1. A semiconductor package, comprising:
a substrate having a first surface and a second surface opposite the first surface, the substrate having a set of bond wire studs on first bond pads formed on the second surface thereof;
a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of solder bumps;
an underfill material disposed between the first semiconductor chip and the substrate, encapsulating the solder bumps;
a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip; and
a set of bond wires electrically coupled from the second semiconductor chip to the set of bond wire studs on the substrate through second bond pads between the bond wire and the wire studs.
2. The semiconductor package of claim 1, wherein the underfill material fills into the gap between the first semiconductor chip and the substrate through capillary action, and further wherein the underfill material does not flow over andor overlap the top surfaces of the set of bond wire studs.
3. The semiconductor package of claim 1, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip by means of an adhesive.
4. The semiconductor package of claim 1, wherein a space between an edge of the first semiconductor chip and one of the set of bond wire studs of the substrate is about 0.1 mm to about 0.2 mm.
5. The semiconductor package of claim 1, wherein a height of one of the set of bond wire studs is between about 10 \u03bcm to about 30 \u03bcm high.
6. The semiconductor package of claim 1, further comprising an encapsulant that encapsulates the first and second semiconductor chips, the set of bond wires, and the set of bond wire studs.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Hydrokinetic coupling device (10), for a motor vehicle, which comprises an axis of rotation (B) and also:
a driven shaft mounted to rotate around the axis of rotation (B);
a torque converter (12) comprising a turbine wheel (22) mounted to rotate around the axis of rotation (B);
a circumferential damper device (40) comprising a damper plate (42) with a radial flange (44), rotationally linked without any play to the turbine wheel (22) by a connecting element (62) on the one hand, and which is rotationally linked with the rotary driven shaft with circumferential damping on the other;
a locking clutch (14), comprising at least one annular, axially sliding friction disc (56A, 56B), which rotates together with the flange (44) of the damper plate (42), wherein the friction disc (56A, 56B) is carried by the connecting element (62), which directly links the turbine wheel (22) to the flange (44) of the damper plate (42).
2. Device (10) according to claim 1, wherein the connecting element is formed by an annular skirt (62) of the damper plate (42), which extends axially from the outer radial edge of the flange (44) as far as a free end section (84), which is fixed to a mounting face (31) of the turbine wheel (22) and wherein the friction disc (56A, 56B) is carried by an outer axial face (60) of the annular skirt (62) of the damper plate (42).
3. Device (10) according claim 2, wherein the friction disc (56A, 56B) comprises radial guide teeth (58), which extend radially inwards from their inner peripheral edge and which are received in an axial flow in associated axial channels (60) formed in the outer axial face of the skirt (22).
4. Device (10) according to claim 2, wherein the flange (44) and the skirt (62) are formed from a single piece.
5. Device (10) according to claim 2, wherein the skirt (62) is a separate piece, which is attached to the flange (44) of the damper plate (42).
6. Device (10) according to claim 5, wherein the skirt (62) is linked rotationally to the flange (44) by the mutual meshing of a toothed axial end side (88) of the skirt (62) and a toothed outer peripheral edge (90) of the flange (44).
7. Device (10) according to claim 2, wherein the free end section (84) of the skirt (62) is fixed to the mounting face (31) of the turbine wheel (22) in a leak-proof manner in respect of a fluid contained in the device (10).
8. Device (10) according to claim 7, wherein the free end section (84) of the skirt (62) is fixed to the mounting face (81) of the turbine wheel (22) by welding.
9. Device (10) according to claim 1, wherein the damper plate (42) is rotationally linked to the rotary driven shaft by means of at least one elastic member (54) with circumferential action, and wherein the elastic member (54) is carried by guide washers (48) fitted axially on both sides of the flange (44) of the damper plate (42) and rotationally linked without play to the rotary driven shaft by means of a first central damper hub (50).
10. Device (10) according to claim 9, wherein the turbine wheel (22) comprises a second turbine hub (32) which is rotationally mounted on a bearing surface (55) of the first damper hub (50).