1. A method of fabricating a pillar-type conductor, comprising:
preparing a ceramic sheet having at least one through hole;
filling the inside of the through hole with a conductive material;
firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and
removing the ceramic sheet so that the pillar-type conductor remains.
2. The method of fabricating the pillar-type conductor of claim 1, wherein the ceramic sheet is formed by stacking a plurality of ceramic green sheets so that the height of the pillar-type conductor is controlled.
3. A method of fabricating a multilayer ceramic laminate, comprising:
preparing a ceramic laminate by stacking a plurality of ceramic green sheets including a via through which a conductive material is filled in at least one first through hole;
forming a surface sheet having a buffering electrode connected to the via and provided on the wall surface of a second through hole on the via;
inserting a pillar-type conductor into the second through hole so that one surface thereof is exposed; and
forming a ceramic sintered body by firing the ceramic laminate.
4. The method of fabricating the multilayer ceramic laminate of claim 1, wherein the surface sheet is formed by stacking a plurality of ceramic green sheets.
5. The method of fabricating the multilayer ceramic laminate of claim 1, further comprising grinding the surface of the ceramic sintered body after the forming of the ceramic sintered body.
6. A method of fabricating a probe board, comprising:
preparing a ceramic laminate by stacking a plurality of ceramic green sheets including a via through which a conductive material is filled in at least one first through hole;
forming a surface sheet having a buffering electrode connected to the via and provided on the wall surface of a second through hole on the via;
inserting a pillar-type conductor into the second through hole so that one surface thereof is exposed;
forming a ceramic sintered body by firing the ceramic laminate;
forming a connection pad on the ceramic laminate; and
joining a probe part made of conductive material on the ceramic laminate.
7. The method of fabricating the probe board of claim 6, wherein the surface sheet is formed by stacking a plurality of ceramic green sheets.
8. The method of fabricating the probe board of claim 6, further comprising grinding the surface of the ceramic sintered body after the forming of the ceramic sintered body.
9. The method of fabricating the probe board of claim 7, further comprising stacking a protecting layer on the ceramic sintered body after the grinding of the ceramic sintered body.
10. The method of fabricating the probe board of claim 9, wherein the connection pad is formed by forming at least one barrier ribs arranged on the protecting layer at a predetermined interval and filling the inside of the barrier ribs with a metal.
11. The method of fabricating the probe board of claim 10, wherein the connection pad is formed by an electroless plating method.
12. The method of fabricating the probe board of claim 10, wherein, before forming the barrier ribs, a plating seed layer is formed on the protecting layer.
13. The method of fabricating the probe board of claim 12, wherein the connection pad is formed by an electroplating method.
14. The method of fabricating the probe board of claim 10, wherein the probe part is joined by interposing a solder between the plating seed layer and the probe part and removing the protecting layer and the plating seed layer formed on an adhesive pad by melting the solder.
15. A multilayer ceramic substrate, comprising:
a ceramic laminate formed by stacking a plurality of ceramic green sheets including a via through which a conductive material is filled in at least one first through hole;
a surface sheet provided on the via and having a buffering electrode connected to the via and provided on the wall surface of a second through hole; and
a pillar-type conductor inserted into the second through hole so that one surface thereof is exposed.
16. The multilayer ceramic substrate of claim 15, wherein the surface sheet is formed by stacking a plurality of ceramic green sheets.
17. A probe board, comprising:
a ceramic laminate formed by stacking a plurality of ceramic green sheets including a via through which a conductive material is filled in at least one first through hole;
a surface sheet provided on the via and having a buffering electrode connected to the via and provided on the wall surface of a second through hole;
a pillar-type conductor inserted into the second through hole so that one surface thereof is exposed;
a ceramic sintered body formed by firing the ceramic laminate;
a connection pad formed on the ceramic sintered body; and
a probe part joined to the ceramic sintered body and made of a conductive material.
18. The probe board of claim 17, wherein the surface sheet is formed by stacking a plurality of ceramic green sheets.
19. The probe board of claim 17, further comprising a protecting layer on the ceramic sintered body.
20. The probe board of claim 17, wherein the connection pad is formed by an electroless plating method.
21. The probe board of claim 17, wherein the connection pad is formed by an electroplating method.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for protecting digital content, comprising:
providing digital content;
separating a portion of the digital content into multiple segments;
providing a digital watermark containing only watermark information, fingerprint information, or both; and
inserting the digital watermark between the segments of the digital content.
2. The method of claim 1, further comprising selecting a portion of the digital content before separating it into segments.
3. The method of claim 2, further comprising randomly selecting the portion of the digital content to separate.
4. The method of claim 2, further comprising selecting a pre-determined portion of the digital content to separate.
5. The method of claim 1, wherein the digital watermark contains a single segment with only watermark information, fingerprint information, or both.
6. The method of claim 5, further comprising providing the digital watermark as multiple segments and then combining them into a single segment before insertion into the digital content.
7. The method of claim 1, wherein the digital watermark contains multiple segments with only watermark information, fingerprint information, or both.
8. The method of claim 7, further comprising providing the digital watermark as a single segment and then separating it into multiple segments before insertion into the digital content.
9. The method of claim 1, wherein the digital watermark replaces some of the digital content segments when inserted.
10. The method of claim 1, further comprising distributing the watermarked digital content substantially at the same time as the watermark is inserted into the digital content.
11. A method for associating a digital watermark with digital content, comprising:
providing digital content;
selecting a predetermined portion of the digital content;
separating that portion of the digital content into multiple segments;
providing a digital watermark containing only watermark information, fingerprint information, or both; and
inserting the digital watermark between the segments of the digital content.
12. The method of claim 11, wherein the digital watermark contains a single segment with only watermark information, fingerprint information, or both.
13. The method of claim 12, further comprising providing the digital watermark as multiple segments and then combining them into a single segment before insertion into the digital content.
14. The method of claim 11, wherein the digital watermark contains multiple segments with only watermark information, fingerprint information, or both.
15. The method of claim 14, further comprising providing the digital watermark as a single segment and then separating it into multiple segments before insertion into the digital content.
16. The method of claim 14, further comprising distributing the watermarked digital content substantially at the same time as the watermark is inserted into the digital content.
17. A method for distributing watermarked digital content, comprising:
providing digital content;
selecting a predetermined portion of the digital content;
separating that portion of the digital content into multiple segments;
providing a digital watermark containing only watermark information, fingerprint information, or both;
inserting the digital watermark between the segments of the digital content substantially at the same time the digital content is distributed.
18. The method of claim 17, wherein the digital watermark contains a single segment with only watermark information, fingerprint information, or both.
19. The method of claim 18, further comprising providing the digital watermark as multiple segments and then combining them into a single segment before insertion into the digital content.
20. The method of claim 17, wherein the digital watermark contains multiple segments with only watermark information, fingerprint information, or both.
21. The method of claim 20, further comprising providing the digital watermark as a single segment and then separating it into multiple segments before insertion into the digital content.
22. Watermarked digital content prepared by the method comprising:
providing digital content;
selecting a predetermined portion of the digital content;
separating that portion of the digital content into multiple segments;
providing a digital watermark containing only watermark information, fingerprint information, or both; and
inserting the digital watermark between the segments of the digital content.
23. Watermarked digital content, comprising a portion of the digital content separated into segments with a digital watermark located between those segments, wherein the digital watermark contains only watermark information, fingerprint information, or both.
24. The digital content of claim 23, wherein the digital watermark contains only a single segment.
25. The digital content of claim 23, wherein the digital watermark contains multiple segments and each watermark segment is located between two segments of the digital content.
26. The digital content of claim 23, wherein the digital watermark has replaced some of the digital content segments.
27. A computer-implemented system for distributing watermarked digital content, comprising:
a first device for watermarking digital content, the first device comprising:
a first module for receiving or storing digital content;
a second module for receiving or creating a digital watermark;
a third module for modifying the digital watermark;
a fourth module for dividing a portion of the digital content into segments and inserting the digital watermark between the segments of the digital content; and
a second device for distributing the watermark digital content to a user.
28. The system of claim 27, wherein the first and second devices are the same or different.