1. A high strength steel pipe for line pipe superior in low temperature toughness characterized by comprising a steel plate shaped into a tube with seam portions of the steel plate welded by one layer each at the inner side and outer side, wherein a base metal of the steel pipe has a chemical composition containing, by mass %,
C: 0.020 to 0.080%,
Si: 0.01 to 0.50%,
Mo: 0.01 to 0.09%,
Al: 0.0005 to 0.030%, and
Nb: 0.013 to 0.030%
in a range of
C+0.25Si+0.1Mo+Al+Nb: 0.100% or less
further containing,
Mn: 1.50 to 2.50%,
Ti: 0.003 to 0.030%, and
B: 0.0001 to 0.0030%, and
limiting
P: 0.020% or less and
S: 0.0030% or less,
with the balance of Fe and unavoidable impurities, a mixture of austenite and martensite present along prior austenite grain boundaries of reheated parts of a heat affected zone having a width of 10 \u03bcm or less and a length of 50 \u03bcm or less and wherein the weld metal has a chemical composition containing, by mass %,
C: 0.010 to 0.100%,
Si: 0.01 to 0.50%,
Mn: 1.00 to 2.00%,
Ni: 1.30 to 3.20%,
Al: 0.0005 to 0.100%,
Ti: 0.003 to 0.050%, and
O: 0.0001 to 0.0500%
further containing
a total of one or more of Cr, Mo, and V: 1.00 to 2.50%,
limiting
P: 0.020% or less and
S: 0.0100% or less
with the balance of Fe and unavoidable impurities.
2. A high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 1 characterized in that the base metal has a tensile strength in the circumferential direction of 900 MPa or more.
3. A high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 1 characterized in that the weld metal has a chemical composition further containing, by mass %, B: 0.0001 to 0.0050%.
4. A high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 1 characterized in that the base metal has a chemical composition further containing, by mass %, one or both of
Cu: 0.05 to 1.50% and
Ni: 0.05 to 5.00%.
5. A high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 1 characterized in that the base metal has a chemical composition further containing, by mass %, one or more of
Cr: 0.02 to 1.50%,
W: 0.01 to 2.00%,
V: 0.010 to 0.100%,
Zr: 0.0001 to 0.0500%, and
Ta: 0.0001 to 0.0500%.
6. A high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 1 characterized in that the base metal has a chemical composition further containing, by mass %, one or more of
Mg: 0.0001 to 0.0100%,
Ca: 0.0001 to 0.0050%,
REM: 0.0001 to 0.0050%,
Y: 0.0001 to 0.0050%,
Hf: 0.0001 to 0.0050%, and
Re: 0.0001 to 0.0050%.
7. A method of production of the high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 1, said method of production characterized by melting and casting steel comprising the chemical composition as set forth in claim 1 into a steel slab, reheating the steel slab to 1000\xb0 C. or more, hot rolling by a reduction ratio in a nonrecrystallization temperature region of 3 or more to form a steel plate, water cooling, stopping water cooling at 500\xb0 C. or lower, shaping the steel plate into a tube, welding the seam potions to produce a pipe, and then enlarging the pipe.
8. A method of production of high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 7 characterized by shaping the steel plate into a tube by a UO process, welding the seam portions from the inner side and outer side by submerged arc welding to produce the pipe, then enlarging the pipe.
9. A method of production of a high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 8 wherein a welding wire used for the submerged arc welding has a chemical composition containing, by mass %,
C: 0.01 to 0.12%,
Si: 0.05 to 0.50%,
Mn: 1.00 to 2.50%, and
Ni: 2.00 to 8.50%
further containing one or more of Cr, Mo, and V in a range of
Cr+Mo+V: 1.00 to 5.00%
with a balance of Fe and unavoidable impurities.
10. A method of production of high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 9, the chemical composition of the welding wire further containing, by mass %, B: 0.0001 to 0.0050%.
11. A method of production of high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 7 further comprising heat treating the weld zone and heat affected zone after welding and before pipe expansion.
12. A method of production of high strength steel pipe for line pipe superior in low temperature toughness as set forth in claim 11 wherein the heating temperature of heat treating the weld zone and heat affected zone is 200 to 500\xb0 C.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A stage assembly that moves a device, the stage assembly comprising:
a stage including (i) a device table that retains the device, (ii) a first moving component that is connected to the device table, and (iii) a spaced apart second moving component that is connected to the device table;
a first reaction component that interacts with the first moving component, and a second reaction component that interacts with the second moving component, the interaction between at least one of the reaction components and at least one of the moving components causing movement of the device table relative to at least one of the reaction components, movement of the device table generating reaction forces that include a reaction force around a Z axis; and
a reaction assembly including (i) a first X reaction mass secured to the first reaction component, (ii) a second X reaction mass secured to the second reaction component, and (iii) a reaction mover assembly connected to at least one of the X reaction masses, the reaction mover assembly moving at least one of the X reaction masses to counteract the reaction force around the Z axis.
2. The stage assembly of claim 1 wherein movement of the device table generates an X reaction force along an X axis, and wherein the reaction assembly includes a reaction base that supports the first X reaction mass, the first X reaction mass moving relative to the reaction base to reduce-the X reaction force that is transferred to the reaction base.
3. The stage assembly of claim 2 wherein the reaction base supports the second X reaction mass, the second X reaction mass moving relative to the reaction base to reduce the X reaction force that is transferred to the reaction base.
4. The stage assembly of claim 3 further comprising a first Y reaction mass, the reaction base supporting the first Y reaction mass, wherein movement of the device table generates a Y reaction force along a Y axis, the first Y reaction mass being moved relative to the reaction base to counteract the Y reaction force on the reaction base.
5. The stage assembly of claim 4 further comprising a second Y reaction mass, the reaction base supporting the second Y reaction mass, the second Y reaction mass being moved relative to the reaction base to counteract the Y reaction force on the reaction base.
6. The stage assembly of claim 5 further comprising a stage base that supports the device table, wherein the first X reaction mass moves with two degrees of freedom relative to the stage base to reduce one or more of the reaction forces.
7. The stage assembly of claim 6 wherein the second X reaction mass moves with two degrees of freedom relative to the stage base to reduce one or more of the reaction forces.
8. The stage assembly of claim 1 further comprising a stage base that supports the device table, wherein the first X reaction mass moves with three degrees of freedom relative to the stage base to reduce the reaction forces that are transferred to the stage base, and wherein the second X reaction mass moves with three degrees of freedom relative to the stage base to reduce the reaction forces that are transferred to the stage base.
9. The stage assembly of claim 1 further comprising a trim mover assembly connected to at least one of the X reaction masses, the trim mover moving at least one of the X reaction masses relative to a mounting base.
10. The stage assembly of claim 1 further comprising a stage base that supports the device table, and a reaction base that supports at least one of the first X reaction mass and the second X reaction mass, wherein the reaction base is isolated from the stage base.
11. The stage assembly of claim 1 further comprising a stage base that supports the device table, wherein the first X reaction mass moves with two degrees of freedom relative to the stage base to reduce the reaction forces transferred to the stage base and with one degree of freedom relative to the second X reaction mass, and the second X reaction mass moves with two degrees of freedom relative to the stage base to reduce the reaction forces transferred to the stage base and with one degree of freedom relative to the first X reaction mass.
12. The stage assembly of claim 1 further comprising a stage base that supports the device table, wherein the first X reaction mass moves with three degrees of freedom relative to the stage base to reduce the reaction forces transferred to the stage base and with one degree of freedom relative to the second X reaction mass, and the second X reaction mass moves with three degrees of freedom relative to the stage base to reduce the reaction forces transferred to the stage base and with one degree of freedom relative to the first X reaction mass.
13. An exposure apparatus including the stage assembly of claim 1.
14. A device manufactured with the exposure apparatus according to claim 13.
15. A wafer on which an image has been formed by the exposure apparatus of claim 13.
16. A stage assembly that moves a device, the stage assembly comprising:
a device table that retains the device;
a mover assembly that is coupled to and moves the device table, movement of the device table generating reaction forces in at least two degrees of freedom;
a stage base that supports the device table, the stage base having a top surface that is opposite the device table; and
an X reaction mass secured to the mover assembly, the X reaction mass moving in two degrees of freedom relative to the stage base to reduce reaction forces in at least two degrees of freedom that are transferred to the stage base.
17. The stage assembly of claim 16 wherein the X reaction mass moves with at least three degrees of freedom relative to the stage base to reduce the reaction forces that are transferred to the stage base.
18. The stage assembly of claim 16 further comprising a reaction base that supports the X reaction mass, the reaction base moving with at least two degrees of freedom relative to the stage base.
19. The stage assembly of claim 16 further comprising a reaction base that supports the X reaction mass, the reaction base moving with at least three degrees of freedom relative to the stage base.
20. The stage assembly of claim 16 further comprising a reaction base that supports the X reaction mass, the X reaction mass moving with at least one degree of freedom relative to the reaction base.
21. The stage assembly of claim 16 further comprising a Y reaction mass and a reaction base that supports the Y reaction mass, the Y reaction mass being moved with one degree of freedom relative to the reaction base to counteract the reaction forces transferred to the reaction base.
22. The stage assembly of claim 21 wherein the Y reaction mass moves with at least three degrees of freedom relative to the stage base.
23. An exposure apparatus including the stage assembly of claim 16.
24. A device manufactured with the exposure apparatus according to claim 23.
25. A wafer on which an image has been formed by the exposure apparatus of claim 23.
26. The stage assembly of claim 16, wherein the mover assembly includes a first component and a second component that interacts with the first component for causing a force between the first component and the second component, the first component being connected to the first X reaction mass and a second component being connected to the device table.
27. A stage assembly that moves a device, the stage assembly comprising:
a device table that retains the device;
a stage base that supports the device table;
a mover assembly that moves the device table, movement of the device table generating reaction forces;
an X reaction mass that is connected to the device table is secured to the mover assembly;
a reaction base that supports the X reaction mass and allows the X reaction mass to move relative to the reaction base to reduce the reaction forces that are transferred to the reaction base; and
a mounting base that supports the reaction base and allows the reaction base to move with one degree of freedom.
28. The stage assembly of claim 27 wherein the reaction base moves with at least two degrees of freedom relative to the stage base and the mounting base.
29. The stage assembly of claim 27 wherein the reaction base moves with at least three degrees of freedom relative to the stage base and the mounting base.
30. The stage assembly of claim 29 wherein the X reaction mass reduces the reaction forces transferred to the stage base in at least two degrees of freedom.
31. The stage assembly of claim 27 further comprising an X trim mover that moves the X reaction mass with one degree of freedom relative to the reaction base and the stage base.
32. The stage assembly of claim 27, wherein the X reaction mass includes a first X reaction mass and a second X reaction mass, and the reaction base supports the first and second X reaction masses and allows the first and second X reaction masses to move relative to the reaction base independently each other.
33. The stage assembly of claim 27 further comprising an X reaction mover, the X reaction mover connected to the X reaction mass moving the X reaction mass relative to the reaction base to generate a correction force on the reaction base.
34. The stage assembly of claim 33 further comprising a X trim mover including a first component that is secured to the X reaction mass, and a second component that is coupled to the mounting base, the X trim mover moving the X reaction mass relative to the mounting base with one degree of freedom.
35. The stage assembly of claim 27 further comprising a Y reaction mass and a Y reaction mover that moves the Y reaction mass relative to the reaction base and generates a Y correction force along the Y axis that is transferred to the reaction base.
36. The stage assembly of claim 35 further comprising a Y trim mover including a first component that is secured to the Y reaction mass, and a second component that is coupled to the mounting base, the Y trim mover moving the Y reaction mass relative to the mounting base with one degree of freedom.
37. The stage assembly of claim 27, wherein the mover assembly includes a first component and a second component that interacts with the first component for causing a force between the first component and the second component, the first component being connected to the X reaction mass and a second component being connected to the device table.
38. A method for making a stage assembly that moves a device, the method comprising the steps of:
providing a device table that retains the device;
supporting the device table with a stage base;
connecting a mover assembly to the device table, the mover assembly generating reaction forces in at least two degrees of freedom; and
securing a first reaction mass and a second reaction mass to the mover assembly, each of the reaction masses moving with at least two degrees of freedom relative to the stage base to reduce the reaction forces, wherein the first reaction mass moves with at least one degree of freedom relative to the second reaction mass.
39. The method of claim 38 including the step of supporting the first reaction mass and the second reaction mass with a reaction base, the reaction base moving relative to the stage base with two degrees of freedom.
40. The method of claim 38 including the step of supporting the first reaction mass and the second reaction mass with a reaction base, the reaction base moving relative to the stage base with three degrees of freedom.
41. A method for making an exposure apparatus that forms an image on a wafer, the method comprising the steps of:
providing an irradiation apparatus that irradiates the wafer with radiation to form the image on the wafer; and
providing the stage assembly made by the method of claim 38.
42. A method of making a wafer utilizing the exposure apparatus made by the method of claim 41.
43. A method of making a device including at least the exposure process; wherein the exposure process utilizes the exposure apparatus made by the method of claim 41.