1. A method for manufacturing a stacked electronic component, comprising:
adhering a first electronic component having first electrode pads on a substrate having electrode portions;
connecting a first portion of the electrode portions and the first electrode pads via first bonding wires;
adhering a second electronic component having second electrode pads on the first electronic component by using an adhesive layer structure including a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side; and
connecting a second portion of the electrode portions and the second electrode pads via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer;
wherein the first layer softens or melts at an adhesive temperature of the second electronic component, and has a viscosity within a range of 1 kPa\xb7s or more and 100 kPa\xb7s or less at the adhesive temperature, and the second layer maintains a layered shape for the adhesive temperature of the second electronic component, and has a viscosity of a range of 130 kPa\xb7s or more at the adhesive temperature; and
wherein ends of the first bonding wires connected to the second electrode pads are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component.
2. The manufacturing method according to claim 1,
wherein the second electronic component has a portion protruding outside from an outer periphery of the first electronic component, and the first layer is filled between the protruding portions of the second electronic component and the substrate by softened or melted at the adhesive temperature of the second electronic component.
3. The manufacturing method according to claim 1,
wherein the first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
4. The manufacturing method according to claim 1,
wherein the first layer substantially covers the first electronic component, and the second layer substantially covers the second electronic component.
5. The manufacturing method according to claim 1,
wherein the first and second layers have a room temperature modulus of elasticity in a range of 500 MPa or more and 1200 MPa or less.
6. The manufacturing method according to claim 1,
wherein the adhesive layer has a modulus of elasticity at 175\xb0 C. of 40 MPa or more after cure, and a modulus of elasticity at 260\xb0 C. of 1 MPa or more after cure.
7. The manufacturing method according to claim 1,
wherein the first and second layers are made of an epoxy resin.
8. The manufacturing method according to claim 1,
wherein the second electronic component has a surface area the same as or larger than a surface area of the first electronic component.
9. A method for manufacturing a stacked electronic component, comprising:
adhering a first electronic component having first electrode pads on a substrate having electrode portions;
connecting a first portion of the electrode portions and the first electrode pads via first bonding wires;
adhering a second electronic component having second electrode pads on the first electronic component by using an adhesive layer structure having a first layer disposed adjacent to the first electronic component and a second layer disposed adjacent to the second electronic component; and
connecting a second portion of the electrode portions and the second electrode pads via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer; and
wherein the first and second layers have a room temperature modulus of elasticity in a range of 500 MPa or more and 1200 MPa or less.
10. The manufacturing method according to claim 9, wherein the first layer substantially covers the first electronic component, and the second layer substantially covers the second electronic component.
11. The manufacturing method according to claim 9,
wherein ends of the first bonding wires connected to the second electrode pads are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component.
12. The manufacturing method according to claim 9,
wherein the second electronic component has a surface area the same as or larger than a surface area of the first electronic component.
13. The manufacturing method according to claim 9,
wherein the first and second layers are made of an epoxy resin.
14. The manufacturing method according to claim 9,
wherein the first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
15. A method for manufacturing a stacked electronic component, comprising:
adhering a first electronic component having first electrode pads on a substrate having electrode portions;
connecting a first portion of the electrode portions and the first electrode pads via first bonding wires;
adhering a second electronic component having second electrode pads on the first electronic component by using an adhesive layer structure having a first layer disposed adjacent to the first electronic component and a second layer disposed adjacent to the second electronic component; and
connecting a second portion of the electrode portions and the second electrode pads via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer; and
wherein the adhesive layer has a modulus of elasticity at 175\xb0 C. of 40 MPa or more after cure, and a modulus of elasticity at 260\xb0 C. of 1 MPa or more after cure.
16. The manufacturing method according to claim 15,
wherein the first layer substantially covers the first electronic component, and the second layer substantially covers the second electronic component.
17. The manufacturing method according to claim 15,
wherein ends of the first bonding wires connected to the second electrode pads are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component.
18. The manufacturing method according to claim 15,
wherein the second electronic component has a surface area the same as or larger than a surface area of the first electronic component.
19. The manufacturing method according to claim 15,
wherein the first and second layers are made of an epoxy resin.
20. The manufacturing method according to claim 15,
wherein the first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A pulse generator, for delivering electrical stimulation to a patient, comprising:
a battery operable to power the pulse generator;
circuitry for generating and delivering electrical pulses to tissue of the patient according to a plurality of controllable output levels; and
a voltage conversion module operable to convert from a voltage level from the battery to a variable converted voltage level for provision to the circuitry for generating and delivering, wherein the voltage conversion module comprises a plurality of capacitive voltage multipliers including at least one fractional capacitive voltage multiplier, and the voltage conversion module including a voltage combining element that combines the voltages output from the plurality of capacitive voltage multipliers to produce the converted voltage level.
2. The pulse generator of claim 1, wherein the voltage conversion module provides converted voltage levels in \xbc increments of the voltage level from the battery.
3. The pulse generator of claim 1, wherein the voltage conversion module comprises a logic element for receiving multiple control bits, the control bits identifying a desired voltage level for the converted voltage level.
4. The pulse generator of claim 1, wherein the voltage conversion module comprises:
switching circuitry that is operable to controllably arrange a plurality of capacitors into a stacked circuit configuration to achieve a desired fractional voltage level.
5. The pulse generator of claim 4, wherein the switching circuitry of the voltage conversion module is implemented in at least one integrated circuit disposed between a plurality of capacitors.
6. The pulse generator of claim 4, wherein lower voltage capacitors are disposed at a bottom portion of the stacked circuit configuration and higher voltage capacitors are disposed at a top portion of the stacked circuit configuration.
7. The pulse generator of claim 1, wherein the voltage conversion module is operable to partition a plurality of controllable switches to minimize a number of components of the voltage conversion module experiencing high voltage levels.
8. The pulse generator of claim 1 further comprising:
control circuitry for causing delivery of multiple pulses to tissue of the patient in succession, the control circuitry (i) causing the converted voltage level to equal a first voltage level before causing the circuitry for delivering to deliver a first electrical pulse at a first amplitude; and shortly thereafter (ii) causing the converted voltage level to equal a second voltage level before causing the circuitry for delivering to deliver a second electrical pulse at a second amplitude.
9. The pulse generator of claim 8, wherein at least one storage capacitor in the plurality of capacitive voltage multipliers is not discharged between the first and second electrical pulses.
10. The pulse generator of claim 1, wherein at least one capacitor in the voltage conversion module is used in a charge phase, a pump phase, and a source phase.
11. The pulse generator of claim 1, wherein the battery is a rechargeable battery.
12. The pulse generator of claim 1, wherein the pulse generator device is a neurostimulator device.
13. A method of operating a pulse generator for delivering electrical stimulation to a patient, the method comprising:
powering the pulse generator using a battery;
generating electrical pulses according to a plurality of controllable output levels;
delivering the generated electrical pulses to tissue of the patient; and
converting from a voltage level from the battery to a variable converted voltage level for use by the generating, wherein the converting includes (i) multiplying the voltage level from the battery by multiple capacitive multipliers including at least one fractional capacitive multiplier and (ii) combining voltages output from the multiple capacitive multipliers to produce the converted voltage level.
14. The method of claim 13, wherein the converting is performed in \xbc increments of the voltage level from the battery.
15. The method of claim 13, further comprising:
communicating multiple control bits to identify a desired voltage level for the converted voltage level.
16. The method of claim 13, wherein the converting comprises:
configuring switching circuitry between a plurality of capacitors to achieve the converted voltage level.
17. The method of claim 16, wherein a plurality of switches are controlled to create a stacked circuit configuration of capacitors to achieve a desired fractional voltage level.
18. The method of claim 13 further comprising:
causing the converted voltage level to equal a first voltage level before causing the generation and delivery of a first electrical pulse at a first amplitude, and shortly thereafter causing the converted voltage level to equal a second voltage level before causing the generation and delivery of a second electrical pulse at a second amplitude.
19. The method of claim 18, wherein at least one storage capacitor in the plurality of capacitive voltage multipliers is not discharged between the first and second electrical pulses.
20. The method of claim 13, wherein at least one capacitor in the multiple capacitive voltage multipliers is used in a charge phase, a pump phase, and a source phase.