1. A terminal, comprising:
an optical apparatus for generating a projected display;
at least one sensor that detects physical movement of the terminal; and
a processor that processes an output from the sensor to determine a position of the terminal resulting from the physical movement, wherein the processor compensates the optical apparatus to stabilize the displacement of the projected display based on the determined position.
2. The terminal as claimed in claim 1, wherein the terminal is one of a mobile data terminal and a communication terminal.
3. The terminal as claimed in claim 1, wherein the processor is activated via a switch on the terminal.
4. The terminal as claimed in claim 1, further comprising an apparatus for emitting a light beam as a pointing agent in the projected display.
5. The terminal as claimed in claim 1, further comprising a camera for recording at least segments of the projected display.
6. A method for stabilizing a projection from a terminal, comprising the steps of:
generating a projected display through an optical apparatus in the terminal;
detecting physical movement of the terminal; and
processing the detected physical movement to determine a position of the terminal and compensating the optical apparatus to stabilize the displacement of the projected display, based on the determined position.
7. The method according to claim 6, wherein the terminal is one of a mobile data terminal and a communication terminal.
8. The method according to claim 6, wherein the steps of processing the detected physical movement and compensating the optical apparatus are performed after receiving an input from a switch on the terminal.
9. The method according to claim 6, further comprising the step of emitting a light beam as a pointing agent in the projected display.
10. The method according to claim 6, further comprising the step of recording at least segments of the projected display via a camera located on the terminal.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multilayer wiring substrate which has a multilayer build-up structure including a plurality of resin insulation layers and a plurality of conductor layers, the resin insulation layers and the conductor layers being alternately stacked, and in which at least one of the resin insulation layers contains an inorganic fiber layer in an inner layer portion of a resin insulation material; the resin insulation material of the resin insulation layer has a via hole; the inorganic fiber layer has an aperture at a position corresponding to the via hole; and a via conductor that electrically connects the conductor layers is formed in the via hole and the aperture, the multilayer wiring substrate being characterized in that:
a portion of the inorganic fiber layer defining the aperture protrudes inwardly from the inner wall of the via hole lying adjacent to the inorganic fiber layer; and
tip ends of a plurality of inorganic fiber filaments of the inorganic fiber layer protruding inwardly from the inner wall of the via hole are bonded together through melting to form a wall-like weld portion extending along the inner wall of the via hole.
2. A multilayer wiring substrate according to claim 1, wherein the diameter of the aperture is the smallest at an inner-layer-side opening portion of an inner side surface of the weld portion.
3. A multilayer wiring substrate according to claim 1, wherein the inner side surface of the weld portion is tapered such that the diameter of the aperture gradually decreases from an outer-layer-side opening portion toward the inner-layer-side opening portion.
4. A multilayer wiring substrate according to claim 1, wherein the length of the weld portion, as measured in a circumferential direction of the via hole, is 5% or more the inner circumferential length of the via hole at a position lying adjacent to the inorganic fiber layer.
5. A multilayer wiring substrate according to claim 1, wherein the mean diameter of inorganic fiber filaments forming the inorganic fiber layer is 5.0 \u03bcm or less.
6. A multilayer wiring substrate according to claim 1, wherein the via conductor is a filled via conductor charged in the via hole and the aperture.
7. A method for producing the multilayer wiring substrate as recited in claim 1, characterized in that the method comprises:
an insulation layer provision step of providing, on a conductor layer, a resin insulation layer made of a resin insulation material and containing a glass cloth serving as an inorganic fiber layer;
a via hole provision step of subjecting the resin insulation layer to laser drilling employing a carbon dioxide gas laser, to thereby provide a via hole in the resin insulation material, to provide an aperture in the glass cloth, and to form a weld portion through melting and bonding, by means of heat generated during laser drilling, of tip ends of a plurality of glass fiber filaments of the glass cloth protruding from the inner wall of the via hole; and
a via conductor formation step of forming, through plating, a via conductor in the via hole and the aperture.