1. A folded box gluing machine for making folded boxes from blanks comprising:
an orienting station arranged to orient and guide the blanks;
a pre-breaker station arranged adjacent to the orienting station with a gap therebetween and arranged to fold flaps of the blanks back and forth;
a conveying mechanism arranged to deliver the blanks through the orienting station and the pre-breaker station; and
an embossing mechanism including embossing dies arranged in the gap between the orienting station and the pre-breaker station so as to emboss the blanks; wherein
one of the embossing dies includes a product-specific male mold and another die includes a product-neutral female mold; and
the product-specific male mold and the product-neutral female mold define dots of Braille script.
2. The folded box gluing machine according to claim 1, wherein the embossing mechanism is a rotational embossing mechanism including rotating embossing dies.
3. The folded box gluing machine according to claim 2, wherein the embossing dies have a common rotation drive.
4. The folded box gluing machine according to claim 2, wherein a lower embossing die is coupled to a drive of the conveying mechanism and an upper embossing die includes a rotation drive.
5. The folded box gluing machine according to claim 1, wherein the product-neutral female mold is interchangeable.
6. The folded box gluing machine according to claim 1, wherein the embossing dies are mounted in the machine and can be positioned in a crosswise direction.
7. The folded box gluing machine according to claim 1, wherein the product-specific male mold is interchangeable.
8. The folded box gluing machine according to claim 1, wherein positions of the embossing dies are adjustable relative to each other.
9. The folded box gluing machine according to claim 1, wherein the embossing mechanism is arranged in front of a first folding station.
10. The folded box gluing machine according to claim 1, wherein the embossing mechanism is arranged to be removed from the machine.
11. The folded box gluing machine according to claim 10, wherein the embossing mechanism is arranged to swivel in the machine from an active position to an inactive position.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A process transmitter for measuring a process variable, the process transmitter comprising:
a process sensor for sensing the process variable of a process fluid;
transmitter circuitry for processing a signal from the process sensor;
a transmitter housing for receiving the process sensor and transmitter circuitry;
at least one transmitter mounting component for isolating the sensor or the transmitter circuitry from the process fluid or external environment; and
a mechanical integrity sensor for validating assembly of the transmitter housing and transmitter mounting component.
2. The process transmitter of claim 1 wherein:
the transmitter housing includes at least one access opening for the process sensor or the transmitter circuitry;
the transmitter access opening is mechanically sealed with a transmitter mounting component; and
the mechanical integrity sensor comprises a proximity sensor for sensing proximity of the transmitter mounting component to the housing.
3. The process transmitter of claim 2 wherein the transmitter circuitry verifies that the transmitter mounting component is fully seated with the access opening such that the transmitter mounting component prevents contaminants from entering the housing.
4. The process transmitter of claim 2 wherein the transmitter circuitry verifies that the transmitter mounting component is properly threaded with the housing such that the component provides an adequate flame quenching channel.
5. The process transmitter of claim 2 wherein the transmitter circuitry includes predetermined values for comparison to a signal generated by the mechanical integrity sensor.
6. The process transmitter of claim 1 wherein:
the transmitter mounting component comprises a process flange for joining the transmitter housing with the process fluid; and
the mechanical integrity sensor comprises a material verification sensor for sensing material properties of the process flange.
7. The process transmitter of claim 6 wherein the transmitter circuitry validates the sensed material property of the process flange with material property data stored in the transmitter circuitry.
8. The process transmitter of claim 6 wherein the material verification sensor comprises an inductive permeability sensor.
9. The process transmitter of claim 6 and further comprising a second material verification sensor for sensing material properties of a process diaphragm positioned within the process transmitter.
10. The process transmitter of claim 1 wherein the transmitter circuitry includes electronics that annunciate to a user output of the mechanical integrity sensor.
11. The process transmitter of claim 1 wherein the transmitter circuitry operates the mechanical integrity sensor as a continuous background operation.
12. The process transmitter of claim 1 wherein the transmitter circuitry includes a user control such that a user is able to manually initiate operation of the mechanical integrity sensor.
13. The process transmitter of claim 1 wherein the
the transmitter mounting component comprises a sensor module for joining the transmitter housing with a process fluid flange; and
the mechanical integrity sensor comprises a proximity sensor for sensing orientation of the transmitter housing on the sensor module.
14. A process transmitter for measuring a process variable, the process transmitter comprising:
a process sensor module for sensing the process variable of a process fluid;
a transmitter housing for receiving the process sensor;
at least one housing cover for sealing the sensor within the housing; and
a mechanical integrity sensor for sensing assembly of the housing cover or sensor module with the transmitter housing.
15. The process transmitter of claim 14 wherein the mechanical integrity sensor comprises a proximity sensor.
16. The process transmitter of claim 15 wherein the proximity sensor is selected from the group consisting of an inductive proximity sensor, a capacitive proximity sensor, a magnetometer, an ultrasonic proximity sensor, an optical proximity sensor or a mechanical limit switch.
17. The process transmitter of claim 14 and further comprising electronic circuitry that annunciates when a housing cover or sensor module is improperly positioned or missing.
18. The process transmitter of claim 14 further comprising transmitter circuitry which includes predetermined proximity values for comparison to a signal generated by the mechanical integrity sensor.
19. The process transmitter of claim 14 wherein the mechanical integrity sensor is comprised of a capacitive proximity sensor.
20. The process transmitter of claim 19 wherein the capacitive proximity sensor comprises:
a first capacitor comprising a first terminal screw and a second terminal screw;
a second capacitor comprising the first terminal screw and a housing cover; and
a third capacitor comprising the second terminal screw and the housing cover;
wherein the capacitance of the circuit formed by the first, second and third capacitors changes as the housing cover is assembled with the transmitter housing.
21. The process transmitter of claim 14 wherein the mechanical integrity sensor comprises an inductive proximity sensor.
22. The process transmitter of claim 21 wherein the inductive proximity sensor comprises:
an inductance coil for generating an electrostatic field positioned within the sensor housing adjacent a housing cover;
a core material positioned within the inductance coil;
an oscillator for generating an eddy current in the core; and
a signal level detector for sensing a change in an amplitude of oscillation of the eddy current when a housing cover is positioned near the core.
23. A process transmitter for measuring a process variable, the process transmitter comprising:
a process sensor for sensing the process variable of a process fluid;
a transmitter housing for receiving the process sensor;
a process flange for joining the transmitter housing with a process fluid source; and
a mechanical integrity sensor for verifying material properties of the process flange.
24. The process transmitter of claim 23 wherein the mechanical integrity sensor comprises an inductive permeability sensor.
25. The process transmitter of claim 24 wherein the inductive permeability sensor comprises:
an inductance coil for generating an electrostatic field positioned within the sensor housing adjacent a housing cover;
a core material positioned within the inductance coil;
an oscillator for generating an eddy current in the core; and
a signal level detector for sensing a change in an amplitude of oscillation of the eddy current when the process flange is positioned near the core.
26. The process transmitter of claim 23 and further comprising a second material verification sensor for sensing material properties of a process diaphragm positioned within the process transmitter.
27. The process transmitter of claim 23 and further comprising transmitter circuitry including predetermined material property values for comparison to a signal generated by the mechanical integrity sensor.
28. The process transmitter of claim 27 and further comprising electronic circuitry that annunciates when the signal generated by the mechanical integrity sensor differs from a predetermined material property value.