1. An image sensor, comprising:
an array of sensor pixels, having columns and rows wherein a discrete pixel that makes up said array of sensor pixels further comprises;
a photosensitive region detecting an image,
a region integrating and storing said image,
circuitry for providing a pair of identical output signals from each of said discrete pixels that makes up said array of sensor pixels,
a plurality of column circuits configured one per each column in said image sensor and further configured to sum one of said pair of identical signals generated in a particular discrete pixel with said signal from each of a group of selected said discrete pixels in a common column for each imager column into a summed column data signal; and
a plurality of row circuits configured one per each row in said image sensor and further configured to sum a second of said pair of identical signals generated in said particular discrete pixel with said signal from each of a group of selected said discrete pixels in a common row for each imager row into a summed row data signal.
2. The sensor of claim further comprising circuitry for the storage of each of the summed column data signals, one per column; and circuitry for the storage of each of the summed row data signals, one per row.
3. The sensor of claim 1, further comprising circuitry for storage of each of the summed column data signals, one per column; circuitry for the storage of each of the summed row data signals, one per row; and a configured sensor circuitry coupled to said array and configured for outputting said one-dimensional column signal and said one-dimensional row signal.
4. The sensor of claim 3, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each row in parallel for readout off-chip.
5. The sensor of claim 3, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each column in parallel for readout off-chip.
6. The sensor of claim 3, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each row sequentially for readout off-chip.
7. The sensor of claim 3, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each column sequentially for readout off-chip.
8. The sensor of claim 1, wherein an optical multiplication device is configured to amplify the incident optical signal prior to image detection.
9. The sensor of claim 1, wherein said optical multiplication device is a micro-channel plate.
10. The sensor of claim 1, wherein said optical multiplication device is an internal semiconductor carrier amplifier.
11. A system comprising:
an optical multiplier configured to receive an incident optical signal indicative of an image so as to generate an amplified optical signal;
an array of sensor pixels, having columns and rows, wherein a discrete pixel that makes up said array of sensor pixels further comprises;
a photosensitive region detecting an image,
a region integrating and storing said image,
circuitry for providing a pair of identical output signals from each of said discrete pixels that makes up said array of sensor pixels,
a plurality of column circuits configured one per each column in said image sensor and further configured to sum one of said pair of identical signals generated in a particular discrete pixel with said signal from each of a group of selected said discrete pixels in a common column for each imager column into a summed column data signal; and
a plurality of row circuits configured one per each row in said image sensor and further configured to sum a second of said pair of identical signals generated in said particular discrete pixel with said signal from each of a group of selected said discrete pixels in a common row for each imager row into a summed row data signal;
a configured column storage circuitry for the storage of each of the summed column data signals, one per column, in a one-dimensional data format and
a configured row storage circuitry for the storage of each of the summed row data signals, one per row, in a one-dimensional data format; and
a processor configured to subject recorded spatial and temporal properties of said optical signals received by said array to deconvolution so as to extract the spectral content in said captured image.
12. The system of claim 11, wherein said optical multiplier is a microchannel plate.
13. The system of claim 11, further comprising internal semiconductor carrier amplification to amplify the incident optical signal after image detection.
14. The system of claim 11, further comprising a sensor circuitry coupled to said array and configured for outputting said one-dimensional column signal and said one-dimensional row signal.
15. The system of claim 11, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each row in parallel for readout off-chip.
16. The system of claim 11, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each row sequentially for readout off-chip.
17. The system of claim 11, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each column in parallel for readout off-chip.
18. The system of claim 11, wherein said sensor circuitry is further configured for addressing and outputting the summed electrical signal from each column sequentially for readout off-chip.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A communication cable comprising an elongated cable core having a tensile strength element (ZE) and a plurality of optical transmission elements (UE1,UEn) stranded around said tensile strength element (ZE) and being held together as a bundle by at least one retainer element, said retainer element being arranged in a form of an interlocking stitch, wherein said interlocking stitch is arranged in a form of loops of a yarn at successive discrete locations, said loops applying a radially acting retainer force to the transmission elements (UE1, UEn).
2. The communication cable according to claim 1, wherein each of said plurality of said transmission elements (UE1,UEn) comprises a tube (KH) and at least one optical light waveguide (LW) within said tube.
3. The communication cable according to claim 2, wherein said tube being further filled with a filling compound (FUM).
4. The communication cable according to claim 3, wherein said filling compound is a thixotropic mass.
5. The communication cable according to claim 1, wherein said arrangement of transmission elements (UE1,UEn) has an annular outside contour (KR).
6. The communication cable according to claim 5 further comprising a cable filling compound (FM) arranged in free space between said transmission elements (UE1,UEn).
7. The communication cable according to claim 1, wherein the loops are formed by a plurality of retainer elements at different positions on an outside circumference of the cable core, wherein these loops are chained to one another.
8. The communication cable according to claim 7, wherein the loops of the retainer elements are provided on an outside surface of the cable core at discrete locations that follow one another in a circumferential direction, and wherein the respective loops are tightened to pinch one another and to provide a radially acting retainer force.
9. The communication cable according to claim 7, wherein the loops are chained to one another in a longitudinal direction and in a circumferential direction to form a substantially helical path around the bundle.
10. A communication cable comprising a plurality of optical transmission elements and at least one retainer element arranged in a form of an interlocking stitch for holding said optical transmission elements together, each of said plurality of transmission element comprising a tube and at least one optical light waveguide within said tube, and said retainer extending about said optical transmission elements without contacting said optical light waveguides of said optical transmission elements, wherein said interlocking stitch is arranged in a form of loops of a yarn at successive discrete locations, said loops applying radially acting retainer force to the transmission elements (UE1, UEn).
11. The communication cable according to claim 10, wherein said arrangement of transmission elements (UE1,UEn) has an annular outside contour (KR).
12. A communication cable comprising a tensile strength element (ZE) and a plurality of optical transmission elements (UE1,UEn) stranded around said tensile strength element (ZE) and at least one retainer element, said retainer element being arranged as an interlocking stitch in a form of loops at successive discrete locations, said loops applying a radially acting retainer force to the transmission elements (UE1,UEn), and each of said plurality of said transmission elements (UE1,UEn) comprising a tube (KH) and at least one optical waveguide (LW) within said tube.
13. The communication cable according to claim 12, wherein said tube being further filled with a filling compound (FUM).
14. The communication cable according to claim 12, wherein said retainer element is a yarn.
15. A communication cable comprising a plurality of optical transmission elements and at least first and second retainer elements for holding said optical transmission elements together, each of said retainer elements forming a sequence of loops, each loop having a closed end and an open end, said open end being formed of first and second portions of the respective retainer element, the first and second portions of the first retainer element of each of its loops penetrating the closed end of the loops of the second retainer element.