1. A coffee machine, comprising:
a grinder including:
a bean chamber, and
a grinding unit disposed under the bean chamber;
a stewing vessel positioned below a discharging outlet of the grinder, the stewing vessel being fixed on a casing body of the coffee machine through a removable structure;
a filter mesh disposed in the stewing vessel;
a water supply mechanism connected to the stewing vessel, the water supply mechanism including a stewing water amount controlling mechanism, the stewing water amount controlling mechanism including a time regulator to control a working time of the heating vessel; and
a coffee powder amount controlling mechanism including a time regulator to control a working time of a coffee powder delivering motor,
wherein the coffee powder amount controlling mechanism and the water amount controlling mechanism cooperate with each other,
wherein the grinding unit includes:
a grinding bean chamber, and
a rotating grinding plate and a stationary grinding plate disposed in the grinding bean chamber,
wherein the grinder is an electric grinder, and the rotating grinding plate of the grinder is driven by a grinding motor, wherein the rotating and stationary grinding plates include grinding teeth, a shaft of the grinding motor being coupled with the rotating grinding plate,
wherein the grinding bean chamber has a powder outlet, and a powder outlet channel is disposed under the powder outlet, and
wherein a screw rod is disposed in the powder outlet channel, and an end of the screw rod that is located away from the powder outlet is connected to the powder delivering motor.
2. The coffee machine according to claim 1, wherein the stewing vessel is connected to the casing body of the coffee machine by a structure selected from the group consisting of an inserting connection, a screwed connection, and a hanging connection.
3. The coffee machine according to claim 1, wherein the water supply mechanism includes:
a water tank for the coffee machine,
a heating vessel,
a first water outlet pipe connected between the water tank and the heating vessel, and
a second water outlet pipe connected between the heating vessel and the stewing vessel.
4. The coffee machine according to claim 3, further comprising a check valve disposed between the water tank and the first water outlet pipe, wherein
the heating vessel is a single or multiple tubular heating vessel, which is connected to a stewing chamber through the second water outlet pipe, and
the stewing chamber is positioned above the stewing vessel and includes steam recovering tubes connected to the water tank.
5. The coffee machine according to claim 1, wherein the heating vessel is a minitype boiler.
6. The coffee machine according to claim 1, wherein a discharging door is disposed at the discharging outlet of the grinder.
7. The coffee machine according to claim 6, wherein the discharging door is a rubber door with at least one valve.
8. The coffee machine according to claim 6, wherein the discharging door is a plugin type electromagnetic valve or an overturning type electromagnetic valve.
9. The coffee machine according to claim 1, further comprising a timer.
10. The coffee machine according to claim 1, wherein a removable shaft coupling is disposed between the shaft of the grinding motor and the rotating grinding plate.
11. The coffee machine according to claim 1, wherein the grinder further includes a grinding unit setting seat into which the grinding unit is inserted.
12. The coffee machine according to claim 1, wherein
the bean chamber and the stationary grinding plate are fixed on a support for the stationary grinding plate, and
the support for the stationary grinding plate is rotatably connected to the grinding unit.
13. The coffee machine according to claim 1, wherein the rotating grinding plate is fixed on a support for the rotating grinding plate.
14. The coffee machine according to claim 1, wherein the stewing vessel is connected to the casing body of the coffee machine by either a screwed connection or a hanging connection.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A contour mode micromechanical piezoelectric resonator, comprising:
a bottom electrode;
a top electrode;
a piezoelectric layer disposed between said bottom electrode and said top electrode, said piezoelectric resonator having a planar surface having a cantilevered periphery, dimensioned to undergo in-plane lateral displacement at said periphery; and
means for applying an alternating electric field across the thickness of said piezoelectric resonator, said electric field configured to cause said resonator to have a contour mode in-plane lateral displacement that is substantially in the plane of said planar surface, wherein the fundamental frequency for the displacement of said piezoelectric resonator is set in part lithographically by the planar dimensions of one of said bottom electrode, said top electrode and said piezoelectric layer.
2. The resonator of claim 1 wherein said means for applying an alternating electric field comprise electrical interconnects to the top electrode and the bottom electrode.
3. The resonator of claim 1 wherein said bottom electrode is lithographically patterned to excite a specific region or regions of the piezoelectric resonator.
4. The resonator of claim 1 wherein said top electrode is lithographically patterned to excite a specific region or regions of the piezoelectric resonator.
5. The resonator of claim 1 wherein said piezoelectric layer is a layer selected from the group consisting of aluminum nitride, gallium nitride, aluminum gallium arsenide, zinc oxide, quartz, and combinations thereof.
6. The resonator of claim 1 wherein said bottom or said top electrode is made from a material selected from the group consisting of aluminum, platinum, tungsten, molybdenum, ruthenium, chrome, gold, titanium, doped polycrystalline silicon, and combinations thereof.
7. The resonator of claim 1 comprising one or more tethers that anchor the resonator to a substrate or other resonators.
8. The resonator of claim 7 being a part of an array of resonators formed by mechanically coupling the resonators in said array to one another using said tethers.
9. The resonator of claim 7 wherein said one or more tethers are configured for use as electrical connectors for exchanging electrical signals with the piezoelectric resonator.
10. The resonator of claim 9 being one of more than one resonator and wherein said more than one resonators are electrically cascaded to form a network of said resonators.
11. The resonator of claim 10 wherein said network is a Pi, T or L network.
12. The resonator of claim 11 being a part of a band pass filter circuit formed using a series of either of said Pi, T or L networks.
13. The resonator of claim 11 comprising 2 or more resonators that are electrically connected.
14. The resonator of claim 111 comprising electrical connectors used to route the signal from one resonator to the next.
15. The resonator of claim 1 being one of more than one resonator and wherein said more than one resonators are connected and arranged as a band-pass filter circuit.
16. The resonator of claim 1 comprising
means for applying a DC voltage across the thickness of the piezoelectric resonator, said DC voltage configured for tuning the center frequency of the resonator.
17. The resonator of claim 1 wherein said piezoelectric resonator is a part of a frequency reference in an oscillator circuit.
18. The resonator of claim 1 wherein said piezoelectric resonator is a part of a band pass filter circuit.
19. The resonator of claim 1 wherein said piezoelectric layer has a shape selected from the group consisting of a rectangle, a circle, a polygon, a circular annulus, a rectangular annulus, a polygonal annulus and combinations thereof.
20. A method of fabricating a contour mode micromechanical piezoelectric resonator body on a substrate, comprising:
forming a patterned bottom electrode above the substrate;
forming a piezoelectric layer above the bottom electrode;
forming a patterned top electrode on top of the piezoelectric layer;
forming an opening through the piezoelectric layer to the bottom electrode; and
etching the resonator body away from the substrate.
21. The method of claim 20 comprising releasing the formed resonator body from the underlying substrate by a dry-etching process.
22. The method of claim 21 wherein said dry etching process is conducted using a xenon di fluoride or a sulfur hexafluoride etch chemistry.
23. The method of claim 20 wherein said forming a layer of a piezoelectric layer above said bottom electrode comprises reactively depositing the piezoelectric layer.
24. The method of claim 20 wherein the bottom electrode, the piezoelectric layer and the top electrode are formed using sputter-deposition techniques.
25. The method of claim 20 wherein forming an opening through the piezoelectric layer comprises using a wet phosphoric acid etch or a photoresist stripping acid etch.
26. The method of claim 20 wherein said forming a patterned top electrode comprises evaporating and patterning the top electrode by a lift-off or a dry etching process.
27. The method of claim 20 wherein said forming a patterned bottom electrode comprises evaporating and patterning the bottom electrode by a lift-off or a dry etching process.
28. The method of claim 20 further comprising forming an electrically insulating layer on the substrate prior to said forming a patterned bottom electrode.
29. The method of claim 28 wherein the insulating layer is made out of a material selected from the group consisting of silicon nitride, silicon dioxide, aluminum nitride, silicon carbide, titanium dioxide, and combinations thereof.
30. The method of claim 20 wherein a temperature of less than approximately 350 C is employed.
31. The method of claim 20 comprising tuning the center frequency of the piezoelectric resonator by lithographically changing the in-plane dimensions of the electrodes.
32. The method of claim 20 comprising setting the center frequency of the piezoelectric resonator by changing the thickness of the electrodes.
33. The method of claim 20 comprising tuning the center frequency of the piezoelectric resonator by lithographically changing the in-plane dimensions of the electrodes and the thickness of the electrodes.
34. The method of claim 20 comprising forming more than one micromechanical piezoelectric resonator on a substrate and electrically cascading the more than one resonators to form a circuit selected from the group consisting of a Pi, a T or L network.
35. The method of claim 20 comprising forming more than one micromechanical piezoelectric resonator on a substrate, wherein each of the more than one resonators has a differently patterned top or bottom electrode.
36. The method of claim 34 comprising forming a part of a band pass filter circuit using a series of either of said Pi, T or L networks.
37. The method of claim 34 comprising electrically connecting the more than one resonators.
38. The method of claim 34 comprising forming electrical connectors used to route the signal from one resonator to the next.
39. The method of claim 20 comprising forming one or more tethers that anchor the resonator to the substrate or other resonators.
40. The method of claim 39 comprising forming an array of resonators by mechanically coupling the resonators in said array to one another using said tethers.
41. The method of claim 40 comprising forming more than one micromechanical piezoelectric resonator on a substrate and electrically cascading the more than one resonators to form a circuit selected from the group consisting of a Pi, a T or L network.
42. The method of claim 41 comprising forming a part of a band pass filter circuit using a series of either of said Pi, T or L networks.
43. The method of claim 39 wherein said one or more tethers are configured for use as electrical connectors for exchanging electrical signals with the piezoelectric resonator.
44. The method of claim 38 or 42 comprising varying the bandwidth of the filter by lithographically changing the lateral dimension of the coupling tethers.
45. The method of claim 20 comprising forming more than one micromechanical piezoelectric resonator on a substrate and wherein said more than one resonators are electrically cascaded to form a network of said resonators.
46. The method of claim 20 wherein the resonator body has a fundamental frequency set by the thickness of the piezoelectric layer.