insulating portion opposite to the first surface, the second conductive tracks being for connection to a reference voltage; and
means, contained in the planar insulating portion, for connecting the first conductive tracks to the second conductive tracks.
4. The device of claim 1, wherein the conductive pillars have a spherical shape.
5. The device of claim 1, wherein the conductive pillars have an at least partly cylindrical shape.
6. The device of claim 1, wherein at least two adjacent conductive pillars are in contact.
7. The device of claim 1, wherein the support is a ball grid array package.
8. A method for manufacturing electronic circuits, comprising the steps of:
providing a planar support;
attaching circuit portions on a surface of the support, each circuit portion containing at least one integrated circuit chip; and
attaching wafer portions of a semiconductor material to the support, the wafer portions being spaced apart from and parallel to said surface of the support, each wafer portion: covering a respective one of the circuit portions, having a side facing the circuit portions being covered with a conductive layer, and being connected to the support by conductive pillars distributed around each of said circuit portions and extending between the conductive layer and the support.
9. The method of claim 8, wherein at least several adjacent conductive pillars are spaced apart and the delimiting step is preceded by introducing an insulating material between spaced apart portions of the conductive pillars and under each wafer portion to cover said at least two adjacent circuit portions.
10. The method of claim 8, wherein the wafer portions are obtained by sawing of a wafer on which the conductive pillars are distributed.
11. The method of claim 8 wherein the conductive pillars are formed by spreading welding paste through a mask on to the conductive layer.
12. The method of claim 8 wherein the conductive pillars are formed by forming an insulating layer on the conductive layer, etching the insulating layer to form openings, and forming the conductive pillars in the openings.
13. A protected electronic device, comprising:
a support;
first and second circuit portions positioned on the support, each circuit portion including at least one integrated circuit chip;
a wafer spaced apart from the support;
a conductive layer arranged parallel to the support and covering a surface of the wafer that faces the support; and
conductive pillars connecting the wafer to the support and extending from the conductive layer to the support, the conductive pillars being distributed around each circuit portion and in contact with the conductive layer,
wherein the wafer is of a semiconductor material.
14. The device of claim 13, wherein several adjacent conductive pillars are spaced apart, the device further comprising an insulating region arranged at least between the wafer and the support and covering each circuit portion.
15. The device of claim 13, wherein the support comprises:
a planar insulating portion;
first conductive tracks arranged on a first surface of the planar insulating portion, the first conductive tracks being connected to at least some of the conductive pillars;
second conductive tracks arranged on a second surface of the planar insulating portion opposite to the first surface, the second conductive tracks being for connection to a reference voltage; and
conductive vias extending through the planar insulating portion and connecting the first conductive tracks to the second conductive tracks.
16. The device of claim 13, wherein the conductive pillars have a spherical shape.
17. The device of claim 13, wherein the conductive pillars have an at least partly cylindrical shape.
18. The device of claim 13, wherein at least two adjacent conductive pillars are in contact.
19. The device of claim 13, wherein the conductive pillars are distributed around four sides of each of the circuit portions.