1. A method for determining dielectric constant of a film comprising:
providing a low-k dielectric film over a reflective layer formed over a substrate;
determining dielectric constant of said low-k dielectric film by measuring said dielectric constant without contacting said low-k dielectric film, said measuring including separately measuring an electronic component of said dielectric constant, an ionic component of said dielectric constant and an overall dielectric constant; and
deriving a dipolar component of said dielectric constant from said electronic component, said ionic component, and said overall dielectric constant.
2. The method as in claim 1, wherein said measuring does not alter any properties of said low-k dielectric film.
3. The method as in claim 1, wherein said reflective layer comprises aluminum or copper.
4. The method as in claim 1, wherein said low-k dielectric film and said conductive layer are features of an integrated circuit device being formed and further comprising further processing said substrate and completing said integrated circuit device.
5. The method as in claim 1, wherein said measuring an electronic component comprises measuring with an ellipsometer; said measuring an ionic component comprises measuring with an infrared spectrometer; and said measuring an overall dielectric constant comprises measuring with a microwave spectrometer.
6. The method as in claim 1, wherein said separately measuring an electronic component is done using radiation having wavelengths in a visible-ultraviolet light range.
7. The method as in claim 1, wherein said separately measuring an ionic component is done using infrared light.
8. The method as in claim 1, wherein said separately measuring an overall dielectric constant is done using microwaves.
9. The method as in claim 1, wherein at least one of measuring an electronic component, measuring an ionic component and measuring an overall dielectric constant includes measuring over a range of wavelengths.
10. The method as in claim 1, wherein said measuring an electronic component includes measuring refractive index and converting said refractive index to said electronic component.
11. The method as in claim 1, wherein said measuring said overall dielectric constant includes measuring impedance and converting said impedance to said overall dielectric constant.
12. The method as in claim 1, further comprising:
processing said substrate in a processing operation after said determining and said deriving then further determining and further deriving following said processing operation;
comparing results of said determining and deriving to said further determining and said further deriving; and
adjusting said processing operation based on said comparing.
13. A method for determining dielectric constant of a low-k dielectric film comprising:
providing a low-k dielectric film over a reflective layer formed over a substrate;
determining an overall dielectric constant, an electronic component of said dielectric constant, an ionic component of said dielectric constant and a dipolar component of said of said dielectric constant by:
first measuring using an ellipsometer, secondly measuring using an infrared spectrometer and thirdly measuring using a microwave spectrometer and mathematically manipulating results of said first measuring, said secondly measuring and said thirdly measuring.
14. The method as in claim 13, wherein said first measuring comprises measuring said electronic component of said dielectric constant.
15. The method as in claim 13, wherein said first measuring comprises measuring said electronic component of said dielectric constant.
16. The method as in claim 13, wherein said first measuring comprises measuring said electronic component of said dielectric constant, said secondly measuring comprises measuring said ionic component of said dielectric constant said thirdly measuring comprises measuring said overall dielectric constant and wherein said dipolar component of said dielectric constant is calculated.
17. The method as in claim 13, further comprising:
processing said substrate in a processing operation after said determining and then further determining following said processing operation;
comparing results of said determining to said further determining; and
adjusting said processing operation based on said comparing.
18. A system for measuring dielectric constant of a low-k dielectric film formed over a reflective layer, said system comprising:
an ellipsometer that measures an electronic component of said dielectric constant of said low-k dielectric film and produces a measured electronic component;
an infrared spectrometer that measures an ionic component of said dielectric constant of said low-k dielectric film and produces a measured ionic component;
a microwave spectrometer that measures an overall dielectric constant of said low-k dielectric film and produces a measured overall dielectric constant; and
means for deriving a dipole component of said dielectric constant using said measured electronic component, said measured ionic component and said measured overall dielectric constant.
19. The system as in claim 18, wherein a first spectrometer tool includes said infrared spectrometer and said microwave spectrometer.
20. The system as in claim 18, wherein said ellipsometer, said infrared spectrometer and said microwave spectrometer are each non-contact measuring tools.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic still camera comprising:
a photographing optical system;
an image pick-up device; and
a transmission optical component;
wherein light rays of an object which are passed through said photographing optical system are incident on a sensor surface of said image pick-up device through said transmission optical component,
wherein said transmission optical component is shaped so as to shift an image point of an object image formed through said photographing optical system rearwards with respect to said photographing optical system,
wherein said transmission optical component includes a concave lens surface having a negative optical power,
wherein said transmission optical component is fixed to said image pick-up device with the space between the sensor surface and the transmission optical system being sealed in an air-tight manner,
wherein the surface on the photographing optical system side of said transmission optical component comprises a concave lens surface,
wherein said image pick-up device comprises:
a protection glass on the photographing optical system side with respect to said sensor surface; and
said transmission optical component which is installed on the photographing optical system side of said protection glass,
wherein said transmission optical component comprises an infrared absorption filter, an optical adhesive layer, and an optical low-pass filter, cemented in that order from said photographing optical system side;
wherein the surface on the photographing optical system side of said infrared absorption filter is a concave curved surface; and
wherein the surface on the photographing optical system side of said optical adhesive layer includes a concave surface of a plano-concave lens.
2. The electronic still camera according to claim 1, wherein said electronic still camera comprises a focal plane shutter, and
wherein said transmission optical component and said image pick-up device are positioned behind said focal plane shutter with respect to said photographing optical system.
3. The electronic still camera according to claim 1, wherein said transmission optical component comprises a concave lens having a concave surface on the sensor surface side.
4. The electronic still camera according to claim 1, wherein the refractive index of said optical adhesive layer is greater than the refractive index of said infrared absorption filter.