1. An apparatus for delivering a prosthesis comprising
a catheter sized and configured for introduction into a hollow body organ or blood vessel, the catheter having a distal end,
a carrier on the distal end sized and configured to carry the prosthesis during introduction of the catheter,
a release mechanism on the distal end being operable to retain the prosthesis on the carrier, the release mechanism also being operable to selectively release the prosthesis from the carrier for deployment in the hollow body organ or blood vessel,
an enclosure mechanism on the distal end being operable to enclose the prosthesis on the carrier, the enclosure mechanism also being operable to selectively expose the prosthesis on the carrier, to thereby enable the release of the prosthesis from the carrier in response to selective operation of the release mechanism, and
at least one actuator coupled to the release mechanism and the enclosure mechanism to selectively operate the release mechanism and the enclosure mechanism.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic assembly including a casing with walls providing an internal chamber, at least one circuit board located in the chamber and provided with a plurality of electronic components connected thereto, said electronic components including at least one heat generating component requiring cooling, wherein the circuit board is fitted to or proximate a said wall with the at least one heat generating component disposed on a side of the circuit board facing said wall and thermally coupled thereto, at least said wall being thermally conductive.
2. An assembly according to claim 1, wherein there is provided at least one coupling element for coupling the heat generating component or components to said wall.
3. An assembly according to claim 2, wherein the coupling element or elements include a conductive block between said wall and the or each component, and wherein the block or each block is a part of the wall or a separate component fixed to the wall.
4. An assembly according to claim 2, wherein the or each coupling element is made of a metal or metal alloy, andor wherein there is provided one coupling element per heat generating component of the circuit board.
5. An assembly according to claim 2, wherein there is provided a heat transfer agent between the or each heat generating component and its respective the coupling element.
6. An assembly according to claim 5, wherein the transfer agent includes a thermal grease or a thermal pad.
7. An assembly according to claim 1, wherein all the heat generating components of the circuit which require cooling are located on the side of the circuit board facing said wall.
8. An assembly according to claim 1, wherein the casing is substantially completely or completely closed or sealed.
9. An assembly according to claim 1, wherein said wall or walls against which the heat generating components are thermally coupled are provided with cooling fins on external sides thereof.
10. An assembly according to claim 9, including a fan for promoting air flow through the cooling fins.
11. An assembly according to claim 1, wherein there is provided at least one biasing element for biasing the heat generating component or components against said wall of the casing or said coupling elements.
12. An assembly according to claim 11, wherein the or each biasing element is of resilient form.
13. An assembly according to claim 12, wherein there is provided at least one spring located to push the or each component against said wall or associated the coupling element.
14. An assembly according to claim 13, wherein the or at least one of the biasing elements includes a sprung loaded screw, bolt pin or rivet.
15. An assembly according to claim 11, wherein the or each biasing element is located proximate an associated heat conducting element.
16. An assembly according to claim 15, wherein the or each biasing element is located no more than around 15 mm from its associated component.
17. An electronic assembly according to claim 1, wherein the at least one circuit board includes a front side and a rear side and holds a plurality of components including a set of first heat generating components which require cooling during operation, and a set of second components which generate insufficient heat to require cooling, wherein the first set of components is located on the rear side of the circuit board and at least some of the second set of components are located on the front side of the circuit board.
18. An electronic assembly according to claim 1, wherein the casing includes walls providing an internal chamber, means for locating an electronic circuit board to or proximate a said wall with at least one heat generating component thereof disposed on a side of the circuit board facing said wall and to be coupled heat conductively thereto, and at least one raised coupling element on said wall for coupling the heat generating component or components to said wall.
19. An electronic assembly including a circuit board, the circuit board having a front side and a rear side and holding a plurality of components including a set of first heat generating components which require cooling during operation; and a set of second components which generate insufficient heat to require cooling, wherein the first set of components is located on the rear side of the circuit board and at least some of the second set of components are located on the front side of the circuit board.
20. An electronic assembly including: a casing, the casing having walls providing an internal chamber; means for locating an electronic circuit board to or proximate a said wall with at least one heat generating component thereof disposed on a side of the circuit board facing said wall and to be coupled heat conductively thereto; and at least one raised coupling element on said wall for coupling the heat generating component or components to said wall.