1. An induction heater, comprising:
an inverter body having an inlet formed in a bottom surface thereof;
an inverter circuit board provided within the inverter body;
an inverter heat dissipater mounted in the inverter body and contacting the bottom surface of the inverter body such that an inlet of the inverter heat dissipater is connected to the inlet of the inverter body, wherein the inverter heat dissipater is configured to blow air to a front and a rear of the inverter circuit board, the inverter heat dissipater comprising:
an inverter heat dissipation blower configured to blow air into at least one of a first inverter heat dissipation space formed between the inverter body and the inverter circuit board or a second inverter heat dissipation space formed between the inverter body and the inverter circuit board; and
an inverter guide provided between the inverter body and the inverter circuit board and configured to guide air blown by the inverter heat dissipation blower to the inverter circuit board; and
a heat sink provided on a top surface of the inverter circuit board, wherein the heat sink dissipates heat from the inverter circuit board, and wherein an outlet divider divides an outlet of the inverter heat dissipation blower so that more air is blown into the first inverter heat dissipation space than into the second inverter heat dissipation space, and
wherein the inverter guide comprises a plurality of guide ribs each having an end portion thereof that is closest to the heat sink bent toward the heat sink.
2. The induction heater of claim 1, wherein the first inverter heat dissipation space is provided between a top surface of the inverter circuit board and the inverter body, and wherein the second inverter heat dissipation space is provided between a bottom surface of the inverter circuit board and the inverter body.
3. The induction heater of claim 2, wherein a first portion of an outlet of the inverter heat dissipation blower is configured to blow air into the first inverter heat dissipation space, and a second portion of the outlet of the inverter heat dissipation blower is configured to blow air into the second inverter heat dissipation space.
4. The induction heater of claim 3, wherein the outlet divider divides the outlet of the inverter heat dissipation blower into the first and second portions.
5. The induction heater of claim 2, wherein the inverter body comprises a plurality of outlets configured to guide air blown by the inverter heat dissipation blower out of the inverter body, the plurality of outlets comprising a first inverter body outlet configured to discharge air from the first inverter heat dissipation space and a second inverter body outlet configured to discharge air from the second inverter heat dissipation space.
6. The induction heater of claim 2, wherein the inverter body comprises an outlet configured to guide air blown by the inverter heat dissipation blower out of the inverter body, the outlet comprising a first portion configured to discharge air from the first inverter heat dissipation space and a second portion configured to discharge air from the second inverter heat dissipation space.
7. The induction heater of claim 2, wherein the inverter body has a substantially rectangular inner space, and the inverter heat dissipation blower is provided at a corner of the rectangular inner space of the inverter body.
8. The induction heater of claim 2, wherein the inverter body comprises:
an outlet provided on a side of the inverter body, wherein the inlet of the inverter body is configured to guide air blown by the inverter heat dissipation blower into the inverter body and the outlet of the inverter body is configured to guide air blown by the inverter heat dissipation blower to an outside of the inverter body.
9. The induction heater of claim 1, wherein the inverter guide is configured to support the inverter circuit board.
10. The induction heater of claim 1, wherein the inverter circuit board comprises both a first inverter circuit board and a second inverter circuit board provided within the inverter body, and the wherein the heat sink comprises:
a first heat sink provided on the first inverter circuit board and configured to dissipate heat from the first inverter circuit board; and
a second heat sink provided on the second inverter circuit board and configured to dissipate heat from the second inverter circuit board, the first and second heat sinks being provided in a space between the first inverter circuit board and the second inverter circuit board proximate each other.
11. The induction heater of claim 10, wherein the inverter heat dissipation blower comprises:
a first inverter heat dissipation blower configured to blow air to the first inverter circuit board, wherein the first inverter heat dissipation blower corresponds to the first heat sink; and
a second inverter heat dissipation blower configured to blow air to the second inverter circuit board, wherein the second inverter heat dissipation blower corresponds to the second heat sink.
12. The induction heater of claim 11, wherein the inverter guide comprises:
a first inverter guide configured to guide the air blown by the first inverter heat dissipation blower to the first inverter circuit board, but not to the first heat sink; and
a second inverter guide configured to guide the air blown by the second inverter heat dissipation blower to the second inverter circuit board, but not to the second heat sink.
13. The induction heater of claim 10, wherein the inverter heat dissipation blower is configured to blow air to the first and second inverter circuit boards, wherein the inverter heat dissipation blower corresponds to both the first and second heat sinks.
14. The induction heater of claim 1, further comprising one or more induction coils provided on the inverter body, wherein the induction coils generate an induction field.
15. An induction heater, comprising:
an inverter circuit board;
an inverter body which defines a space configured to receive the inverter circuit board, the inverter body having an inlet formed in a bottom surface thereof;
a heat sink provided on a top surface of the inverter circuit board, wherein the heat sink dissipates heat from the inverter circuit board, and wherein an outlet divider divides an outlet of an inverter heat dissipation blower so that more air is blown into a first inverter heat dissipation space than into a second inverter heat dissipation space, the first and second inverter heat dissipation spaces each being formed between the inverter circuit board and the inverter body; and
an inverter heat dissipater mounted in the inverter body and contacting the bottom surface of the inverter body such that an inlet of the inverter heat dissipater is connected to the inlet of the inverter body, wherein the inverter heat dissipater is configured to blow both a main air stream to a first portion of the inverter circuit board and a sub-air stream to a second portion of the inverter circuit board,
wherein the inverter heat dissipater includes an inverter guide provided between the inverter body and the inverter circuit board and configured to guide air blown by an inverter heat dissipation blower to the inverter circuit board, and
wherein the inverter guide comprises a plurality of guide ribs each having an end thereof that is closest to the heat sink bent toward the heat sink.
16. The induction heater of claim 15, wherein the first portion of the inverter circuit board comprises a front of the inverter circuit board, and the second portion of the inverter circuit board comprises a rear of the inverter circuit board.
17. The induction heater of claim 16, wherein the inverter heat dissipater is configured to support the inverter circuit board.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A support element for a semiconductor device, the support element including at least one surface having a subregion for receiving the semiconductor device, wherein the support element comprises at least one fluid-tight boundary which is formed as an elevation arranged on the surface and at least partly surrounds the subregion of the surface, and wherein the support element further comprises means for analyzing at least one of chemical and organic substances arranged within the fluid-tight boundary.
2. The support element as claimed in claim 1, wherein the fluid-tight boundary is formed as a closed frame arranged on the surface.
3. The support element as claimed in claim 1, wherein the fluid-tight boundary is formed in a U-shaped manner.
4. The support element as claimed in claim 1, wherein the fluid-tight boundary comprises a polymer applied to the surface of the support element.
5. The support element as claimed in claim 1, further comprising a fluid introduced within the fluid-tight boundary.
6. The support element as claimed in claim 1, further comprising at least one contacting pad arranged on the surface of the support element outside the subregion surrounded by the fluid-tight boundary.
7. The support element as claimed in claim 1, further comprising a plastic casing encapsulating at least a portion of the support element located outside the subregion surrounded by the fluid-tight boundary.
8. The support element as claimed in claim 7, wherein the plastic casing is non-transparent.
9. The support element as claimed in claim 1, further comprising a substantially opaque fluid arranged within the fluid-tight boundary.
10. The support element as claimed in claim 1, wherein the support element comprises one of a semiconductor substrate, a semiconductor chip, and a semiconductor wafer.
11. A semiconductor component comprising:
a support element for supporting a semiconductor device, the support element including at least one surface having a subregion for receiving the semiconductor device, and at least one fluid-tight boundary which is formed as an elevation arranged on the surface and at least partly surrounds the subregion of the surface,
wherein the semiconductor device is arranged in the subregion of the surface of the support element, wherein an area covered by the semiconductor device is smaller than the subregion, such that the semiconductor device is arranged completely within the fluid-tight boundary, and wherein the support element further comprises at least one contacting pad arranged on the surface of the support element outside the subregion and within the fluid-tight boundary.
12. The semiconductor component as claimed in claim 11, wherein the semiconductor device is adhesively bonded to the surface of the support element by an adhesive fluid arranged within the fluid-tight boundary.
13. The semiconductor component as claimed in claim 11, wherein the semiconductor component is substantially surrounded by plastic.
14. The semiconductor component as claimed in claim 13, wherein the plastic is substantially non-transparent.
15. The semiconductor component as claimed in claim 11, wherein a substantially opaque fluid is arranged within the fluid-tight boundary.
16. The semiconductor component as claimed in claim 11, wherein the support element comprises one of a semiconductor chip, a semiconductor substrate, and a semiconductor wafer.
17. A semiconductor component comprising:
a support element for supporting a semiconductor device, the support element including a surface having a subregion for receiving the semiconductor device, and a fluid-tight boundary arranged on the surface and at least partly surrounding the subregion of the surface, wherein the semiconductor device is arranged in the subregion of the surface of the support element, and wherein the semiconductor device comprises a semiconductor laser arranged to emit a beam through the support element, wherein an intermediate space between the semiconductor laser and the support element is filled with an immersion adhesive.
18. A semiconductor component comprising:
a support element for supporting a semiconductor device, the support element including a surface having a subregion for receiving the semiconductor device, and a fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, wherein the semiconductor device is arranged in the subregion of the surface of the support element such that it rests substantially on the fluid-tight boundary, and wherein a cavity which is closed off in a substantially fluid-tight manner is formed within the fluid-tight boundary between the surface of the support element and the semiconductor device, wherein the semiconductor device has at least one opening through which fluids can flow into the cavity andor out of the cavity.
19. The semiconductor component as claimed in claim 18, wherein at least one of the semiconductor device and the support element comprises means for performing fluid analysis.