What is claimed is:
1. A portable electronic device including a camera rotatably mounted on a casing having a front wall and a rear wall, and a display for displaying thereon an image taken by said camera at the front wall of said casing, wherein
said camera is arranged in said casing at a location between the front side and the rear side thereof;
said casing has a pair of windows which are formed in, and enclosed on their peripheries by, the front and rear walls thereof, respectively, and through which said camera is operated to rotate by a user and allowed to view the outside of said casing so as to ensure its field of view; and
said camera is rotatably supported on said casing through a rotational operation mechanism which is rotated by the user through said windows formed in the front and rear walls, respectively, from outside of said casing thereby to change a direction of view of said camera in a range between a direction of said front wall and a direction of said rear wall.
2. A portable electronic device comprising:
a casing having a front wall and a rear wall;
a camera disposed in a space between said front and rear walls of said casing so as to be rotatable in a direction from said front wall to the rear wall or vice versa;
a display provided on said front wall of said casing for displaying thereon an image taken by said camera;
a first window which is formed in said front wall of said casing and through which said camera is able to view the outside of said casing and is operated to rotate by a user;
a second window which is formed in said rear wall of said casing, and through which said camera is able to view the outside of said casing and is operated to rotate by the user; and
a bridge portion disposed in a peripheral portion of said casing connecting between said front and rear walls of said casing for forming a part of each of frames for said first and second windows.
3. The portable electronic device as set forth in claim 2, wherein
said casing has an end wall in said peripheral portion of said casing for connecting between corresponding ends of said front wall and said rear wall;
said first window is formed to extend from said front wall to said end wall; and
said second window is also formed to extend from said rear wall to said end wall.
4. The portable electronic device as set forth in claim 3, wherein
said end wall has a thickness equal to a distance between said front wall and said rear wall, and a width in a direction perpendicular to a thicknesswise direction; and
said bridge portion extends in the widthwise direction of said end wall and has a thickness less than that of said end wall.
5. The portable electronic device as set forth in claim 2, wherein
said bridge portion has such a width that it is able to cover the whole or a part of a prescribed proportion or more of the shooting range of said camera at least at a certain rotational position of said camera during the time when said camera is being rotated to reach the bridge portion.
6. The portable electronic device as set forth in claim 2, wherein
said bridge portion includes a prescribed pattern, a picture of which is to be taken by said camera.
7. The portable electronic device as set forth in claim 2, wherein
said bridge portion is integrally molded to said casing.
8. The portable electronic device as set forth in claim 2, wherein
an image display panel with said display mounted thereon and a switch operation panel with a switch mounted thereon are integrally connected with each other in a foldable manner; and
said camera is disposed between said display and an outer peripheral portion of said casing of said image display panel.
9. The portable electronic device as set forth in claim 8, wherein
said camera is rotatable about an axis which is parallel to a folding axis about which said image display panel and said switch operation panel are foldable with respect to each other.
10. The portable electronic device as set forth in claim 8, wherein
said camera is rotatable about an axis perpendicular to a folding axis about which said image display panel and said switch operation panel are foldable with respect to each other.
11. A portable electronic device comprising:
a casing having a front wall and a rear wall;
a camera disposed in a space between said front and rear walls of said casing so as to be rotatable in a direction from said front wall to the rear wall or vice versa;
a display provided on said front wall of said casing for displaying thereon an image taken by said camera;
a first window which is formed in said front wall and through which said camera is able to view the outside of said casing;
a second window which is formed in said rear wall and through which said camera is able to view the outside of said casing;
a bridge portion disposed in a peripheral portion of said casing connecting between said front and rear walls of said casing for forming a part of each of frames for said first and second windows; and
a control part for performing prescribed control based on an image of said bridge portion taken by said camera.
12. The portable electronic device as set forth in claim 11, wherein
said bridge portion includes a prescribed pattern which is to be photographed by said camera, said control part being operable to perform said prescribed control based on an image of said prescribed pattern taken by said camera.
13. The portable electronic device as set forth in claim 11, wherein
said control part performs an indication on said display to the effect that a shooting plane of said camera has been changed from said front side to said rear side or vice versa.
14. A portable electronic device as set forth in claim 11, wherein
said control part controls said display in such a manner that an inverted image taken by said camera is turned upside down to provide an erect image on said display.
15. A portable electronic device including a camera and a display for displaying an image taken by said camera, said camera and said display being disposed in a casing, wherein
said camera is disposed in, and mounted on, said casing for rotation in a direction from a front side to a rear side of said casing or vice versa;
said casing has a pair of windows formed at its front side and rear side, respectively, through which said camera views the outside of said casing; and
a control part is provided for performing prescribed control based on an image of a wall of said casing which is taken by said camera and which lies between said front side and said rear side.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor light emitting diode, comprising:
a light emitting structure comprising an upper surface comprising an N-face; and
an ohmic electrode structure arranged on the light emitting structure, the ohmic electrode structure comprising:
a contact layer arranged on the N-face of the light emitting structure;
a protective layer arranged on the contact layer;
a lower diffusion preventing layer disposed between the contact layer and the N-face of the light emitting structure; and
an upper diffusion preventing layer disposed between the contact layer and the protective layer.
2. The semiconductor light emitting diode according to claim 1, wherein: the lower diffusion preventing layer comprises at least one of Mo and W; the contact layer comprises at least one of Ti, TiN, a Ti\u2014Ni alloy, Ta, and a W\u2014Ti alloy; the upper diffusion preventing layer comprises a metal layer comprising at least one of W, Cr, Ru, Pt, Ni, Pd, Ir, Rh, and Nb, or an oxide film comprising at least one of RuOx, NiOx, IrOx, RhOx, NbOx, TiOx, TaOx, CrOx, and WOx; and the protective layer comprises Al.
3. The semiconductor light emitting diode according to claim 2, wherein the lower diffusion preventing layer comprises a Mo layer or a W layer.
4. The semiconductor light emitting diode according to claim 2, wherein the contact layer comprises a Ti layer.
5. The semiconductor light emitting diode according to claim 2, wherein the contact layer comprises Ti and the upper diffusion preventing layer comprises W.
6. The semiconductor light emitting diode according to claim 2, wherein the lower diffusion preventing layer has a thickness of 1 \u212b to 10 \u212b.
7. The semiconductor light emitting diode according to claim 2, wherein the contact layer has a thickness of 10 \u212b to 50 \u212b.
8. The semiconductor light emitting diode according to claim 2, wherein the upper diffusion preventing layer has a thickness of 100 \u212b to 1000 \u212b.
9. The semiconductor light emitting diode according to claim 1, wherein the light emitting structure comprises an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, and the ohmic electrode structure is arranged on the n-type semiconductor layer.
10. The semiconductor light emitting diode according to claim 9, further comprising an ohmic electrode contacting the p-type semiconductor layer.
11. A method of manufacturing a semiconductor light emitting diode, the method comprising:
forming a light emitting structure comprising an upper surface comprising an N-face; and
forming an ohmic electrode structure on the N-face of the light emitting structure, the ohmic electrode structure comprising a lower diffusion preventing layer, a contact layer, an upper diffusion preventing layer, and a protective layer.
12. The method according to claim 11, wherein: the lower diffusion preventing layer comprises at least one of Mo and W; the contact layer comprises at least one of Ti, TiN, a Ti\u2014Ni alloy, Ta, and a W\u2014Ti alloy; the upper diffusion preventing layer comprises a metal layer formed of at least one of W, Cr, Ru, Pt, Ni, Pd, Ir, Rh, and Nb, or an oxide film formed of at least one of RuOx, NiOx, IrOx, RhOx, NbOx, TiOx, TaOx, CrOx, and WOx; and the protective layer is formed of Al.
13. The method according to claim 12, wherein the contact layer comprises Ti.
14. The method according to claim 13, wherein the upper diffusion preventing layer comprises W.
15. The method according to claim 11, further comprising: surface-treating the light emitting structure before forming the ohmic electrode structure.
16. The method according to claim 15, wherein the surface treatment comprises dipping a surface of the light emitting structure in aqua regia, followed by washing the surface of the light emitting structure using deionized water, and drying the surface of the light emitting structure using nitrogen.
17. The method according to claim 11, further comprising: heat-treating the ohmic electrode structure.
18. The method according to claim 17, wherein the heat treatment is performed at a temperature of 150\xb0 C. to 600\xb0 C.
19. The semiconductor light emitting diode according to claim 1, wherein the lower diffusion preventing layer contacts the N-face of the light emitting structure, the contact layer contacts the lower diffusion preventing layer, the upper diffusing preventing layer contacts the contact layer, and the Al protective layer contacts the upper diffusing preventing layer.
20. The method according to claim 11, wherein forming the ohmic electrode structure comprises:
forming the lower diffusion preventing layer on the N-face of the light emitting structure;
forming the contact layer on the lower diffusion preventing layer;
forming the upper diffusion preventing layer on the contact layer; and
forming the protective layer on the upper diffusion preventing layer.