1. A system for generating a bill of material (BOM) file, the system comprising:
an extracting module configured for extracting data on components of a circuit design diagram of a motherboard, and for storing the data in a spreadsheet as a non-standardized original BOM file;
a checking module configured for determining whether the data meet requirements corresponding to designing standards of the motherboard by checking the data of the non-standardized original BOM file;
a processing module configured for classifying the data into lists according to predefined manufacturing procedures; and
a generating module configured for automatically generating a standardized BOM file according to the corresponding lists.
2. The system according to claim 1, wherein the checking module is further configured for determining whether the motherboard is a single-sided motherboard or a double-sided motherboard.
3. The system according to claim 2, further comprising a reading module configured for reading a pick file if the motherboard is a double-sided motherboard.
4. The system according to claim 3, wherein the pick file stores location information of all components of the double-sided motherboard.
5. The system according to claim 3, wherein the standardized BOM file is either the standardized BOM file of the single-sided motherboard or the standardized BOM file of the double-sided motherboard.
6. The system according to claim 1, wherein the predefined manufacturing procedures are selected from a group consisting of the manufacturing procedures related to surface mount parts, plated-through-hole parts, and package parts.
7. The system according to claim 6, wherein the lists of the standardized BOM file of the single-sided motherboard comprises: a first list for storing surface mount parts data, a second list for storing plated-through-hole parts data, a third list for storing package parts data, a fourth list for storing non-functional parts data, and a fifth list for storing changed components data.
8. The system according to claim 6, wherein the lists of the standardized BOM file of the double sided motherboard comprises: a first list for storing surface mount parts data on a top side of the motherboard, a second list for storing surface mount parts data on a bottom side of the motherboard, a third list for storing plated-through-hole parts data, a fourth list for storing package parts data, a fifth list for storing non-functional parts data, and a sixth list for storing changed components data.
9. A method for generating a bill of material (BOM) file, the method comprising the steps of:
extracting data on components of a circuit design diagram of a motherboard, and storing the data in an spreadsheet as a non-standardized original BOM file;
determining whether the data meet requirements corresponding to designing standards of the motherboard by checking the data of the non-standardized original BOM file;
classifying the data into lists according to predefined manufacturing procedures; and
automatically generating a standardized BOM file according to the corresponding lists.
10. The method according to 9, further comprising steps of:
determining whether the motherboard is a single-sided motherboard or a double-sided motherboard, if the data meet the requirements corresponding to designing standards of the motherboard; and
reading a pick file if the motherboard is a double-sided motherboard.
11. The method according to 10, wherein the pick file is configured for storing location information on all components of the double-sided motherboard.
12. The method according to 11, wherein the standardized BOM file is either the standardized BOM file of the single-sided motherboard or the standardized BOM file of the double-sided motherboard.
13. The method according to claim 9, wherein the predefined manufacturing procedures are selected from a group consisting of the manufacturing procedures related to surface mount parts, plated through hole parts, and package parts.
14. The method according to claim 13, wherein the lists of the standardized BOM file of the single-sided motherboard comprises: a first list for storing surface mount parts data, a second list for storing plated-through-hole parts data, a third list for storing package parts data, a fourth list for storing non-functional parts data, and a fifth for storing changed components data.
15. The method according to claim 13, wherein the lists of the standardized BOM file of the double sided motherboard comprises: a first list for storing surface mount parts data on a top side of the motherboard, a second list for storing surface mount parts data on a bottom side of the motherboard, a third list for storing plated-through-hole parts data, a fourth list for storing package parts data, a fifth list for storing non-functional parts data, and a sixth list for storing changed components data.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. An interposer for providing electrical contact with a ball grid array connector, comprising:
a housing having a plurality of contacts, wherein the contacts have a first end and a second end;
a first body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts; and
a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts, wherein the first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball grid array connector.
2. The interposer of claim 1, wherein the contacts pass from a first face of the housing to a second face of the housing opposite the first face.
3. The interposer of claim 1, wherein the first body and the second body form a soldered connection with the single body of reflowable, electrically conductive material of the ball grid array connector during a reflow process.
4. The interposer of claim 1, wherein the first end of the contacts are accessible on a first face of the housing and the second end of the contacts are accessible on an opposite face of the housing.
5. The interposer of claim 1, wherein the first body and the second body form a soldered connection with the single body of reflowable, electrically conductive material of the ball grid array connector during a reflow process.
6. The interposer of claim 1, wherein the interposer comprises a third body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts, wherein the third body provides electrical contact between the interposer and the single body of reflowable, electrically conductive material of the ball grid array connector.
7. The interposer of claim 6, wherein at least one of the first, second, and third body form a soldered connection with the single body of reflowable, electrically conductive material of the ball grid array connector during a reflow process.
8. The interposer of claim 6, wherein the single body of reflowable, electrically conductive material of the ball grid array connector rests on the first, second, and third bodies of the interposer.
9. The interposer of claim 8, wherein the body of reflowable, electrically conductive material of the ball grid array connector, and the first, second and third bodies of the interposer are substantially spherical.
10. The interposer of claim 9, wherein the substantially spherical body of reflowable, electrically conductive material of the ball grid array connector rests on each of the substantially spherical first, second and third bodies of the interposer.
11. The interposer of claim 9, wherein the body of reflowable, electrically conductive material of the ball grid array connector, and the first, second and third bodies of the interposer have substantially similar dimensions.
12. The interposer of claim 8, wherein the body of reflowable, electrically conductive material of the ball grid array connector is substantially spherical, and at least one of the first, second and third bodies of the interposer are substantially conical.
13. The interposer of claim 12, wherein the substantially conical first, second and third bodies of the interposer have substantially similar dimensions.
14. The interposer of claim 12, wherein the substantially spherical body of reflowable, electrically conductive material of the ball grid array rests on each of the substantially conical first, second and third bodies of the interposer.
15. The interposer of claim 1, wherein the interposer comprises a fourth body of reflowable, electrically conductive material disposed on the second end of at least one of the contacts that provides electrical contact between the interposer and a substrate during a reflow process, wherein the second end is opposite the first end.
16. The interposer of claim 1, further comprising a plurality of holes through the housing, wherein each hole has at least one contact therein.
17. The interposer of claim 1, wherein the contacts form a matrix array and each contact has at least first and second bodies for providing electrical contact between the interposer and respective single bodies of reflowable, electrically conductive material of the ball grid array connector.
18. An electrical connection comprising, comprising:
a housing having a plurality of contacts, wherein the contacts have a first end and a second end;
a first body of reflowable, electrically conductive material disposed on a first end of at least one of the contacts; and
a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts,
wherein the first body and the second body form a soldered connection with a single body of reflowable, electrically conductive material during a reflow process.
19. The electrical connection of claim 18, wherein the first and second bodies are substantially spherical bodies having substantially similar dimensions.
20. The electrical connection of claim 18, wherein the first and second bodies are substantially conical bodies having substantially similar dimensions.
21. The electrical connection of claim 18, wherein the housing and the first and second bodies form part of an interposer and the other body forms part of a BGA connector.
22. An interposer for communicating with a ball grid array connector, comprising:
a housing having a plurality of holes;
more than one contact located within each of the plurality of holes, wherein the contacts have a first end and a second end;
a first body of reflowable, electrically conductive material disposed on the first end of a first contact; and
a second body of reflowable, electrically conductive material disposed on the first end of a second contact, wherein the first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball grid array connector.
23. The interposer of claim 22, further comprising a third body of reflowable, electrically conductive material disposed on the second end of at least one of the first and second contacts.
24. An interposer for mating with a ball grid array connector, comprising:
a housing having a first face and a second face, wherein the first face is opposite the second face;
a plurality of holes in the housing extending from the first face to the second face;
a first body of reflowable, electrically conductive material located partially within a first hole, wherein the first body extends from a plane of the first face; and
a second body of reflowable, electrically conductive material located partially within the first hole, wherein the second body extends from a plane of the first face.
25. The interposer of claim 24, further comprising a third body of reflowable, electrically conductive material located partially within the first hole, wherein the third body extends from a plane of the first face.
26. The interposer of claim 24, further comprising a fourth body of reflowable, electrically conductive material located partially within the first hole, wherein the third body extends from a plane of the second face.
27. The interposer of claim 26, wherein the fourth body is in electrical connection with at least one of the first, second, and third bodies.