1. A computer-implemented process for inventory management comprising:
identifying existing advertising units, that are unsold inventory and available to offer for sale
obtaining a history of a buyer with respect to purchases of like advertising units if any;
assigning a probability that the buyer will make a purchase from the unsold inventory;
receiving from the buyer criteria about the buyer’s purchase requirements;
obtaining available advertising inventory information;
obtaining prices for said advertising units from a revenue maximization system based on at least the probability and available inventory; and
generating at least two packaged advertising offers by executing program instructions in a computer system, the packaged advertising offers comprising a plurality of advertising units based on said criteria obtained from said buyer, wherein the buyer’s criteria includes a target number of people and target frequency of exposure to the advertisement units, and wherein said at least two offers meet the buyer’s criteria and reflect said available inventory and said prices.
2. The process according to claim 1, wherein said buyer’s purchase requirements further includes at least one requirement selected from the group consisting of marketplace, population of the marketplace, performance measurements, price, demographics, psycho graphics, number of available advertising units and day parts.
3. The process according to claim 1, wherein said obtaining said prices includes using inventory scaling, available inventory of advertising units to sell, budgetary goal information, and buyer payment history.
4. A computer-implemented process for advertisement inventory management comprising:
identifying an opportunity to purchase advertisement units;
obtaining a history of a buyer with respect to purchases of like advertisement units, if any;
receiving from the buyer criteria about purchase requirements of the buyer;
obtaining available advertisement inventory information;
obtaining prices for said advertisement units from a revenue maximization system using a probability that the buyer will accept an offer from available inventory; and
generating at least one scenario by executing program instructions in a computer system, the scenario comprising a plurality of advertisement units based on said criteria obtained from said buyer, wherein the buyer’s criteria includes a target number of people and target frequency people that will be exposed to the advertisement units, and wherein said at least one scenario meets the buyer’s criteria and reflects said available inventory and said prices.
5. The process according to claim 4, wherein said buyer’s purchase requirements includes at least one requirement of the selected from the group consisting of marketplace, population, target number and frequency of people exposed to said advertisement units, performance measurements, price, demographics, psycho graphics, number of available units and day parts.
6. The process according to claim 4, wherein said obtaining prices further includes advertisement inventory scaling, available inventory of advertisement units to sell, budgetary goal information, and purchaser payment history.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An integrated circuit (IC) interconnect structure comprising:
a first via positioned in a dielectric and coupled to a high current device at one end;
a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof and the buffer metal segment comprising a plurality of electrically insulating inter-dielectric (ILD) pads formed therethrough;
a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end; and
a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof;
wherein the plurality of ILD pads are configured in a pattern within a perimeter of the buffer metal segment, with the pads having varying shapes and sizes with respect to one another and being arranged at various densities with respect to locations in the buffer metal segment so as to spread current density distribution in the metal buffer segment in a manner that avoids current crowding in the metal buffer segment and in the metal power line.
2. The IC interconnect structure of claim 1, wherein the buffer metal segment is equal to or shorter than a Blech length and is significantly shorter in length than the metal power line.
3. The IC interconnect structure of claim 1, wherein the buffer metal segment is positioned in a first metal layer of the IC and the metal power line is positioned in a second metal layer of the IC.
4. The IC interconnect structure of claim 1, wherein the buffer metal segment includes a portion having non-parallel sides wherein a width of the buffer metal segment varies from one end to an opposite end thereof.
5. The IC interconnect structure of claim 1, wherein the ILD pattern is non-uniform and is formed such that a density thereof is higher at a center region of the buffer metal segment.
6. The IC interconnect structure of claim 1, wherein the ILD pattern is arranged so as to define a zigzag shaped, electrically conductive path near a center region of the metal buffer section.