1. A fire door stop system used with a fire door assembly that includes a fire door and a fire door frame having a soffit that forms an overlap surface between the fire door and the fire door frame, the fire door stop system comprising:
a profile strip that is configured to be fastenable to the soffit; and
a seal consisting of an intumescent material to form an intumescent seal between the profile strip and the soffit;
wherein the profile strip has a flange that, when fastened to the soffit, extends outward from the soffit, so as to form an extended overlap surface between the fire door and the fire door frame, the flange having a face surface that faces the fire door; and
wherein the seal is affixed to the face surface of the flange so as to form the intumescent seal between the flange and the soffit under non-fire conditions when the fire door is closed.
2. The fire door stop system of claim 1, wherein the soffit has a fire door stop surface against which the fire door closes;
wherein the profile strip is a flat strip; and
wherein the flange is formed by folding an edge of the profile strip.
3. The fire door stop system of claim 2, wherein the profile strip is constructed of 22 gauge steel.
4. The fire door stop system of claim 1, further comprising a horizontal edge protector, wherein the fire door has a front face, a rear face, and a horizontal edge face at a top and at a bottom of the fire door, and wherein the horizontal edge protector has a three-sided channel shape that fits over the horizontal edge face and extends a distance onto the front face and the rear face, so as to protect the horizontal edge face at the top andor at the bottom of the fire door.
5. The fire door stop system of claim 4, wherein the horizontal edge protector is a bottom-edge extension that is fastenable to a bottom edge of the fire door and is adjustable in its placement on the bottom edge of the fire door, so as to reduce a gap between the bottom edge of the fire door and a finished floor surface.
6. The fire door stop system of claim 1, further comprising a latch protector that is a steel plate with a cutout dimensioned to accommodate dimensions of a striker plate opening that is provided on a striker plate that is mountable on the fire door frame, wherein the latch protector is mountable between the striker plate and the fire door frame.
7. The fire door stop system of claim 1, further comprising a vertical edge protector, wherein the fire door has a front face, a rear face, and a vertical edge face along each side of the fire door, and wherein the vertical edge protector is wrapped around the vertical edge face of at least one side of the fire door.
8. The fire door stop system of claim 1, wherein the profile strip is configured to remedy non-compliant fire doors and fire door frames having clearances greater than 316\u2033 for steel doors and greater than \u215b\u2033 for wood doors.
9. The fire door stop system of claim 1, wherein the profile strip is configured to remedy non-compliant fire doors and fire door frames having clearances up to \xbd\u2033 for steel doors and up to \u215c\u2033 for wood doors.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A contact for a semiconductor device component, comprising:
a core comprising a polymer and configured to protrude from the semiconductor device component in a generally transverse orientation relative to a plane of the semiconductor device component; and
a conductive coating on at least a portion of the core.
2. The contact of claim 1, wherein the core is flexible and resilient.
3. The contact of claim 1, wherein the core is substantially rigid.
4. The contact of claim 1, wherein the core comprises a plurality of adjacent, mutually adhered regions of the polymer.
5. The contact of claim 1, wherein the polymer comprises a photoimagable polymer.
6. The contact of claim 1, wherein the core includes a base, an intermediate section, and a contact tip.
7. The contact of claim 6, wherein the intermediate section is flexible and resilient.
8. The contact of claim 6, wherein the base is configured to be secured to the semiconductor device component.
9. The contact of claim 6, wherein the conductive coating covers at least a portion of the contact tip and at least a portion of the intermediate section.
10. The contact of claim 9, wherein the conductive coating substantially covers the contact tip.
11. The contact of claim 9, wherein the contact tip is configured to electrically communicate with another contact of another semiconductor device component.
12. The contact of claim 9, wherein the conductive coating also covers at least a portion of the base.
13. The contact of claim 12, wherein a portion of the conductive coating on the base is configured to electrically communicate with a corresponding conductive element of the semiconductor device component.
14. The contact of claim 9, wherein the portion of the conductive coating on the intermediate section is configured to electrically communicate with a corresponding conductive element of the semiconductor device component.
15. The contact of claim 6, wherein the contact tip is enlarged relative to the intermediate section.
16. The contact of claim 1, wherein the conductive coating substantially covers the core.
17. The contact of claim 1, wherein the conductive coating comprises a plurality of layers of conductive material.
18. The contact of claim 1, wherein the core protrudes from a contact pad of the semiconductor device component.
19. The contact of claim 1, wherein the core comprises a filament.
20. A contact for a semiconductor device component, comprising:
a core comprising a filament comprising dielectric material and configured to protrude from the semiconductor device component in a generally transverse orientation relative to a plane of the semiconductor device component; and
a conductive coating on at least a portion of the core.
21. The contact of claim 20, wherein the core is flexible and resilient.
22. The contact of claim 20, wherein the core is substantially rigid.
23. The contact of claim 20, wherein the core comprises a plurality of adjacent, mutually adhered regions comprising the dielectric material.
24. The contact of claim 23, wherein the plurality of adjacent, mutually adhered regions comprises a plurality of at least partially superimposed, contiguous, mutually adhered layers.
25. The contact of claim 20, wherein the dielectric material comprises a polymer.
26. The contact of claim 25, wherein the polymer comprises a photoimagable polymer.
27. The contact of claim 20, wherein the core includes a base, an intermediate section, and a contact tip.
28. The contact of claim 27, wherein the intermediate section is flexible and resilient.
29. The contact of claim 27, wherein the base is configured to be secured to the semiconductor device component.
30. The contact of claim 27, wherein the conductive coating covers at least a portion of the contact tip and at least a portion of the intermediate section.
31. The contact of claim 30, wherein the conductive coating substantially covers the contact tip.
32. The contact of claim 31, wherein the contact tip is configured to electrically communicate with a contact of another semiconductor device component.
33. The contact of claim 30, wherein the conductive coating also covers at least a portion of the base.
34. The contact of claim 33, wherein a portion of the conductive coating on the base is configured to electrically communicate with a corresponding conductive element of the semiconductor device component.
35. The contact of claim 30, wherein the portion of the conductive coating on the intermediate section is configured to electrically communicate with a corresponding conductive element of the semiconductor device component.
36. The contact of claim 27, wherein the contact tip is enlarged relative to the intermediate section.
37. The contact of claim 20, wherein the conductive coating substantially covers the core.
38. The contact of claim 20, wherein the conductive coating comprises a plurality of contiguous regions of conductive material.
39. The contact of claim 38, wherein the plurality of contiguous regions comprises a plurality of layers.
40. The contact of claim 20, wherein the core is configured to protrude from a contact pad of the semiconductor device component.
41. A contact for a semiconductor device component, comprising:
a core comprising a dielectric material configured to be secured to and protrude from a contact pad of the semiconductor device component; and
a conductive coating on at least a portion of the core.
42. The contact of claim 41, wherein the core is flexible and resilient.
43. The contact of claim 41, wherein the core is substantially rigid.
44. The contact of claim 41, wherein the core comprises a plurality of adjacent, mutually adhered regions comprising the dielectric material.
45. The contact of claim 44, wherein the plurality of adjacent, mutually adhered regions comprises a plurality of at least partially superimposed, contiguous, mutually adhered layers.
46. The contact of claim 41, wherein the dielectric material comprises a polymer.
47. The contact of claim 46, wherein the polymer comprises a photoimagable polymer.
48. The contact of claim 41, wherein the core includes a base, an intermediate section, and a contact tip.
49. The contact of claim 48, wherein the intermediate section is flexible and resilient.
50. The contact of claim 48, wherein the base is configured to be secured to the semiconductor device component.
51. The contact of claim 48, wherein the conductive coating covers at least a portion of the contact tip and at least a portion of the intermediate section.
52. The contact of claim 51, wherein the conductive coating substantially covers the contact tip.
53. The contact of claim 52, wherein the contact tip is configured to electrically communicate with a contact of another semiconductor device component.
54. The contact of claim 51, wherein the conductive coating also covers at least a portion of the base.
55. The contact of claim 54, wherein a portion of the conductive coating on the base is configured to electrically communicate with a corresponding conductive element of the semiconductor device component.
56. The contact of claim 51, wherein the portion of the conductive coating on the intermediate section is configured to electrically communicate with a corresponding conductive element of the semiconductor device component.
57. The contact of claim 48, wherein the contact tip is enlarged relative to the intermediate section.
58. The contact of claim 41, wherein the conductive coating substantially covers the core.
59. The contact of claim 41, wherein the conductive coating comprises a plurality of contiguous regions of conductive material.
60. The contact of claim 59, wherein the plurality of contiguous regions comprises a plurality of layers.