1. A thermally insulating beverage or food container, comprising:
(a) a bottom wall; and
(b) a side wall extending upwardly from the bottom wall, said side wall comprising
(i) a substrate layer comprising paperboard,
(ii) an expanded foam layer having a projected area and defining a remote surface thereof, remote from said paperboard substrate layer, the remote surface of said expanded foam layer being defined by intermingled peaks and valleys, the peaks of the remote surface representing about 25 percent to no more than about 65 percent of the projected area of the remote surface, and
(iii) a heat seal layer comprising a polymeric film defining the inner surface of said beverage or food container,
said expanded foam layer being disposed between said paperboard substrate layer and said heat seal layer such that said expanded foam layer is not exposed as a surface of said food or beverage container and said heat seal layer defining a barrier between said expanded foam layer and contents of said beverage or food container, said expanded foam layer being in contact with said paperboard substrate layer, said heat seal layer being affixed to the remote surface of said expanded foam layer only at and adjacent the peaks, whereby thermally insulating dead air space is defined between the remote surface and the heat seal layer at the valleys.
2. A thermally insulating food or beverage, comprising:
(a) a bottom wall; and
(b) a side wall extending upwardly from said bottom wall, said side wall comprising
(i) a substrate layer comprising paperboard, and
(ii) an expanded foam layer affixed to the substrate paperboard layer and
(iii) a heat seal layer comprising a polymeric film defining the inner surface of said beverage and food container,
said heat seal layer affixed to said expanded foam layer, and said expanded foam layer being disposed between said paperboard substrate layer and said heat seal layer such that said expanded foam layer is not exposed as a surface of said food or beverage container, said expanded foam comprises expanded products of polymeric microcapsules expanded in accord with an earlier-applied heating process, an interface between said substrate layer and said expanded foam layer includes a portion of said microcapsules in interstices of said paperboard of said substrate layer.
3. A thermally insulating food or beverage container, comprising:
(a) a bottom wall; and
(b) a side wall extending upwardly from said bottom wall, said side wall comprising
(i) a substrate layer comprising paperboard, and
(ii) an expanded foam layer comprising expanded products of polymeric microcapsules expanded in accord with an earlier-applied heating process, and affixed to the substrate paperboard layer, said expanded foam layer having been applied as a coating of heat expandable microcapsules on said paperboard substrate layer, said expanded foam layer having a portion of said microcapsules in interstices of said paperboard of said substrate layer, and
(iii) a heat seal layer defining the inner surface of said beverage or food container
said expanded foam layer being disposed between said paperboard substrate layer and said heat seal layer,
said container, when containing a hot liquid at 100 degrees C., having an outer surface temperature, at the outer surface, sufficiently cool that an average person can continuously hold such container without temperature-related discomfort.
4. A thermally insulating food or beverage container as in claim 1, said heat seal layer being affixed to said expanded foam layer.
5. A thermally insulating food or beverage container as in claim 1, said expanded foam layer having a thickness of about 60 microns to about 750 microns.
6. A thermally insulating food or beverage container as in claim 1, said expanded foam layer having a thickness of about 150 microns to about 500 microns and said container, when containing water at about 100 degrees C., having an outer surface temperature of no more than about 70 degrees C.
7. A thermally insulating food or beverage container as in claim 1, said expanded foam layer having a thickness of about 150 microns to about 500 microns and said container, when containing water at about 100 degrees C., having an outer surface temperature of no more than about 65 degrees C.
8. A thermally insulating food or beverage container as in claim 1, said expanded products of microcapsules comprising primary polymeric material selected from the group consisting of polyvinylidene chloride copolymer and acrylonitrilemethyl methacrylate copolymer.
9. A thermally insulating food or beverage container as in claim 1, said expanded foam layer having a realized bulk density of about 0.5 pcf to about 15 pcf.
10. A thermally insulating food or beverage container as in claim 1, wherein an interface between said substrate layer and said expanded foam layer includes a portion of said microcapsules in interstices of said paperboard of said substrate layer.
11. A thermally insulating food or beverage container, comprising:
(a) a bottom wall; and
(b) a side wall extending upwardly from said bottom wall, and having an outer surface and an inner surface, said side wall comprising
(i) a substrate layer comprising paperboard, and
(ii) an expanded foam layer comprising expanded products of a generally uniform mixture of polymeric microcapsules and binder, expanded in accord with an earlier-applied heating process, and affixed to the substrate layer, a portion of said microcapsules of said expanded foam layer being in interstices of said paperboard of said substrate layer, said expanded foam layer comprising about 60 weight percent to about 90 weight percent expanded microcapsules and about 40 weight percent to about 10 weight percent binder, and
(iii) a heat seal layer defining the inner surface of said beverage or food container,
said expanded foam layer being disposed between said paperboard substrate layer and said heat seal layer.
12. A thermally insulating food or beverage container as in claim 11, said heat seal layer being affixed to said expanded foam layer.
13. A thermally insulating food or beverage container as in claim 11, said expanded foam layer having a thickness of about 60 microns to about 750 microns.
14. A thermally insulating food or beverage container as in claim 11, said expanded foam layer having a thickness of about 150 microns to about 500 microns and said container, when containing water at about 100 degrees C., having an outer surface temperature of no more than about 70 degrees C.
15. A thermally insulating food or beverage container as in claim 11, said expanded foam layer having a thickness of about 150 microns to about 500 microns and said container, when containing water at about 100 degrees C., having an outer surface temperature of no more than about 65 degrees C.
16. A thermally insulating food or beverage container as in claim 11, said expanded products of microcapsules comprising primary polymeric material selected from the group consisting of polyvinylidene chloride copolymer and acrylonitrilemethyl methacrylate copolymer.
17. A thermally insulating food or beverage container as in claim 11, said expanded foam layer having a realized bulk density of about 0.5 pcf to about 15 pcf.
18. A thermally insulating food or beverage container as in claim 11, wherein an interface between said substrate layer and said expanded foam layer includes a portion of said microcapsules in interstices of said paperboard of said substrate layer.
19. A thermally insulating beverage or food container, comprising:
(a) a bottom wall; and
(b) a side wall extending upwardly from the bottom wall, said side wall comprising
(i) a substrate layer comprising paperboard,
(ii) an expanded foam layer having a projected area and defining a remote surface thereof, remote from said paperboard substrate layer, the remote surface of said expanded foam layer being defined by intermingled peaks and valleys, the peaks of the remote surface representing about 25 percent to no more than about 65 percent of the projected area of the remote surface, and
(iii) a heat seal layer defining the inner surface of said beverage or food container,
said expanded foam layer being disposed between said paperboard substrate layer and said heat seal layer, and said heat seal layer being affixed to the remote surface of said expanded foam layer only at and adjacent the peaks, whereby thermally insulating dead air space is defined between the remote surface and the heat seal layer at the valleys.
20. A thermally insulating food or beverage container, comprising:
(a) a bottom wall; and
(b) a side wall extending upwardly from said bottom wall, said side wall comprising
(i) a substrate layer comprising paperboard, and
(ii) a non-syntactic expanded foam layer comprising expanded products of polymeric microcapsules expanded in accord with an earlier-applied heating process, and affixed to the substrate paperboard layer, said expanded foam layer having been applied as a coating of heat expandable microcapsules on said paperboard substrate layer, and
(iii) a heat seal layer defining the inner surface of said beverage and food container,
said expanded foam layer being disposed between said paperboard substrate layer and said heat seal layer, wherein an interface between said substrate layer and said expanded foam layer includes a portion of said microcapsules in interstices of said paperboard of said substrate layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method comprising:
receiving a continuous analog signal representing an internal temperature for a processor by a comparator from a temperature measuring device, the comparator and the temperature measuring device disposed on a semiconductor die with the processor;
comparing the continuous analog signal with a control temperature threshold;
generating a control signal with a duty cycle based on the comparison;
tracking an activity level of the control signal based on the duty cycle; and
generating a warning temperature event when the activity level of the control signal reaches a warning threshold.
2. The method of claim 1, wherein the tracking includes:
increasing a counter if the control signal is active; and
decreasing the counter if the control signal is inactive, the counter indicating whether the activity level of the control signal has reached the warning threshold.
3. The method of claim 1, wherein the tracking includes:
increasing a counter if the control signal is active; and
resetting the counter to a value below the warning threshold if the internal temperature falls below the control temperature threshold, the counter indicating whether the activity level of the control signal has reached the warning threshold.
4. The method of claim 1, wherein the tracking includes:
decreasing a counter if the control signal is active; and
resetting the counter to a value above the warning threshold if the internal temperature falls below the control temperature threshold, the counter indicating whether the activity level of the control signal has reached the warning threshold.
5. The method of claim 1, wherein the tracking includes tracking the control signal with a finite state machine.
6. The method of claim 1, wherein generating the warning temperature event includes generating a user notification, the user notification including a recommendation to initiate a manual data saving process.
7. The method of claim 1, wherein generating the warning temperature event includes initiating a process selected from a group comprising an automated data saving process, an operating system procedure, a system management software routine and a platform control function.
8. The method of claim 1, further including generating a system shutdown signal on the die if the internal temperature reaches a shutdown temperature threshold.
9. The method of claim 1, further including measuring a secondary internal temperature of the processor.
10. An apparatus comprising:
a temperature measuring device disposed on a die with a processor, the temperature measuring device operative to output a continuous analog signal representing an internal temperature for a processor;
a comparator on the die to couple to the temperature measuring device, the comparator operative to receive the continuous analog signal, compare the continuous analog signal with a control temperature threshold, and generate a control signal with a duty cycle based on the comparison; and
a tracking module on the die to couple to the comparator, the tracking module including tracking logic operative to track an activity level of the control signal based on the duty cycle, and event logic operative to generate a warning temperature event when the activity level of the control signal reaches a warning threshold.
11. The apparatus of claim 10, wherein the tracking logic includes a counter to indicate whether the activity level of the control signal has reached the warning threshold, the counter to increase if the control signal is active and decrease if the control signal is inactive.
12. The apparatus of claim 10, wherein the tracking logic includes a counter to indicate whether the activity level of the control signal has reached the warning threshold, the counter to increase if the control signal is active and reset to a value below the warning threshold if the internal temperature falls below the control temperature threshold.
13. The apparatus of claim 10, wherein the tracking logic includes a counter to indicate whether the activity level of the control signal has reached the warning threshold, the counter to decrease if the control signal is active and reset to a value above the warning threshold if the internal temperature falls below the control temperature threshold.
14. The apparatus of claim 10, wherein the tracking logic includes a finite state machine to track the activity level of the control signal.
15. The apparatus of claim 10, wherein the warning temperature event is to include a user notification that includes a recommendation to initiate a manual data saving process.
16. The apparatus of claim 10 wherein the warning temperature event is to include an initiation of a process selected from a group comprising an automated data saving process, an operating system procedure, a system management software routine and a platform control function.
17. The apparatus of claim 10, further including a shutdown device to generate a system shutdown signal if the internal temperature reaches a shutdown temperature threshold.
18. The apparatus of claim 10, further including a secondary temperature measurement device to measure a secondary internal temperature of the processor.
19. A system comprising:
a temperature measuring device disposed on a semiconductor die with a processor, the temperature measuring device operative to output a continuous analog signal representing an internal temperature for a processor;
a comparator on the die to couple to the temperature measuring device, the comparator operative to receive the continuous analog signal, compare the continuous analog signal with a control temperature threshold, and generate a control signal with a duty cycle based on the comparison;
a tracking module on the die to couple to the comparator, the tracking module including tracking logic operative to track an activity level of the control signal based on the duty cycle, and event logic operative to generate a warning temperature event when the activity level of the control signal reaches a warning threshold; and
a non-volatile memory subsystem coupled to the semiconductor die to support an automated data saving process in response to the warning temperature event, wherein the internal temperature is measured using a temperature measuring device.
20. The system of claim 19, wherein the processor further includes a shutdown device to generate a system shutdown signal if the internal temperature reaches a shutdown temperature threshold.
21. The system of claim 20, wherein the die further includes an embedded controller coupled to the processor to conduct thermal management for the processor in response to the control signal and the system shutdown signal.
22. The system of claim 19, wherein the processor further includes a secondary temperature measurement device to measure a secondary internal temperature of the processor.
23. The system of claim 22, further including a conversion device coupled to the secondary temperature measurement device to convert the secondary internal temperature into a digital signal.
24. The system of claim 19, further including a chipset disposed between the semiconductor package and the memory subsystem.
25. A method comprising:
receiving a continuous analog signal representing an internal temperature for a processor by a comparator from a thermal diode, the comparator and the thermal diode integrated on a semiconductor die with the processor;
comparing the continuous analog signal with a control temperature threshold;
generating a control signal with a duty cycle based on the comparison;
tracking an activity level of the control signal based on the duty cycle;
generating a warning temperature event when the activity level of the control signal reaches a warning threshold, the generating of the warning temperature event including at least one of initiating an automated data saving process and generating a user notification, the user notification including a recommendation to initiate a manual data saving process.
26. The method of claim 25, further including:
generating a system shutdown signal on the die if the internal temperature reaches a shutdown temperature threshold; and
powering down the processor in response to the system shutdown signal.
27. The method of claim 25, wherein generating the warning temperature event further includes initiating an operating system low power mode.
28. The method of claim 25, further including measuring a secondary internal temperature of the processor.
29. The method of claim 25, wherein the tracking includes tracking the activity level with a skewed counter.