1. An electrical connector comprising:
a base pad formed of a sheet of aluminum having a layer of copper on at least one side and a layer of solder on at least a portion of the layer of copper, the base pad having a bottom surface;
an electrical contact structure connected to the base pad and extending away from the base pad, the electrical contact structure being formed from the sheet of aluminum with said layer of copper; and
the layer of solder being located on the bottom surface of the base pad and over said at least a portion of the layer of copper.
2. The connector of claim 1 in which the base pad and the electrical contact have a layer of copper on two opposite sides.
3. The connector of claim 2 in which the sheet of aluminum has a layer of copper on two opposite sides.
4. An electrical connector comprising:
a base pad formed of a sheet of aluminum having a layer of copper bonded to opposite surfaces of the sheet of aluminum and a layer of solder on at least a portion of one layer of copper, the base pad having a soldering surface;
an electrical contact structure connected to the base pad and extending away from the base pad, the electrical contact structure being formed from the sheet of aluminum with said layers of copper; and
the layer of solder being located on the soldering surface of the base pad and over said at least a portion of the one layer of copper.
5. A metallic strip and forming die combination comprising:
a metallic strip comprising an elongate strip of aluminum having a layer of copper on at least one side, and a predetermined pattern of solder on the layer of copper, the pattern of solder having at least one elongate strip of solder extending longitudinally along the metallic strip with a predetermined width and at a predetermined distance from an edge of the metallic strip; and
a forming die configured for forming the metallic strip into electrical connectors, each having a base pad and an electrical contact structure extending away from the base pad, the predetermined pattern of solder on the metallic strip being sized and positioned relative to the die for forming the base pads with a layer of solder on the layer of copper.
6. The combination of claim 5 in which the metallic strip has a layer of copper on two opposite sides.
7. The combination of claim 6 in which the pattern of solder is centrally located on the metallic strip.
8. The combination of claim 7 in which the pattern of solder comprises at least two elongate strips of solder parallel to each other extending longitudinally along the metallic strip.
9. The combination of claim 6 in which the pattern of solder comprises one elongate strip of solder extending to one edge of the metallic strip.
10. A laminated metallic strip comprising:
a flat elongate strip of aluminum;
first and second layers of copper on opposite surfaces of the aluminum strip; and
a predetermined pattern of solder on one of the layers of copper, the pattern of solder having at least one elongate strip of solder extending longitudinally along the metallic strip with a predetermined trimmed width W2 and at a predetermined distance d1 from a trimmed edge of the metallic strip.
11. A method of forming an electrical connector comprising:
forming a base pad from a sheet of aluminum having a layer of copper on at least one side and a layer of solder on at least a portion of the layer of copper, the base pad having a bottom surface and an electrical contact structure connected to the base pad and extending away from the base pad, the electrical contact structure being formed from the sheet of aluminum with said layer of copper; and
the layer of solder being located on the bottom surface of the base pad and over said at least a portion of the layer of copper.
12. The method of claim 11 further comprising providing the base pad and the electrical contact with a layer of copper on two opposite sides.
13. The method of claim 12 further comprising forming the electrical connector from a sheet of aluminum having a layer of copper on two opposite sides.
14. The method of claim 13 further comprising combining two sheets of copper with the sheet of aluminum with a rolling process to form a copper clad sheet.
15. The method of claim 14 further comprising forming a layer of solder on the copper clad sheet, to form a solder clad sheet.
16. The method of claim 15 further comprising trimming the solder clad sheet.
17. The method of claim 16 further comprising forming the electrical connectors from the solder clad sheet with a forming die.
18. A method of forming an electrical connector comprising:
forming a base pad from a sheet of aluminum having a layer of copper bonded to opposite surfaces of the sheet of aluminum and a layer of solder on at least a portion of one layer of copper, the base pad having a soldering surface and an electrical contact structure connected to the base pad and extending away from the base pad, the electrical contact structure being formed from the sheet of aluminum with said layers of copper; and
the layer of solder being located on the soldering surface of the base pad and over said at least a portion of the one layer of copper.
19. A method of forming electrical connectors comprising:
providing a metallic strip comprising a strip of aluminum having a layer of copper on at least one side, and a predetermined pattern of solder on the layer of copper, the pattern of solder having at least one elongate strip of solder extending longitudinally along the metallic strip with a predetermined width and at a predetermined distance from an edge of the metallic strip; and
forming the metallic strip into electrical connectors each having a base pad and an electrical contact structure extending away from the base pad with a forming die, the predetermined pattern of solder being sized and positioned relative to the die for forming the base pads with a layer of solder on the layer of copper.
20. The method of claim 19 further comprising providing the metallic strip with a layer of copper on two opposite sides.
21. The method of claim 20 further comprising centrally locating the pattern of solder on the metallic strip.
22. The method of claim 21 further comprising forming the pattern of solder with at least two elongate strips of solder parallel to each other extending longitudinally along the metallic strip.
23. The method of claim 20 further comprising forming the pattern of solder with one elongate strip of solder extending to one edge of the metallic strip.
24. A method of forming a metallic strip comprising:
forming first and second layers of copper on opposite surfaces of a flat elongate strip of aluminum; and
forming a predetermined pattern of solder on one of the layers of copper, the pattern of solder having at least one elongate strip of solder extending longitudinally along the metallic strip with a predetermined trimmed width W2 and at a predetermined distance d1 from a trimmed edge of the metallic strip.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A magnetic resonance imaging method comprising
acquisition of magnetic resonance signals including application of diffusion weighting and involving a plurality of diffusion weighting strengths and a plurality of diffusion directions
reconstruction of an object dataset from the magnetic resonance signals
the object dataset assigning apparent diffusion coefficients to voxels in a multidimensional geometric space and
identifying the occurrence of a single or several diffusion directions in individual voxels of the object dataset.
2. A magnetic resonance imaging method as claimed in claim 1, wherein the apparent diffusion coefficients for individual voxels are decomposed into contributions for the respective diffusion direction(s) for the voxel at issue.
3. A magnetic resonance imaging method as claimed in claim 2, wherein the decomposition of the apparent diffusion coefficients is done on the basis of equal diffusion strengths for the identified principal diffusion directions in the voxel at issue.
4. A method of analysis of an object dataset assigning apparent diffusion coefficients to voxels in a multidimensional geometric space, the analysis comprising identifying the occurrence of a single or several diffusion directions in individual voxels of the object dataset from a plurality of diffusion weighting strengths and a plurality of diffusion directions for individual voxels.
5. A computer program for analysis of an object dataset assigning apparent diffusion coefficients to voxels in a multidimensional geometric space, the computer program comprising instructions to identify the occurrence of a single or several diffusion directions in individual voxels of the object dataset from a plurality of diffusion weighting strengths and a plurality of diffusion directions for individual voxels.
6. A magnetic resonance imaging system arranged to
acquisition of magnetic resonance signals including application of diffusion weighting and involving a plurality of diffusion weighting strengths and a plurality of diffusion directions
reconstruction of an object dataset from the magnetic resonance signals
the object dataset assigning apparent diffusion coefficients to voxels in a multidimensional geometric space and the magnetic resonance imaging system including an image processing unit to
identify the occurrence of a single or several diffusion directions in individual voxels of the object dataset.