1. Power control device for controlling the output power supplied to a discharge lamp operated by an electrical power supply, comprising:
power level determining means for determining the actual lamp power level;
error determining means for determining the error between the determined lamp power level and a specified reference power level;
output power determining means for maintaining the output power level supplied by the electrical power supply to the lamp if the error falls within a specified window and for adjusting the output power level supplied by the electrical power supply to the lamp towards said reference power level if the error falls outside the specified window.
2. Power control device according to claim 1, wherein the width of the window exceeds the ripple on the lamp power.
3. Power control device according to claim 1 or 2, wherein the width of the window is dependent on the specified reference power level.
4. Power control device according to claim 1, 2 or 3, wherein the output power determining means comprise means for decreasing the window width towards low reference power levels and increase the window width towards high reference power levels.
5. Power control device according to any of claims 1-4, wherein the output power determining means comprise means for varying the window width between a maximum window width and a minimum window width, the ratio of which is preferably approximately {fraction (110)} or more.
6. Power control device according to claim 5, wherein the ratio of the maximum and minimum window width is in the same order as the ratio of the maximum output power and minimum output power, limited by the boundaries of a predetermined minimum and a predetermined maximum window width.
7. Power control device according to any of the preceding claims, wherein the output power determining means comprise means for determining the reference power level on basis of a prestored nominal lamp power level and a dimming level, which is input to the output power determining means.
8. Power control device according to any of the claims 1-7, wherein the output power determining means comprise means for iteratively increasing or decreasing the output power level with a first correction or a second correction respectively if the error is outside the window, and maintaining the output power level if the error is inside the window.
9. Power control device according to any of the claims 1-8, wherein the output power means comprise means for increasing or decreasing the output power level supplied by the power supply with a third or fourth correction respectively of the error is inside the main window, but outside a subwindow of the main window, the third and fourth correction being smaller than the first and second correction respectively.
10. Power control device according to claim 8 or 9, wherein said corrections are factors C1, C2, C3, C4 which are prestored in the output power means.
11. Power control device according to claim 8, 9 or 10, wherein one or more of the corrections are dependent on the error level.
12. Power control device according to claim 11, wherein the dutycycle of the output power level or the output power level supplied to the lamp satisfies:
PnPn-1Kp(EnEn-1)KiEn
wherein Pn is the (dutycycle of the) output power level supplied to the lamp on time n, Pn-1 is the (dutycycle of the) output power level supplied to the lamp on time n-1, En and En-1 the error on time n and n-1 respectively, Kp is the proportional gain and Ki is the integrating gain.
13. Power control device according to any of the preceding claims, the power level determining means comprising:
means for determining the actual voltage across the lamp;
means for determining the actual current in the lamp;
means for determining the actual power level from the actual voltage and actual current.
14. Power control device according to any of the preceding claims, wherein the output power determining means and error determining means comprise a programmable microcontroller (MC) connected to an interface circuit (IFC).
15. Power control device according to any of the preceding claims, wherein the output power determining means can be connected to one or more switching elements of the electrical power supply for controlling the output power by controlling the switching of the switching elements.
16. Apparatus for supplying power to a discharge lamp, comprising:
an electrical power supply for supplying power to the lamp;
power level determining means for determining the actual level of the lamp power;
error determining means for determining the error between the determined lamp power level and a specified reference power level;
output power determining means, connected to the power supply for controlling the output power so as to adjust the output power to be supplied to the lamp towards said reference power level only if the error falls outside a specified window.
17. Apparatus according to claim 16, wherein the DC power supply (UDC) is controllable and the power determining means control the output voltage (UDC) of the DC power supply as to adjust the output power.
18. Apparatus according to claim 16, wherein the operation frequency (at GHB1, GHB2) is controllable and the power determining means control the output voltage (UDC) of the DC power supply so as to adjust the output power.
19. Apparatus according to any of claims 16-18, wherein the power supply is a switched-mode power supply (SMPS).
20. Apparatus according to any of claims 16-19, wherein the power supply is of the constant frequency pulse width modulation (PWM) type.
21. Apparatus according to any of claims 16-20, comprising a power control device according to any of claims 1-15.
22. Method of controlling the power supplied to a discharge lamp operated by an electrical power supply, comprising:
determining the actual power level of the power consumed by the lamp;
determining the error between the actual lamp power level and a specified reference power level;
if the error falls within a specified window, maintaining the output power level supplied to the lamp;
if the error falls outside the specified window, adjusting the output power level supplied to the lamp towards said reference power level.
23. Method according to claim 22, wherein the window width is dependent on the specified reference power level.
24. Method according to claim 22 or 23, wherein the window width is decreased towards low reference power levels and increased towards high reference power levels.
25. Method according to claim 22, 23 or 24, wherein the window width is variable between a maximum window width and a minimum window width, the ratio of which is approximately {fraction (110)} or more.
26. Method according to any of the claims 22-25, wherein the reference power level is a determined by a preset nominal lamp power and an input dimming level.
27. Method according to any of claims 22-26, wherein a power control device according to any of claims 1-15 andor an apparatus according to any of claims 16-21 is applied.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wiring substrate comprising:
a multilayer portion which has a substrate main surface and a substrate reverse surface, the multilayer portion including interlayer insulation layers and a conductor layer that are layered;
a plurality of projection electrodes arranged within an electrode formation region on the substrate main surface; and
via conductors, which electrically connect the plurality of projection electrodes and the conductor layer to each other, provided at a top layer, which is the interlayer insulation layer which forms the substrate main surface;
wherein at least one among the plurality of projection electrodes has a larger outer diameter than an outer diameter of the respective via conductor and is a variant projection electrode which has a roughened upper surface.
2. The wiring substrate according to claim 1,
wherein the variant projection electrode has a roughened lateral surface in addition to the roughened upper surface.
3. The wiring substrate according to claim 1,
wherein a surface roughness Ra of the variant projection electrode is from 0.1 \u03bcm to 0.6 \u03bcm.
4. The wiring substrate according to claim 1,
wherein the variant projection electrode has an equal outer diameter from an upper end to a lower end and is formed in a shape of a column as a whole.
5. The wiring substrate according to claim 1,
wherein all of the plurality of projection electrodes which are present within the electrode formation region comprise variant projection electrodes.
6. The wiring substrate according to claim 1,
wherein the plurality of projection electrodes are arrayed in vertical and horizontal rows along a surface direction of the substrate main surface within the electrode formation region, and
wherein, among the plurality of projection electrodes, projection electrodes positioned at an outer periphery of the electrode formation region comprise variant projection electrodes.
7. The wiring substrate according to claim 1,
wherein the variant projection electrode is in a flip chip interconnection with a connecting terminal arranged at a bottom surface side of a component via a solder bump placed on the upper surface of the variant projection electrode.
8. A method of manufacturing a wiring substrate, comprising:
preparing a multilayer portion which has a substrate main surface and a substrate reverse surface, the multilayer portion including interlayer insulation layers and a conductor layer that are layered;
forming a via hole which penetrates a top layer, which is the interlayer insulation layer which forms the substrate main surface;
forming a resist on the top layer;
forming an opening on the resist which has a larger inner diameter than that of the via hole;
forming a via conductor at the via hole and a projection electrode at the opening by plating the inner side of the via hole and the opening; and
forming a variant projection electrode by roughening an upper surface of the projection electrode.
9. The method of manufacturing a wiring substrate according to claim 8,
wherein, in forming the variant projection electrode, the upper surface of the projection electrode is roughened by etching the projection electrode.
10. The method of manufacturing a wiring substrate according to claim 8,
wherein, informing the variant projection electrode, the upper surface of the projection electrode is roughened by pressing the upper surface of the projection electrode using a pressing jig which has a rough pressing surface.
11. The method of manufacturing a wiring substrate according to claim 9,
wherein, after forming the variant projection electrode, a surface plated layer which has a roughened surface corresponding to a shape of the upper surface of the variant projection electrode is formed on a surface of the variant projection electrode by displacement plating.
12. The method of manufacturing a wiring substrate according to claim 10,
wherein, after forming the variant projection electrode, a surface plated layer which has a roughened surface corresponding to a shape of the upper surface of the variant projection electrode is formed on a surface of the variant projection electrode by displacement plating.