1. A method for processing a wafer, comprising:
providing an alloy susceptor comprising an exterior surface and a wafer contact surface;
treating the exterior surface to produce a roughness of the exterior surface, wherein the wafer contact surface is not treated;
coating the roughened exterior surface with a ceramic material, wherein the wafer contact surface is not coated;
positioning the alloy susceptor comprising the ceramic-coated roughened exterior surface in a wafer process chamber; and
depositing a plurality of layers of film, each of the plurality of layers of film being of a different material than the ceramic material, on the ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of film and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of film and a non-roughened exterior surface of the alloy susceptor without the ceramic material.
2. The method of claim 1, wherein the roughness is produced on the exterior surface of the alloy susceptor by directing an aluminum material that is under pressure at the exterior surface.
3. The method of claim 1, wherein the roughness produced on the exterior surface of the alloy susceptor comprises a range of about 45 to about 60 \u03bcm.
4. The method of claim 1, wherein the ceramic material coated on the roughened exterior surface of the alloy susceptor comprises a thickness of about 50 \u03bcm.
5. A method for processing a wafer, comprising:
providing an alloy susceptor comprising an exterior surface and a wafer contact surface;
treating the exterior surface to produce a roughness of the exterior surface, wherein the wafer contact surface is not treated;
coating the roughened exterior surface with an aluminum oxide ceramic material, wherein the wafer contact surface is not coated;
positioning the alloy susceptor comprising the aluminum oxide ceramic-coated roughened exterior surface in a wafer process chamber; and
depositing a plurality of layers of film, each of the plurality of layers of film being of a different material than the aluminum oxide ceramic material, on the aluminum oxide ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of film and the aluminum oxide ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of film and a non-roughened exterior surface of the alloy susceptor without the aluminum oxide ceramic material.
6. The method of claim 5, wherein the aluminum oxide is applied to the roughened exterior surface of the alloy susceptor at a temperature of at least 2000 degrees Celsius.
7. A method for processing a wafer, comprising:
positioning a first wafer on a wafer contact surface of an alloy susceptor that is located in a wafer process chamber, wherein an exterior surface of the alloy susceptor that excludes the wafer contact surface has been treated to produce a roughness of the exterior surface, and that roughened exterior surface has been coated with a ceramic material;
depositing a first film layer on the first wafer and the ceramic coated roughened exterior surface of the alloy susceptor, wherein the first film layer is of a different material than the ceramic material;
positioning a second wafer on the wafer contact surface; and
depositing a second film layer on the second wafer and the ceramic coated roughened exterior surface of the alloy susceptor that includes the first film layer, wherein the second film layer is of a different material than the ceramic material;
wherein a first adhesion exists between the first and second film layers and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the first and second film layers and a non-roughened exterior surface of the alloy susceptor without the ceramic material.
8. The method of claim 7, wherein the roughness produced on the exterior surface of the alloy susceptor comprises a range of about 45 to about 60 \u03bcm.
9. The method of claim 7, wherein the ceramic material coated on the roughened exterior surface of the alloy susceptor comprises an aluminum oxide ceramic material.
10. The method of claim 8, wherein the ceramic material coated on the roughened exterior surface of the alloy susceptor comprises a thickness of about 50 \u03bcm.
11. The method of claim 7, wherein the roughness is produced on the exterior surface of the alloy susceptor by directing pressurized particles at the exterior surface.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for sequencing a target nucleic acid molecule in a system having a flow chamber with a support, said method comprising:
(a) providing a flow chamber with a support comprising an array of immobilized complexes, each of said immobilized complexes comprising a nucleic acid polymerizing enzyme, a target nucleic acid, and a primer which complements a region of the target nucleic acid, wherein the nucleic acid polymerizing enzyme is complexed with the target nucleic acid and the primer, and either the nucleic acid polymerizing enzyme or the target nucleic acid is immobilized on the support;
(b) introducing into the chamber a plurality of nucleotide analogs with labels on their \u03b3-phosphates that are not positioned on said support to move through said flow chamber to contact said complexes;
(c) extending the primer by incorporating nucleotide analogs from the plurality of nucleotide analogs into the primer, thereby forming a polymerase extension product, which is a complement of the target nucleic acid; and
(d) sequencing the target nucleic acid by individually detecting the labels of the \u03b3-phosphates from the nucleotide analogs during a process in which the polymerase extension product is formed.
2. The method of claim 1, wherein said labels are attached to the \u03b3-phosphates via a linker.
3. The method of claim 1, wherein said labels are directly attached to the \u03b3-phosphates.
4. The method of claim 1, wherein said flow chamber is made of plastic or glass.
5. The method of claim 1, wherein said individually detecting the labels of the \u03b3-phosphates from the nucleotide analogs is performed using a detector which is capable of detecting a single molecule.
6. The method of claim 5, wherein said detector is selected from the group consisting of an optical reader, a high-efficiency photon detection system, a photodiode, a camera, a charge couple device, an intensified charge coupled device, a near-field scanning microscope, a far-field confocal microscope, a microscope that detects wide-field epi-illumination, and a total internal reflection fluorescence microscope when the labels are fluorescent labels.
7. The method of claim 1, wherein the nucleic acid polymerizing enzyme or the target nucleic acid is present as an individual molecule located in a defined location of the support.
8. The method of claim 1, wherein each of the immobilized complexes of said array is different.
9. The method of claim 1, wherein said array of immobilized complexes is addressable.
10. The method of claim 5, wherein said detector is capable of acquiring a sequence of images.
11. The method of claim 10, wherein said sequence of images is analyzed to track single molecules.
12. The method of claim 5, wherein said detector provides low background and enables the detection of single molecules.
13. The method of claim 5, wherein said detector detects the labels in an evanescent optical field when the labels are fluorescent labels.
14. The method of claim 5, wherein said detector detects the labels via a mechanism selected from the group consisting of fluorescence resonance energy transfer, an electron transfer mechanism, an excited-state lifetime mechanism and a ground-state complex quenching mechanism when the labels are fluorescent labels.