1. A method for monitoring tire pressure variation of automobile tire, comprising steps of:
(1) obtaining rotation speeds of individual automobile tires, and creating rotation speed reference values Vr for comparison and judgment based on the obtained rotation speeds;
(2) obtaining and calculating current rotation speeds of individual automobile tires, and calculating:
Reference rotation speed difference Vd=|(Vtlf\u2212Vtrf)\u2212(Vtlb\u2212Vtrb)|;
Measured and calculated rotation speed difference Vc=|(Vclf\u2212Vcrf)\u2212(Vclb\u2212Vcrb)|; And,
Regarding Vres=|Vd\u2212Vc| as the compared result;
Wherein, Vtlf, Vtrf, Vtlb and Vtrb represent the teaching values of the measured rotation speeds of the left front tire, the right front tire, the left rear tire and the right rear tire, respectively, and Vclf, Vcrf, Vclb and Vcrb represent the current measured rotation speeds of the left front tire, the right front tire, the left rear tire and the right rear tire, respectively;
(3) judging the compared result Vres and raising alarms if the compared result Vres exceeds a preset value; or else, turning to step (2).
2. The monitoring method according to claim 1, wherein the compared result Vres in the step (3) is confirmed and considered to raise an alarm only when it exceeds the preset value continuously many times.
3. The monitoring method according to claim 1, wherein for the rotation speeds mentioned in steps (1) and (2), a braking case or turns of tire measured during braking and a spent time must be excluded.
4. The monitoring method according to claim 3, wherein in the step (1), the rotation reference speeds of individual tires are established based on a method for establishing reference data.
5. The monitoring method according to claim 3, wherein the following data will be calculated if an alarm is raised in step (3):
Left difference reference of rotation speed Vrld=Vtlf\u2212Vtlb;
Right difference reference of rotation speed Vrrd=Vtrf\u2212Vtrb;
Left difference of measured and calculated rotation speed Vcld=Vclf\u2212Vclb;
Right difference of measured and calculated rotation speed Vcrd=Vcrf\u2212Vcrb; ; and;
comparing |Vrld\u2212Vcld| with |Vrrd\u2212Vcrd|:
If |Vrld\u2212Vcld|>|Vrrd\u2212Vcrd|, then further comparing Vclf with Vclb;
If Vclf>Vclb, it is indicated that a fault occurs in the left front tire;
if Vclf<Vclb, it is indicated that a fault occurs in the left rear tire;
If |Vrld\u2212Vcld|<|Vrrd\u2212Vcrd|, then further comparing Vcrf with Vcrb;
If Vcrf>Vcrb, it is indicated that a fault occurs in the right front tire;
If Vcrf<Vcrb, it is indicated that a fault occurs in the right rear tire.
6. The monitoring method according to claim 3, wherein the following data will be calculated in calculating step (4) if an alarm is raised in step (3):
Left difference reference of rotation speed Vrld=Vtlf\u2212Vtlb;
Right difference reference of rotation speed Vrrd=Vtrf\u2212Vtrb;
Left difference of measured and calculated rotation speed Vcld=Vclf\u2212Vclb;
Right difference of measured and calculated rotation speed Vcrd=Vcrf\u2212Vcrb; And;
Comparing |Vrld\u2212Vcld| with |Vrrd\u2212Vcrd|, wherein:
If |Vrld\u2212Vcld|>|Vrrd\u2212Vcrd|, then further judging whether Vcld>Vrld is true, and if true, it is indicated that a fault occurs in the left front tire; or else, it is indicated that a fault occurs in the left rear tire;
If |Vrld\u2212Vcld|<|Vrrd\u2212Vcrd|, then further judging whether Vcrd>Vrrd is true, if true, it is indicated that a fault occurs in the right front tire; or else, it is indicated that a fault occurs in the right rear tire.
7. The monitoring method according to claim 6, wherein, in the calculating step(4), if |Vrld\u2212Vcld|=|Vrrd\u2212Vcrd|, then further judging whether Vres>preset value\xd72 is true;
if true, further comparing and judging whether Vrld<Vcld is true, if true, it is indicated that faults occur in the left front tire and the right rear tire; or else, it is indicated that faults occur in the right front tire and the left rear tire.
8. The monitoring method according to claim 7, wherein the following comparison and determination will be performed if Vres>preset value\xd72 is false:
If both |Vclf\u2212Vtlf|>preset value\xd72 and |Vcrf\u2212Vtrf|>preset value\xd72 are true, then it is indicated that faults occur in the left front tire and the right front tire;
If both |Vclb\u2212Vtlb|>preset value\xd72 and |Vcrb\u2212Vtrb|>preset value\xd72 are true, it is indicated that faults occur in the left rear tire and the right rear tire.
9. The monitoring method according to claim 6, wherein the method turns to step(2) while indicating the faults, and records the rotation speeds of individual tires with respect to time, and when tire faults occur, alarm signal, tire location, times of faults, and correction condition are further recorded.
10. A system for monitoring tire pressure variation of automobile tire, comprising:
a tire signal interface circuit for obtaining rotation signal of tires of a vehicle and converting the same;
a braking signal converting circuit for obtaining braking signal of the vehicle and converting the same;
a key-press input circuit;
a single chip microprocessor, which performs processing in accordance with signals provided by the tire signal interface circuit, the braking signal converting circuit and the key-press input circuit;
a display screen interface circuit or a buzzer driving circuit, which sends concerned information to the display screen or the buzzer based on processing results of the single chip microprocessor,
wherein the single chip microprocessor performs processing in accordance with flowing procedures:
(1) obtaining rotation speeds of individual automobile tires, and creating rotation speed reference values Vr for comparison and judgment based on the obtained rotation speeds;
(2) obtaining and calculating current rotation speeds of individual automobile tires, and calculating:
Reference rotation speed difference Vd=(Vtlf\u2212Vtrf)\u2212(Vtlb\u2212Vtrb)|;
Measured and calculated rotation speed difference Vc=|(Vclf\u2212Vcrf)\u2212(Vclb\u2212Vcrb)|; And,
Regarding Vres=|Vd\u2212Vc| as the compared result;
Wherein, Vtlf, Vtrf, Vtlb and Vtrb represent the teaching values of the measured rotation speeds of the left front tire, the right front tire, the left rear tire and the right rear tire, respectively, and Vclf, Vcrf, Vclb and Vcrb represent the current measured rotation speeds of the left front tire, the right front tire, the left rear tire and the right rear tire, respectively;
(3) judging the compared result Vres and raising alarms if the compared result Vres exceeds a preset value; or else, turning to step (2).
11. The monitoring system according to claim 10, wherein the compared result Vres in the step (3) is confirmed and considered to raise an alarm only when it exceeds the preset value continuously many times.
12. The monitoring system according to claim 10, wherein for the rotation speeds mentioned in steps (1) and (2), a braking case or turns of tire measured during braking and a spent time must be excluded.
13. The monitoring system according to claim 12, wherein the system is further provided with a data setting circuit.
14. The monitoring system according to claim 10, wherein in the step (1), the rotation reference speeds of individual tires are established based on a method for establishing a reference data.
15. The monitoring system according to claim 13, wherein the following data will be calculated if an alarm is raised in step (3):
Left difference reference of rotation speed Vrld=Vtlf\u2212Vtlb;
Right difference reference of rotation speed Vrrd=Vtrf\u2212Vtrb;
Left difference of measured and calculated rotation speed Vcld=Vclf\u2212Vclb;
Right difference of measured and calculated rotation speed Vcrd=Vcrf\u2212Vcrb; ; And;
comparing |Vrld\u2212Vcld| with |Vrrd\u2212Vcrd|:
if |Vrld\u2212Vcld|>|Vrrd\u2212Vcrd|, then further comparing Vclf with Vclb;
if Vclf>Vclb, then transmitting a signal indicating that a fault occurs in the left front tire to the display screen and the display screen interface circuit thereof;
if Vclf<Vclb, then transmitting a signal indicating that a fault occurs in the left rear tire to the display screen and the display screen interface circuit thereof;
If |Vrld\u2212Vcld|<|Vrrd\u2212Vcrd|, then further comparing Vcrf with Vcrb;
If Vcrf>Vcrb, then transmitting a signal indicating that a fault occurs in the right front tire to the display screen and the display screen interface circuit;
If Vcrf<Vcrb, then transmitting a signal indicating that a fault occurs in the right rear tire to the display screen and the display screen interface circuit thereof.
16. The monitoring system according to claim 13, wherein the following data will be calculated in calculating step (4) if an alarm is raised in step (3):
Left difference reference of rotation speed Vrld=Vtlf\u2212Vtlb;
Right difference reference of rotation speed Vrrd=Vtrf\u2212Vtrb;
Left difference of measured and calculated rotation speed Vcld=Vclf\u2212Vclb;
Right difference of measured and calculated rotation speed Vcrd=Vcrf\u2212Vcrb; And;
Comparing |Vrld\u2212Vcld| with |Vrrd\u2212Vcrd|, wherein:
If |Vrld\u2212Vcld|>|Vrrd\u2212Vcrd|, then further judging whether Vcld>Vrld is true, and if true, then transmitting a signal indicating that a fault occurs in the left front tire to the display screen and the display screen interface circuit thereof; or else, transmitting a signal indicating that a fault occurs in the left rear tire to the display screen and the display screen interface circuit thereof;
If |Vrld\u2212Vcld|<|Vrrd\u2212Vcrd|, then further judging whether Vcrd>Vrrd is true, and if true, then transmitting a signal indicating that a fault occurs in the right front tire to the display screen and the display screen interface circuit thereof; or else, transmitting a signal indicating that a fault occurs in the right rear tire to the display screen and the display screen interface circuit thereof.
17. The monitoring system according to claim 16, wherein in the calculating step (4) of said monitoring system, if |Vrld\u2212Vcld|=|Vrrd\u2212Vcrd|, then further judging whether Vres >preset value\xd72 is true;
If true, then further comparing and judging whether Vrld<Vcld is true, and if true, then transmitting a signal indicating that faults occur in the left front tire and the right rear tire to the display screen and the display screen interface circuit thereof; or else, transmitting a signal indicating that faults occur in the right front tire and the left rear tire to the display screen and the display screen interface circuit thereof.
18. The monitoring system according to claim 17, wherein the following comparison and determination will be performed if Vres>preset value\xd72 is false:
If both |Vclf\u2212Vtlf|>preset value\xd72 and |Vcrf\u2212Vtrf|>preset value\xd72 are true, then transmitting a signal indicating that faults occur in the left front tire and the right front tire to the display screen and the display screen interface circuit thereof;
If both |Vclb\u2212Vtlb|>preset value\xd72 and |Vcrb\u2212Vtrb|>preset value\xd72 are true, then transmitting a signal indicating that faults occur in the left rear tire and the right rear tire to the display screen and the display screen interface circuit thereof.
19. The monitoring system according to claim 16, wherein the monitoring system turns to step (2) while indicating faults and records the rotation speeds of individual tires with respect to time, and when tire faults occur, alarm signal, tire locations, times of faults, and correction condition are further recorded.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed:
1. An electronic package assembly comprising:
a substrate having a first surface and a second surface;
an integrated circuit chip having a top surface;
first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
encapsulating means for encapsulating the integrated circuit chip, the encapsulating means contacting at least a portion of the first surface of the substrate and having a top portion; and
second attaching means formed in the top portion of the encapsulating means.
2. The electronic package assembly of claim 1, wherein the substrate is a laminated substrate having a plurality of layers.
3. The electronic package assembly of claim 2, wherein the substrate is a polymer.
4. The electronic package assembly of claim 1, wherein the integrated circuit chip is a wirebond chip having a lower surface and the first attaching means physically bonds the lower surface of the wirebond chip to the first surface of the substrate and electrically connects the top surface of the wirebond chip to the first surface of the substrate.
5. The electronic package assembly of claim 1, wherein the encapsulating means is an overmold formed on the top surface of the integrated circuit chip and on the first surface of the substrate.
6. The electronic package assembly of claim 5, wherein the overmold is a polymer.
7. The electronic package assembly of claim 5, wherein the second attaching means is an orifice formed in the top portion of the overmold.
8. The electronic package assembly of claim 7, further comprising an attaching member having an upper portion and a bottom portion, the attaching member detachably coupled to the orifice at the bottom portion of the attaching member.
9. The electronic package assembly of claim 8, wherein the attaching member is one of a push pin, a threaded post, and a solder pin.
10. The electronic package assembly of claim 8, further comprising:
heat dissipating means disposed on the top portion of the overmold, and
third attaching means detachably coupled to the attaching member at the upper portion of the attaching member, the third attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top portion of the overmold.
11. The electronic package assembly of claim 10, further comprising heat transfer means disposed between the heat dissipating means and the overmold.
12. The electronic package assembly of claim 11, wherein the heat transfer means is one of an epoxy, an acrylic a thermal grease, a conductive pad and a thermal tape.
13. The electronic package assembly of claim 10, further comprising fourth attaching means for attaching the second surface of the substrate to a circuit board.
14. The electronic package assembly of claim 13, wherein the fourth attaching means is a ball grid array (BGA).
15. The electronic package assembly of claim 7, wherein the orifice penetrates the substrate from the first surface to the second surface of the substrate.
16. The electronic package assembly of claim 15, wherein the orifice is a plated through-hole.
17. The electronic package assembly of claim 1, wherein the integrated circuit chip is a flip-chip having a lower surface and the first attaching means mechanically and electrically bonds the lower surface of the flip-chip to the first surface of the substrate.
18. The electronic package assembly of claim 17, wherein the first attaching means is one of a controlled collapse chip connection (C4), a gold bump, and a conductive epoxy.
19. The electronic package assembly of claim 1, wherein the top portion of the encapsulating means has an edge portion and the second attaching means is formed along the edge portion of the encapsulating means.
20. The electronic package assembly of claim 19, wherein the encapsulating means is an overmold, formed on the top surface of the integrated circuit chip and on the first surface of the substrate, and the second attaching means is a protrusion formed along the edge portion of the overmold.
21. The electronic package assembly of claim 19, wherein the encapsulating means is an overmold, formed on the top surface of the integrated circuit chip and on the first surface of the substrate, and the second attaching means is a groove formed along the edge portion of the overmold.
22. The electronic package assembly of claim 21, wherein the top portion of the overmold has an opposing edge portion and the groove is formed along both the opposing edge portion and the edge portion of the overmold.
23. The electronic package assembly of claim 22, wherein the groove is V-shaped.
24. The electronic package assembly of claim 23, further comprising:
heat dissipating means disposed on the top portion of the overmold, and
third attaching means detachably coupled to the overmold, the third attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top portion of the overmold.
25. The electronic package assembly of claim 24, further comprising heat transfer means disposed between the heat dissipating means and the overmold.
26. The electronic package assembly of claim 25, wherein the heat transfer means is one of an epoxy, an acrylic a thermal grease, a conductive pad and a thermal tape.
27. The electronic package assembly of claim 24, wherein the third attaching means engages the groove formed in the overmold.
28. The electronic package assembly of claim 27, further comprising fourth attaching means for attaching the second surface of the substrate to a circuit board.
29. The electronic package assembly of claim 28, wherein the fourth attaching means is a ball grid array (BGA).
30. The electronic package assembly of claim 19, wherein the encapsulating means is an overmold, formed on the top surface of the integrated circuit chip and on the first surface of the substrate, and the second attaching means is a slot formed along the edge portion of the overmold.
31. The electronic package assembly of claim 30, further comprising:
heat dissipating means disposed on the top portion of the overmold, and
third attaching means detachably coupled to the overmold, the third attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top portion of the overmold.
32. The electronic package assembly of claim 31, further comprising heat transfer means disposed between the heat dissipating means and the overmold.
33. The electronic package assembly of claim 32, wherein the heat transfer means is one of an epoxy, an acrylic a thermal grease, a conductive pad and a thermal tape.
34. The electronic package assembly of claim 31, wherein the third attaching means engages the slot formed in the overmold.
35. The electronic package assembly of claim 34, wherein the third attaching means is at least one unitary resilient member.
36. The electronic package assembly of claim 35, wherein the third attaching means is one of a metal and a polymer.
37. The electronic package assembly of claim 19, wherein the encapsulating means is an overmold, formed on the top surface of the integrated circuit chip and on the first surface of the substrate, and the second attaching means is a rib formed along the top portion of the overmold.
38. The electronic package assembly of claim 37, further comprising:
heat dissipating means disposed on the top portion of the overmold, and
third attaching means detachably coupled to the overmold, the third attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top portion of the overmold.
39. The electronic package assembly of claim 38, further comprising heat transfer means disposed between the heat dissipating means and the overmold.
40. The electronic package assembly of claim 39, wherein the heat transfer means is one of an epoxy, an acrylic a thermal grease, a conductive pad and a thermal tape.
41. The electronic package assembly of claim 38, wherein the third attaching means engages the rib formed in the overmold.
42. The electronic package assembly of claim 41, wherein the third attaching means is at least one unitary resilient member.
43. The electronic package assembly of claim 42, wherein the third attaching means is one of a metal and a polymer.
44. An electronic package assembly comprising:
a substrate having a first surface, a second surface, and an upper portion;
a flip-chip having a top surface and a bottom surface;
first attaching means for attaching the flip-chip to the first surface of the substrate; and
second attaching means formed along the upper portion of the substrate.
45. The electronic package assembly of claim 44, wherein the first attaching means mechanically and electrically bonds the bottom surface of the flip-chip to the first surface of the substrate.
46. The electronic package assembly of claim 45, wherein the first attaching means is one of a controlled collapse chip connection (C4), a gold bump, and a conductive epoxy.
47. The electronic package assembly of claim 44, wherein the second attaching means is a rib formed along the upper portion of the substrate.
48. The electronic package assembly of claim 47, further comprising:
heat dissipating means disposed on the top surface of the flip-chip, and
third attaching means detachably coupled to the substrate, the third attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top surface of the flip-chip.
49. The electronic package assembly of claim 48, further comprising heat transfer means disposed between the heat dissipating means and the overmold.
50. The electronic package assembly of claim 49, wherein the heat transfer means is one of an epoxy, an acrylic a thermal grease, a conductive pad and a thermal tape.
51. The electronic package assembly of claim 48, wherein the third attaching means engages the rib formed on the substrate.
52. The electronic package assembly of claim 51, wherein the third attaching means is at least one unitary resilient member.
53. The electronic package assembly of claim 52, wherein the third attaching means is one of a metal and a polymer.
54. A method for packaging an electronic assembly comprising the steps of:
(a) attaching an integrated circuit chip to a first surface of a substrate using a first attachment,
(b) encapsulating the integrated circuit chip using an encapsulant contacting the integrated circuit chip and at least a portion of the first surface of the substrate, and
(c) forming a second attachment in a top portion of the encapsulant.
55. The method for packaging of claim 54, further comprising the step of:
(d) attaching a heat dissipater to the encapsulant using a third attachment.