1. A radio frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components;
first and second RF devices implemented on the packaging substrate;
a plurality of wirebond structures implemented on the packaging substrate between the first RF device and the second RF device;
a first conductive ground layer disposed at least partially below the first RF device;
a second conductive ground layer in electrical contact with one or more of the plurality of wirebond structures, the second conductive ground layer being at least partially electrically isolated from the first conductive ground layer; and
a first conductive top layer in electrical contact with the one or more of the plurality of wirebond structures, the first conductive top layer, the plurality of wirebond structures, and the second conductive ground layer forming at least a partial RF barrier between the first RF device and the second RF device.
2. The RF module of claim 1 wherein the first and second conductive ground layers lie in a first plane substantially parallel to a top surface of the packaging substrate.
3. The RF module of claim 2 wherein the first and second conductive ground layers are separated by at least one physical gap that spans a first portion of the first plane, the gap providing at least partial electrical isolation between the first and second conductive ground layers.
4. The RF module of claim 2 further comprising a third conductive ground layer, the third conductive ground layer lying in the first plane and being at least partially electrically isolated from both the first and second conductive ground layers.
5. The RF module of claim 4 wherein the third conductive ground layer is disposed at least partially below the second RF device.
6. The RF module of claim 4 wherein the third conductive ground layer is disposed at least partially below a third RF device implemented on the packaging substrate.
7. The RF module of claim 6 wherein the first RF device includes a first switching device, the second RF device includes a second switching device, and the third RF device includes an amplifier device.
8. The RF module of claim 1 further comprising a second conductive top layer that is co-planar with the first conductive top layer, the second conductive top layer being at least partially electrically isolated from the first conductive top layer.
9. The RF module of claim 1 wherein the first conductive top layer is substantially the same shape as, and disposed above, the second conductive ground layer.
10. The RF module of claim 1 wherein a first portion of the plurality of wirebond structures forms a first row between the first and second RF devices.
11. The RF module of claim 10 wherein a second portion of the plurality of wirebond structures forms a second row, substantially parallel to the first row.
12. A radio frequency (RF) device comprising:
a transceiver;
first and second antennas; and
a power amplifier module in communication with the transceiver, the power amplifier module including a first switching device electrically coupled to the first antenna and a second switching device electrically coupled to the second antenna, a plurality of wirebond structures disposed between the first and second switching devices, a first conductive ground layer disposed at least partially beneath the first switching device, a second conductive ground layer in electrical contact with the plurality of wirebond structures, the second conductive ground layer being at least partially electrically isolated from the first conductive ground layer, the power amplifier module further including a first conductive top layer in electrical contact with the plurality of wirebond structures to form, together with the plurality of wirebond structures and the first conductive ground layer, at least a partial RF barrier between the first and second switching devices.
13. The RF device of claim 12 wherein the power amplifier module further includes an amplifier device electrically connected to the first and second switching devices.
14. The RF device of claim 13 further comprising a third conductive ground layer disposed at least partially beneath the amplifier device, the third conductive ground layer being at least partially electrically isolated from the first and second conductive ground layers.
15. A conductive shielding layer comprising:
a first conductive ground layer disposed at least partially below a first radio frequency (RF) device; and
a second conductive ground layer that is at least partially electrically isolated from the first conductive ground layer, the second conductive ground layer being electrically connected to a first conductive top layer via a plurality of wirebond structures disposed between the first RF device and a second RF device to form at least a partial RF barrier between the first RF device and the second RF device.
16. The shielding layer of claim 15 wherein the first and second conductive ground layers lie in a first plane substantially parallel to a second plane in which the first conductive top layer lies.
17. The shielding layer of claim 16 wherein the first and second conductive ground layers are separated by at least one physical gap that spans a first portion of the first plane, the physical gap providing at least partial electrical isolation between the first and second conductive ground layers.
18. The shielding layer of claim 16 further comprising a third conductive ground layer, the third conductive ground layer lying in the first plane and being at least partially electrically isolated from both the first and second conductive ground layers.
19. The shielding layer of claim 18 wherein the third conductive ground layer is disposed at least partially below a third RF device.
20. The shielding layer of claim 19 wherein the first RF device includes a first switching device, the second RF device includes a second switching device, and the third RF device includes an amplifier device.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method comprising:
intercepting a packet of a packet stream, wherein the packet stream is transmitted in accordance with a particular protocol;
analyzing the packet based on a comparison of the packet to a specification associated with the particular protocol;
based on the analysis, replacing an invalid data value of a field of the packet with a sanitized data value to create a sanitized packet; and
injecting the sanitized packet into the packet stream, wherein the sanitized data value is selectively modifiable based on a security rating of the field, such that the sanitized data value is modifiable by a user of a computer that intercepted the packet when the security rating of the field is a low security rating, and wherein the sanitized data value is not modifiable by the user of the computer that intercepted the packet when the security rating of the field is a high security rating.
2. The method of claim 1, wherein the data value is not a malicious data value.
3. The method of claim 1, wherein the specification is one of a protocol specification for the particular protocol, a request for comments (RFC) document associated with the particular protocol, and an Internet draft associated with the particular protocol.
4. The method of claim 1, wherein the specification includes documented expected behavior characteristics of a computer application associated with the particular protocol.
5. The method of claim 1, wherein the packet includes a checksum and wherein the method further comprises calculating a modified checksum for the sanitized packet.
6. The method of claim 1, further comprising maintaining a list of common field data values for the particular protocol and wherein the sanitized data value is a common field data value for the field.
7. The method of claim 6, wherein the list of common field data values for the particular protocol is included in the specification associated with the particular protocol.
8. The method of claim 1, further comprising, after the invalid data value is replaced with the sanitized data value, comparing the sanitized packet to one or more signatures.
9. The method of claim 8, wherein the one or more signatures include a signature of a malicious packet.
10. The method of claim 9, wherein the sanitized packet is examined for an occurrence of a regular expression associated with the signature of the malicious packet.
11. The method of claim 1, further comprising taking a security action wherein the security action includes at least one of dropping the sanitized packet, rewriting the sanitized packet, logging the sanitized packet, redirecting the sanitized packet, or sending a notification regarding the sanitized packet to an administrator.
12. The method of claim 1, wherein the particular protocol is a networking protocol.
13. A system comprising:
a processor;
a system memory in operable communication with the processor and comprising an analysis module and a sanitization module;
a network interface configured to intercept a packet of a packet stream and to inject a sanitized packet into the packet stream, wherein the packet and the sanitized packet conform to a particular protocol;
wherein the analysis module is executable by the processor to compare the packet to a protocol specification for the particular protocol; and
wherein the sanitization module is executable by the processor to identify a field of the packet that contains an invalid data value based on the comparison performed by the analysis module and to replace the invalid data value with a sanitized data value to form the sanitized packet.
14. The system of claim 13, further comprising, in the system memory, a signature module executable by the processor to compare the sanitized packet to one or more malicious packet signatures.
15. The system of claim 13, wherein the analysis module and the sanitization module operate at one or more layers of an Open Systems Interconnection (OSI) Reference Model that are higher than a network layer.
16. The system of claim 15, wherein the one or more layers of the OSI Reference model that are higher than the network layer include a transport layer, a session layer, a presentation layer, an application layer, or any combination thereof.
17. A computer-readable storage device comprising instructions, that when executed by a computer, cause the computer to:
receive a packet of a packet stream, wherein the packet stream is transmitted according to a particular network protocol;
analyze the packet based on a comparison of the packet to a specification associated with the particular network protocol;
based on the analysis, identify an invalid and non-malicious data value in a particular field of the packet;
retrieve a sanitized data value from a list of common data values for the particular field, the list of common data values defined by the specification;
replace the invalid and non-malicious data value in the particular field with the sanitized data value, while retaining data values in other fields of the packet, to form a sanitized packet, wherein the sanitized data value is selectively user-modifiable based on a security level of the particular field;
compare the sanitized packet to one or more malicious packet signatures to form a sanitized and signature-verified packet; and
transmit the sanitized and signature-verified packet to a destination computing device when the comparison does not identify a match between the sanitized packet and any of the one or more malicious packet signatures.
18. The computer-readable storage device of claim 17, further comprising instructions, that when executed by the computer, cause the computer to log the sanitized packet, drop the sanitized packet, or redirect the sanitized packet when the comparison identifies a match between the sanitized packet and the one or more malicious packet signatures.
19. The computer-readable storage device of claim 17, wherein the specification is represented in an extensible markup language (XML), a generic application level protocol analyzer language (GAPAL), a binary representation, or any combination thereof.