1. An optical tomographic imaging apparatus, comprising:
a light source unit having a first light source that outputs a first light beam which is swept in wavelength repeatedly within a first wavelength range, and a second light source that outputs a second light beam which is swept in wavelength repeatedly within a second wavelength range which is different in range from the first wavelength range, in which a part of the wavelength sweep of the first light beam and a part of the wavelength sweep of the second light beam are performed at the same time;
a beam splitting means that splits the first and second light beams into first measuring and reference beams, and second measuring and reference beams respectively;
a beam combining means that combines first and second reflected beams, which are the reflected beams from a measuring object when the first and second measuring beams are irradiated on the measuring object, with the first and second reference beams respectively;
a wavelength dividing means that divides a first interference beam produced when the first reflected beam is combined with the first reference beam by the beam combining means and a second interference beam produced when the second reflected beam is combined with the second reference beam by the beam combining means into at least a third wavelength range which includes a portion of the first wavelength range and a portion of the second wavelength range, a fourth wavelength range which is shifted on the short wavelength side of the third wavelength range, and a fifth wavelength range which is shifted on the long wavelength side of the third wavelength range;
a first interference beam detection means that detects an interference beam within the third wavelength range as a first interference signal, a second interference beam detection means that detects an interference beam within the fourth wavelength range as a second interference signal, and a third interference beam detection means that detects an interference beam within the fifth wavelength range as a third interference signal; and
a tomographic image processing means that generates a tomographic image of the measuring object using the first, second, and third interference signals detected by the first, second, and third interference beam detection means respectively.
2. The optical tomographic imaging apparatus of claim 1, wherein:
the first and second wavelength ranges include an overlapping wavelength range where the wavelength ranges overlap with each other at an end portion thereof on either the long wavelength side or the short wavelength side;
the third wavelength range includes the entire portion of the overlapping wavelength range; and
a light beam with a wavelength within the third wavelength range is outputted only from either one of the first and second light sources while light beams with wavelengths within the third wavelength range are outputted from the either one of the light sources.
3. The optical tomographic imaging apparatus of claim 1, wherein the wavelength dividing means is formed of two dichroic mirrors.
4. The optical tomographic imaging apparatus of claim 2, wherein the wavelength dividing means is formed of two dichroic mirrors.
5. The optical tomographic imaging apparatus of claim 1, wherein:
the apparatus includes a frequency versus time characteristic detection means that detects a frequency versus time characteristic of each of the first and second light beams and outputs to the tomographic image processing means; and
the tomographic image processing means is a means that generates the tomographic image using the frequency versus time characteristic of each of the first and second light beams detected by the frequency versus time characteristic detection means.
6. The optical tomographic imaging apparatus of claim 2, wherein:
the apparatus includes a frequency versus time characteristic detection means that detects a frequency versus time characteristic of each of the first and second light beams and outputs to the tomographic image processing means; and
the tomographic image processing means is a means that generates the tomographic image using the frequency versus time characteristic of each of the first and second light beams detected by the frequency versus time characteristic detection means.
7. The optical tomographic imaging apparatus of claim 3, wherein:
the apparatus includes a frequency versus time characteristic detection means that detects a frequency versus time characteristic of each of the first and second light beams and outputs to the tomographic image processing means; and
the tomographic image processing means is a means that generates the tomographic image using the frequency versus time characteristic of each of the first and second light beams detected by the frequency versus time characteristic detection means.
8. The optical tomographic imaging apparatus of claim 4, wherein:
the apparatus includes a frequency versus time characteristic detection means that detects a frequency versus time characteristic of each of the first and second light beams and outputs to the tomographic image processing means; and
the tomographic image processing means is a means that generates the tomographic image using the frequency versus time characteristic of each of the first and second light beams detected by the frequency versus time characteristic detection means.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A protective film, comprising:
a substrate; and
a semi-cured protective layer disposed over the substrate, wherein the semi-cured protective layer is completely cured by a heat curing process or a radiation curing process after the semi-cured protective layer is fixed onto a surface of an article.
2. The protective film of claim 1, further comprising an adhesive layer disposed over the semi-cured protective layer.
3. The protective film of claim 1, wherein the substrate is a film material with releasing property.
4. The protective film of claim 1, further comprising a release layer disposed between the substrate and the semi-cured protective layer.
5. The protective film of claim 1, wherein the substrate is selected from a group consisting of acrylic resin film, polyester resin film, polystyreneresin film, polypropylene resin film, polyvinyl chloride resin film, polyethelyne resin film, polycarbonate resin film, polyurethane resin film, aluminum metal film, copper metal film, and cellulose film.
6. The protective film of claim 2, wherein an adhesive of the adhesive layer is selected from a group consisting of acrylic resin, urethaneresin, vinyl resin, polyester resin, polystyreneresin, polypropylene resin, polyethelyne resin, and polycarbonate resin.
7. The protective film of claim 1, wherein a thickness of the substrate is about 4 \u03bcm to about 800 \u03bcm.
8. The protective film of claim 1, wherein a thickness of the semi-cured protective layer is about 1 \u03bcm to about 60 \u03bcm.
9. The protective film of claim 2, wherein a thickness of the adhesive layer is about 1 \u03bcm to about 15 \u03bcm.
10. The protective film of claim 1, wherein a composition of the semi-cured protective layer comprises a thermosetting resin and a radiation curing resin.
11. The protective film of claim 10, wherein the thermosetting resin of the semi-cured protective layer is selected from the group consisting of acrylic resin, acrylate resin, vinyl resin, polyester resin, epoxy resin, polyurethane resin, and combinations thereof.
12. The protective film of claim 10, wherein the radiation curing resin of the semi-cured protective layer is monomer or oligomer.
13. The protective film of claim 12, wherein the monomer is methyl acrylate, acrylate, vinyl, vinyl ether, or epoxy with single functional group, bi functional group, or multi-functional group.
14. The protective film of claim 12, wherein the oligomer is unsaturated polyester, cyclic glycidate, polyurethane acrylate, polyester acrylate, polyether acrylate, acrylated polyacrylic resin, or epoxy resin.
15. The protective film of claim 1, wherein the protective film is overlaid onto a casing of an electronic device.
16. A method for manufacturing a protective film, comprising:
providing a substrate;
providing a liquid mixture consisting of a thermosetting resin and a radiation curing resin;
coating the liquid mixture over the substrate thereby forming a mixed layer; and
performing a heat curing process thereby transforming the mixed layer into a semi-cured protective layer.
17. The method for manufacturing a protective film of claim 16, further comprising forming an adhesive layer over the semi-cured protective layer after performing the heat curing process.
18. The method for manufacturing a protective film of claim 16, wherein the substrate is a film material with releasing property.
19. The method for manufacturing a protective film of claim 16, further comprising forming a release layer before forming the mixed layer.
20. The method for manufacturing a protective film of claim 16, wherein the substrate is selected from a group consisting of acrylic resin film, polyester resin film, polystyreneresin film, polypropylene resin film, polyvinyl chloride resin film, polyethelyne resin film, polycarbonate resin film, polyurethane resin film, aluminum metal film, copper metal film, and cellulose film.
21. The method for manufacturing a protective film of claim 17, wherein the adhesive is selected from a group consisting of acrylic resin, urethaneresin, vinyl resin, polyester resin, polystyreneresin, polypropylene resin, polyethelyne resin, and polycarbonate resin.
22. The method for manufacturing a protective film of claim 16, wherein a thickness of the substrate is about 4 \u03bcm to about 800 \u03bcm.
23. The method for manufacturing a protective film of claim 16, wherein a thickness of the semi-cured protective layer is about 1 \u03bcm to about 60 \u03bcm.
24. The method for manufacturing a protective film of claim 17, wherein a thickness of the adhesive layer is about 1 \u03bcm to about 15 \u03bcm.
25. The method for manufacturing a protective film of claim 16, wherein the thermosetting resin is selected from the group consisting of acrylic resin, acrylate resin, vinyl resin, polyester resin, epoxy resin, polyurethane resin, and combinations thereof.
26. The method for manufacturing a protective film of claim 16, wherein the radiation curing resin is monomer or oligomer.
27. The method for manufacturing a protective film of claim 26, wherein the monomer is methyl acrylate, acrylate, vinyl, vinyl ether, or epoxy with single functional group, bi functional group, or multi-functional group.
28. The method for manufacturing a protective film of claim 26, wherein the oligomer comprises unsaturated polyester, cyclic glycidate, polyurethane acrylate, polyester acrylate, polyether acrylate, acrylated polyacrylic resin, and epoxy resin.
29. The method for manufacturing a protective film of claim 16, further comprising performing a heat curing process or a radiation curing process after fixing the semi-cured protective layer onto a surface of an article thereby completely curing the semi-cured protective layer.
30. The method for manufacturing a protective film of claim 16, wherein the heat curing process is performed at a temperature of about 80\xb0 C. to about 130\xb0 C. for about 20 seconds to 180 seconds thereby transforming the mixed layer into the semi-cured protective layer.
31. The method for manufacturing a protective film of claim 16, further comprising overlaying the protective film onto a casing of an electronic device after performing the heat curing process.