1. A packaged pre-moistened wet wipe comprising a web of nonwoven fibers bonded with a binder, said binder comprising a blend of a water dispersible polymeric binder and an aqueous solution or an aqueous dispersion of a polymer comprising predominantly self-crosslinking monomer, wherein the total amount of crosslinking monomer in the polymers of the polymeric binder the polymer comprising predominantly self-crosslinking monomer is 1 to 11 wt %, based on the total weight of solids.
2. The packaged pre-moistened wet wipe of claim 1 wherein the blend comprises 90 to 99 wt % of the water dispersible polymeric binder and 1 to 10 wt % of the polymer comprising predominantly self-crosslinking monomer, based on the total weight of solids.
3. The packaged pre-moistened wet wipe of claim 1 wherein the blend comprises 95 to 97 wt % of the water dispersible polymeric binder and 3 to 5 wt % of the polymer comprising predominantly self-crosslinking monomer, based on the total weight of solids.
4. The packaged pre-moistened wet wipe of claim 1 wherein the water dispersible polymeric binder is a polymer emulsion, said polymer emulsion comprises a polymer containing 50 to 95 wt % of a vinyl ester, 65 to 85 wt % of another ethylenically unsaturated monomer, 0 to 8 wt % of a self-crosslinking monomer, and 0 to 10 wt % of a functional monomer.
5. The packaged pre-moistened wet wipe of claim 4 wherein said polymer emulsion comprises a polymer containing 65 to 85 wt % of a vinyl ester, 65 to 85 wt % of another ethylenically unsaturated monomer, 1 to 5 wt % of a self-crosslinking monomer, and 2 to 10 wt % of a functional monomer.
6. The packaged pre-moistened wet wipe of claim 5 wherein the vinyl ester is vinyl acetate, the other ethylenically unsaturated monomer is selected from the group consisting of ethylene, butyl acrylate, vinyl versatate, or mixtures thereof, the self-crosslinking monomer is selected from the group consisting of N-methylol acrylamide, acrylamide, i-butoxy methylacrylamide, acrylamidoglycolic acid, acrylamidobutyraldehyde, a dialkyl acetal of acrylamidobutyraldehyde, and mixtures thereof, the functional monomer is selected from the group consisting of acetoacetoxyethyl methacrylate (AAEM), hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, hydroxybutyl acrylate, and mixtures thereof.
7. The packaged pre-moistened wet wipe of claim 6 wherein the polymer comprising predominantly self-crosslinking monomer comprises 50 to 100 wt % monomers, based on total solids, selected from the group consisting of N-methylol acrylamide, acrylamide, isobutyl methacrylamide, n-butyl methacrylamide; acrylamidoglycolic acid, acryamidobutyraldehyde dialkyl acetal, and mixtures thereof, wherein each alkyl contains 1 to 4 carbons.
8. The packaged pre-moistened wet wipe of claim 7 wherein the polymer comprising predominantly self-crosslinking monomer further comprises monomers selected from the group consisting of vinyl acetate, butyl acrylate, methyl methacrylate, and vinyl versatate.
9. The packaged pre-moistened wet wipe of claim 1 wherein the polymeric binder and the polymer comprising predominantly self-crosslinking monomer are in an aqueous emulsion.
10. The packaged pre-moistened wet wipe of claim 1 wherein the binder is free of alkylphenol ethoxylates.
11. An aqueous polymeric binder composition comprising a blend of a water dispersible polymer capable of binding together the fibers composing a nonwoven web and an aqueous solution or a dispersion of a polymer comprised predominantly of one or more self-crosslinking monomer.
12. The binder composition of claim 11 wherein the blend comprises 90 to 99 wt % of the water dispersible polymer and 1 to 10 wt % of the polymer comprising predominantly self-crosslinking monomer, based on the total weight of solids.
13. The binder composition of claim 11 wherein the blend comprises 95 to 97 wt % of the water dispersible polymer and 3 to 5 wt % of the polymer comprising predominantly self-crosslinking monomer, based on the total weight of solids.
14. The binder composition of claim 11 wherein the water dispersible polymeric binder is a polymer emulsion, said polymer emulsion comprises a polymer containing 50 to 95 wt % of a vinyl ester, 65 to 85 wt % of another ethylenically unsaturated monomer, 0 to 8 wt % of a self-crosslinking monomer, and 0 to 10 wt % of a functional monomer.
15. The binder composition of claim 14 wherein said polymer emulsion comprises a polymer containing 65 to 85 wt % of a vinyl ester, 65 to 85 wt % of another ethylenically unsaturated monomer, 1 to 5 wt % of a self-crosslinking monomer, and 2 to 10 wt % of a functional monomer.
16. The binder composition of claim 15 wherein the vinyl ester is vinyl acetate, the other ethylenically unsaturated monomer is selected from the group consisting of ethylene, butyl acrylate, vinyl versatate, or mixtures thereof, the self-crosslinking monomer is selected from the group consisting of N-methylol acrylamide, acrylamide, i-butoxy methylacrylamide, acrylamidoglycolic acid, acrylamidobutyraldehyde, a dialkyl acetal of acrylamidobutyraldehyde, and mixtures thereof, the functional monomer is selected from the group consisting of acetoacetoxyethyl methacrylate (AAEM), hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, hydroxybutyl acrylate, and mixtures thereof.
17. The binder composition of claim 16 wherein the polymer comprising predominantly self-crosslinking monomer comprises 50 to 100 wt % monomers, based on total solids, selected from the group consisting of N-methylol acrylamide, acrylamide, isobutyl methacrylamide, n-butyl methacrylamide; acrylamidoglycolic acid, acryamidobutyraldehyde dialkyl acetal, and mixtures thereof, wherein each alkyl contains 1 to 4 carbons.
18. The binder composition of claim 17 wherein the polymer comprising predominantly self-crosslinking monomer further comprises monomers selected from the group consisting of vinyl acetate, butyl acrylate, methyl methacrylate, and vinyl versatate.
19. The binder composition of claim 11 wherein the water dispersible polymer and the polymer comprising predominantly self-crosslinking monomer are in an aqueous emulsion.
20. The binder composition of claim 11 wherein the binder composition is free of alkylphenol ethoxylates.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method for manufacturing a semiconductor device, comprising the steps of:
defining gate electrode and capacitor regions by adapting a photoetching process to a semiconductor substrate deposited with a gate oxide film and a gate poly, so that the distance between the gate electrode region and the capacitor region can be smaller than twice the thickness of a spacer to be formed later;
growing an oxide film on top of the gate poly and defining a LDD region using phosphor (P) as impurities;
forming a spacer by depositing and etching an oxide film on the sidewalls of the gate oxide film and gate poly where the gate electrode and capacitor regions are defined;
implanting a high concentration As on the surfaces of a bit line contact junction and a gate poly formed between the gate electrodes by implanting a high concentration As to the surface of the resulting material with the spacer; and
implanting phosphor (P) as impurities so as to surround the region implanted with As.
2. The method of claim 1, wherein the step of defining the LDD region is carried out by implanting phosphor with a concentration of 51013 atomscm2 at a depth of about 200 .
3. The method of claim 2, wherein the step of implanting phosphor as impurities so as to surround the region implanted with As is carried out by implanting phosphor with a concentration of 51013 atomscm2 at a depth of about 600 .
4. The method of claim 1, wherein the distance between the gate electrode region and the capacitor region is smaller than 0.26 m.
5. A method for manufacturing a semiconductor device, comprising the steps of:
defining gate electrode and capacitor regions by adapting a photoetching process to a semiconductor substrate deposited with a gate oxide film and a gate poly, so that the distance between the gate electrode region and the capacitor region can be smaller than twice the thickness of a spacer to be formed later;
growing an oxide film on top of the gate poly and defining a first LDD region using as impurities;
forming a spacer by depositing and etching an oxide film on the sidewalls of the gate oxide film and gate poly where the gate electrode and capacitor regions are defined; and
implanting a high concentration As one more time on the surfaces of a bit line contact junction and a gate poly formed between the gate electrodes by implanting a high concentration As to the surface of the resulting material with the spacer; and
wherein the method further comprises the step of forming a second LDD region so as to surround the first LDD region using phosphor (P) as impurities after carrying out the step of defining the first LDD region.
6. The method of claim 5, wherein the step of defining the second LDD region using phosphor is carried out by implanting the phosphor at a depth of 500 .
7. The method of claim 5, wherein the distance between the gate electrode region and the capacitor region is smaller than 0.26 m.