1. A drug delivery composition comprising a HPMC capsule containing the drug and wherein the HPMC capsule is provided with a coating such that the drug is not released from the capsule in the stomach.
2. A drug delivery composition according to claim 1, wherein the HPMC capsule is provided with a coating such that the drug is predominately released from the capsule in the small intestine.
3. A drug delivery composition according to claim 1, wherein the HPMC capsule is provided with a coating such that the drug is predominately released from the capsule in the colon andor terminal ileum.
4. A drug delivery composition according to claim 2 wherein the coating comprised a material which dissolves at a pH of 5.5 or above.
5. A drug delivery composition according to claim 3 wherein the coating comprises a material which dissolves at a pH 7 or above.
6. A drug delivery composition according to claim 2 wherein the coating comprises cellulose acetate trimellitiate (CAT).
7. A drug delivery composition according to claim 2 wherein the coating comprises hydroxypropylmethyl cellulose phthalate (HPMCP).
8. A drug delivery composition according to claim 2 wherein the coating comprises polyvinyl acetate phthalate (PVAP).
9. A drug delivery composition according to claim 2 wherein the coating comprises shellac.
10. A drug delivery composition according to claim 2 wherein the coating comprises a copolymer of methacrylic acid and methylmethacrylate (Eudragit L).
11. A drug delivery composition according to claim 3 wherein the coating composition comprises a material which is redox-sensitive.
12. A drug delivery composition according to claim 3 wherein the coating composition comprises an azopolymer or a disulphide polymer.
13. A drug delivery composition according to claim 3 wherein the coating composition comprises a material which is degraded by enzymes or bacteria present in the colon.
14. A drug delivery composition according to claim 3 wherein the coating composition comprises a copolymer of methacrylic acid and methylmethacrylate to which has been added during polymerisation the monomer methyl acrylate.
15. A drug delivery composition according to claim 3 wherein the coating composition comprises a cellulose ester.
16. A drug delivery composition according to claim 3 wherein the coating composition comprises polyvinyl acetate phthalate.
17. A drug delivery composition according to claim 2 wherein the coating is applied in the range 5-15 mg per cm2 of capsule surface.
18. A drug delivery composition according to claim 3 wherein the coating is applied in the range 5-20 mg per cm2 of capsule surface.
19. A drug delivery system according to claim 2 wherein the drug is one which is effective in the small intestine.
20. A drug delivery system according to claim 1 wherein the drug is one which acts locally in the colon.
21. A drug delivery system according to claim 1 wherin the coating is applied separately to empty HPMC capsule body and cap.
22. A drug delivery system according to claim 21 wherein the HPMC capsule body is coated with an insoluble polymer and the cap is enteric or colonic coated.
23. A drug delivery system according to claim 22 wherein the water insoluble polymer is ethyl cellulose.
24. A drug delivery system according to claim 1 wherein two equal HPMC capsule halves are filled with a caplet.
25. A drug delivery system according to claim 24 wherein the coating is applied separately to equal empty HPMC capsule halves.
26. A drug delivery system according to claim 24 wherein one half is enteric coated and the other halve is colonic coated.
27. A drug delivery system according to claim 24 wherein one half is coated with an insoluble polymer and the other half is enteric or colonic coated.
28. A drug delivery system according to claim 1 wherein the stomach resistant coating is applied to HPMC capsules having a first coating of a water soluble polyvinyl alcohol.
29. A drug delivery system according to claim 1 wherein the HPMC capsule is coated with a film which is non-dissolving at pH<3 to 4 and dissolving at pH>5.5.
30. A drug delivery system according to claim 1 wherein the HPMC content of the capsule shell is in the range of from 10 to 90% by weight.
31. A drug delivery system according to claim 1 wherein stomach resistant coating is applied to HPMC capsules having a sealing on the gap between capsule body and cap.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A non-aluminum solder connector structure comprising:
an insulating layer with a first side and a second side;
a via extending through said insulating layer from said first side to said second side;
a conductor filling said via, wherein a top of said via on said second side comprises an uneven surface;
a stack of dielectric layers adjacent to said second side, said stack of dielectric layers having a top surface;
a well extending through said stack of dielectric layers to said via, wherein said well has a bottom and sidewalls and wherein said bottom of said well comprises said top of said via;
a conductive liner within said well only on said bottom and on said sidewalls, wherein said conductive liner conforms to said uneven surface of said top of said via and wherein a first thickness of said conductive liner is less than approximately one tenth a second thickness of said stack; and
a polymide layer immediately adjacent to said top surface of said stack of dielectric layers, wherein no portion of said conductive liner is positioned between said top surface of said stack of dielectric layers and said polymide layer.
2. The solder connector structure of claim 1, further comprising:
an opening extending through said polymide layer to said well, said opening exposing said conductive liner and further exposing a portion of said top surface of said stack of dielectric layers surrounding said opening; and
a plurality of ball limiting metallurgy layers on said conductive liner and on said portion of said top surface of said stack of gate dielectric layers surrounding said opening, wherein said conductive liner is pre-selected to optimize adhesion of said ball limiting metallurgy layers to said sidewalls.
3. The solder connector structure of claim 1, wherein said conductive liner comprises a single layer of conductive material.
4. The solder connector structure of claim 1, wherein said conductive liner comprises multiple layers of conductive material.
5. The solder connector structure of claim 1, wherein said conductive liner comprises at least one of a tantalum layer, a tantalum nitride layer, a titanium layer and a titanium nitride layer.
6. A non-aluminum solder connector structure comprising:
an insulating layer with a first side and a second side;
a via extending through said insulating layer from said first side to said second side;
a conductor filling said via;
a plurality of dielectric columns extending vertically through said conductor, wherein a top of said via on said second side comprises an uneven surface;
a stack of dielectric layers on said second side, said stack of dielectric layers having a top surface;
a well extending vertically through said stack of dielectric layers to said via, wherein said well has a bottom and sidewalls and wherein said bottom of said well comprises said top of said via;
a conductive liner within said well only on said bottom and said sidewalls, wherein said conductive liner conforms to said uneven surface of said top of said via; and
a polymide layer immediately adjacent to said top surface of said stack of dielectric layers, wherein no portion of said conductive liner is positioned between said top surface of said stack of dielectric layers and said polymide layer.
7. The solder connector structure of claim 6, wherein a first thickness of said conductive liner is less than approximately one tenth a second thickness of said stack.
8. The solder connector structure of claim 6, further comprising:
an opening extending through said polymide layer to said well, said opening exposing said conductive liner and further exposing a portion of said top surface of said stack of dielectric layers surrounding said opening; and
a plurality of ball limiting metallurgy layers on said conductive liner and on said portion of said top surface of said stack of gate dielectric layers surrounding said opening, wherein said conductive liner is pre-selected to optimize adhesion of said ball limiting metallurgy layers to said sidewalls.
9. The solder connector structure of claim 6, wherein said conductive liner comprises a single layer of conductive material.
10. The solder connector structure of claim 6, wherein said conductive liner comprises multiple layers of conductive material.
11. The solder connector structure of claim 6, wherein said conductive liner comprises at least one of a tantalum layer, a tantalum nitride layer, a titanium layer and a titanium nitride layer.