1. An electronic device comprising:
a resonator,
a heating element,
a circuit component provided with at least an oscillating amplifier element; and
a thermo-sensitive element,
wherein the thermo-sensitive element is not disposed between the heating element and the circuit component, and
a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.
2. The electronic device according to claim 1, wherein
the distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.2 mm.
3. The electronic device according to claim 1, wherein
the distance between the heating element and the circuit component is in a range not smaller than 0.1 mm and no larger than 0.8 mm.
4. The electronic device according to claim 1, wherein
the heating element covers the circuit component in a plan view.
5. The electronic device according to claim 1, wherein
the circuit component is provided with at least an inductor and a variable capacitance element.
6. The electronic device according to claim 1, further comprising:
a first support section disposed on the resonator;
a substrate having the circuit component disposed, and provided with a second support section; and
a package housing the resonator and the substrate,
wherein the first support section is connected to the substrate, and
the second support section is connected to the package.
7. The electronic device according to claim 2, further comprising:
a first support section disposed on the resonator;
a substrate having the circuit component disposed, and provided with a second support section; and
a package housing the resonator and the substrate,
wherein the first support section is connected to the substrate, and
the second support section is connected to the package.
8. The electronic device according to claim 3, further comprising:
a first support section disposed on the resonator;
a substrate having the circuit component disposed, and provided with a second support section; and
a package housing the resonator and the substrate,
wherein the first support section is connected to the substrate, and
the second support section is connected to the package.
9. An electronic apparatus comprising:
the electronic device according to claim 1.
10. A moving object comprising:
the electronic device according to claim 1.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of micro-alloying a first alloy and an alloy on predetermined portions of a medical device, comprising the steps of:
providing a medical device made from said first alloy;
placing said medical device in a protective atmosphere;
selectively melting said predetermined portions of said medical device with heat from a source while a predetermined amount of said second alloy is added;
forming a sphere of said predetermined portions through surface tension said molten portions; and
cooling said medical device, wherein said predetermined portions in the form of said sphere remains attached to said medical device upon solidification.
2. The method of claim 1, wherein one of said first and second alloys is radiopaque.