1. A photographing apparatus comprising:
a photographing device for photographing a subject;
a correction circuit for correcting image information obtained by photographing by the photographing device;
an input device for inputting correction information, said correction information for correcting image information received from an image forming apparatus; and
a controller that controls the correction circuit such that the image information is corrected in accordance with the correction information inputted by the input device, wherein a recording medium, on which image information corrected by the correction circuit and correction information obtained from the image forming apparatus are recorded, can be freely loaded into and removed from the photographing apparatus, and the input device inputs correction information from the recording medium that is loaded in the photographing apparatus.
2. A photographing apparatus according to claim 1, further comprising:
a setting device for setting a condition for implementing control by the controller, wherein when the condition for implementing set by the setting device is satisfied, the controller controls the correction circuit.
3. A photographing apparatus according to claim 2, wherein the setting device sets the condition for implementing by selecting one condition for implementing from among a plurality of conditions for implementing control.
4. A photographing apparatus according to claim 1, further comprising a selector for selecting the one of the correction information set in advance and the inputted correction information, wherein the correction circuit corrects the image information in accordance with one of correction information set in advance and the inputted correction information, and the controller controls the correction circuit to correct the image information in accordance with the correction information selected by the selector.
5. A photographing apparatus according to claim 1, wherein the input device directly inputs the correction information from the image forming apparatus.
6. A photographing apparatus according to claim 1, wherein the correction circuit carries out at least one of white balance correction, \u03b3 correction, contour enhancing correction, and color correction coefficient correction.
7. A photographing apparatus according to claim 1, wherein the input device selectively inputs correction information for correcting the image information from one image forming apparatus among a plurality of image forming apparatuses.
8. An image information correction method of a photographing apparatus, which method corrects image information obtained by photographing a subject by a photographing apparatus, the method comprising the steps of:
inputting correction information for correcting the image information, wherein the correction information is received from an image forming apparatus; and
correcting the image information in accordance with inputted correction information, wherein the correction information is inputted from a recording medium that is freely loadable into and removable from the photographing apparatus and on which is recorded image information that has been corrected and correction information obtained from the image forming apparatus.
9. An image information correction method of a photographing apparatus according to claim 8, wherein a condition for implementing correction of the image information is set, and correction is implemented when the set condition for implementing is satisfied.
10. An image information correction method of a photographing apparatus according to claim 8, wherein the condition for implementing is set by selecting at least one condition for implementing from among a plurality of conditions for implementing correction of the image information.
11. An image information correction method of a photographing apparatus according to claim 8, wherein one of correction information set in advance and the inputted correction information is selected, and the image information is corrected according to the selected correction information.
12. An image information correction method of a photographing apparatus according to claim 8, wherein the correction information is inputted directly from the image forming apparatus.
13. A method of dispersing image information correction processings for dispersing a plurality of image information correction processings for correcting image information obtained by photographing by a photographing apparatus, wherein the method comprises:
carrying out, at a photographing apparatus, at least one image information correction processing among a plurality of image information correction processings; and
carrying out, at an image forming apparatus, image information correction processing other than the image information correction processing carried out at the photographing apparatus,
wherein correction information for correcting image information at the image forming apparatus is inputted to the photographing apparatus, and the photographing apparatus carries out image information correction processing in accordance with the inputted correction information, and the correction information is inputted from a recording medium that is freely loadable into and removable from the photographing apparatus and on which is recorded image information that has been corrected and correction information obtained from the image forming apparatus.
14. A method of dispersing image information correction processings according to claim 13, wherein the correction information is inputted from a recording medium which is freely loaded into and removed from the photographing apparatus and on which is recorded correction information obtained from the image forming apparatus.
15. A method of dispersing image information correction processings according to claim 13, wherein the correction information is directly inputted from the image forming apparatus.
16. A method of dispersing image information correction processings according to claim 13, wherein all of the plurality of image information correction processings are carried out at the photographing apparatus, and image information correction processing at the image forming apparatus is omitted.
17. A method of dispersing image information correction processings according to claim 13, wherein the plurality of image information correction processings include at least two of white balance correction processing, \u03b3 correction processing, contour enhancement correction processing, and color correction coefficient correction processing.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A component comprising:
a plurality of resonators that form at least a portion of a circuit;
wherein the plurality of resonators comprise layer structures above a wafer, wherein each of the layer structures comprises first and second electrode layers that comprise electrodes, and at least one piezoelectric layer that is between the first and second electrode layers;
a dielectric layer above the plurality of resonators, the dielectric layer comprising a hermetic encapsulation for the plurality of resonators, the dielectric layer comprising a material and having a thickness that results in a first acoustic impedance, the material comprising a low-K dielectric, the dielectric layer having top and bottom surfaces that substantially follow a topology of the plurality of resonators; and
a metal layer above the dielectric layer, the metal layer comprising a material and having a thickness that results in a second acoustic impedance, the second acoustic impedance being higher than the first acoustic impedance, the metal layer and the dielectric layer being parts of an acoustic mirror;
wherein the wafer has a surface comprising solderable contacts that are electrically connected to the plurality of resonators or to one or more of a plurality of active andor passive components integrated with the plurality of resonators in circuits; and
wherein the plurality of resonators are electrically interconnected by electrode layers of the resonators to form the at least a portion of a circuit.
2. The component of claim 1, wherein the component comprises a bulk acoustic resonator that operates with bulk acoustic waves; and
wherein thicknesses of the dielectric layer and the metal layer are in a range of a quarter wavelength of the bulk acoustic waves.
3. The component of claim 1, wherein the solderable contacts are electrically connected to one or more of the plurality of active andor passive components via feed-throughs in the wafer.
4. The component of claim 1, wherein the solderable contacts are electrically connected to the plurality of resonators via feed-throughs in the wafer.
5. The component of claim 1, wherein the dielectric layer comprises an organic layer.
6. The component of claim 1, wherein the dielectric layer comprises benzocyclobutenes.
7. The component of claim 1, wherein the dielectric layer is over an entire surface of the wafer and over the plurality of resonators.
8. The component of claim 1, wherein the acoustic mirror comprises at least one other layer pair arranged above the metal layer, the at least one other layer pair comprising layers having different acoustic impedances.
9. The component of claim 1, wherein the component comprises a bulk acoustic resonator that operates with bulk acoustic waves; and
wherein a thickness of the metal layer is in a range of a quarter wavelength of the bulk acoustic waves or in a range of an odd multiple of the quarter wavelength.
10. An apparatus comprising:
plural components according to claim 1.
11. The component of claim 1, wherein the acoustic mirror comprises one other layer pair arranged above the metal layer, the one other layer pair comprising a layer having a first acoustic impedance and a layer having a second acoustic impedance, the first acoustic impedance being less than the second acoustic impedance.
12. The component of claim 1, wherein the metal layer comprises at least one of tungsten (W), molybdenum (Mo), gold (Au) and aluminum nitride (AlN).
13. The component of claim 1, wherein the low-k dielectric comprises at least one of an aerogel, a porous silicate, an organosilicate, a siloxane derived from condensed silsesquioxanes, a polyaromatic compound, a cross-linked polyphenylene, and a polymerized benzocyclobutene.
14. The component of claim 1, wherein the component comprises a bulk acoustic resonator that operates with bulk acoustic waves; and
wherein a thickness of the dielectric layer is in a range of a quarter wavelength of the bulk acoustic waves or in a range of an odd multiple of the quarter wavelength.
15. The component of claim 1, wherein the solderable contacts are electrically connected to the plurality of resonators or to one or more of the plurality of active andor passive components via feed-throughs in the wafer.
16. The component of claim 1, wherein the component comprises a bulk acoustic wave resonator, a stacked crystal filter, or a coupled resonator filter.
17. The component of claim 1, wherein the acoustic mirror comprises at least one other layer pair arranged above the metal layer, the at least one other layer pair comprising a layer of relatively low acoustic impedance and a layer of relatively high acoustic impedance.
18. The resonator of claim 1, wherein the dielectric material comprises at least one of an aerogel, a porous silicate, an organosilicate, a siloxane derived from condensed silsesquioxanes, a polyaromatic compound, a cross-linked polyphenylene, and a polymerized benzocyclobutene.
19. The resonator of claim 1, wherein the metal layer comprises one of tungsten (W), molybdenum (Mo), gold (Au) and aluminum nitride (AlN).
20. The resonator of claim 1, wherein the solderable contacts are electrically connected to one or more of the plurality of active andor passive components.
21. The component of claim 1, wherein the low-k dielectric comprises one of an aerogel, a porous silicate, an organosilicate, a siloxane derived from condensed silsesquioxanes, a polyaromatic compound, a cross-linked polyphenylene, and a polymerized benzocyclobutene.
22. The component of claim 1, wherein the component comprises a bulk acoustic resonator that operates with bulk acoustic waves; and
wherein thicknesses of the dielectric layer and the metal layer are in a range of an odd multiple of a quarter wavelength of the bulk acoustic waves.
23. The component of claim 1, wherein the acoustic mirror comprises at least one other layer pair arranged above the metal layer, the at least one other layer pair comprising a layer having a first acoustic impedance and a layer having a second acoustic impedance, the first acoustic impedance being less than the second acoustic impedance.
24. The component of claim 1, wherein layers forming the acoustic mirror comprise an encapsulation for the active or passive circuit elements and the plurality of resonators.
25. The component of claim 24, wherein the plurality of resonators and the active or passive circuit elements comprise parts of a circuit on the wafer, the circuit comprising one or more of a high-frequency circuit, an adaptation circuit, an antenna circuit, a diode circuit, a transistor circuit, a highpass filter, a lowpass filter, a bandpass filter, a filter having a tunable frequency, a power amplifier, a preamplifier, an LNA, a diplexer, a duplexer, a multifilter, a coupler, a directional coupler, a memory element, a balun, a mixer, and an oscillator.