1. A semiconductor device comprising:
a semiconductor layer having an opening over an insulating surface;
a first insulating layer over the semiconductor layer;
a gate electrode over the first insulating layer;
a second insulating layer over the gate electrode; and
a conductive layer over the second insulating layer,
wherein at least a part of the opening reaches the insulating surface, and
wherein the conductive layer is connected to a side surface of the semiconductor layer and a top surface of the semiconductor layer.
2. The semiconductor device according to claim 1, wherein the semiconductor layer is a single crystal silicon layer.
3. The semiconductor device according to claim 1, wherein the semiconductor layer comprise a silicide region.
4. The semiconductor device according to claim 1, wherein a thickness of the semiconductor layer is 10 to 200 nm.
5. The semiconductor device according to claim 1, wherein the conductive layer comprises tungsten.
6. A semiconductor device comprising:
a semiconductor layer having an opening over an insulating surface;
a first insulating layer over the semiconductor layer;
a gate electrode over the first insulating layer;
a second insulating layer over the gate electrode; and
a conductive layer over the second insulating layer,
wherein the conductive layer is connected to the insulating surface through the opening, and
wherein the conductive layer is connected to a side surface of the semiconductor layer and a top surface of the semiconductor layer.
7. The semiconductor device according to claim 6, wherein the semiconductor layer is a single crystal silicon layer.
8. The semiconductor device according to claim 6, wherein the semiconductor layer comprise a silicide region.
9. The semiconductor device according to claim 6, wherein a thickness of the semiconductor layer is 10 to 200 nm.
10. The semiconductor device according to claim 6, wherein the conductive layer comprises tungsten.
11. A semiconductor device comprising:
a semiconductor layer having a first opening over a first insulating layer , the first insulating layer having a second opening;
a second insulating layer over the semiconductor layer;
a gate electrode over the second insulating layer;
a third insulating layer over the gate electrode, the third insulating layer having a third opening; and
a conductive layer over the third insulating layer,
wherein the conductive layer is connected to a side surface of the semiconductor layer and a side surface of the silicide region.
12. The semiconductor device according to claim 11, wherein the semiconductor layer is a single crystal silicon layer.
13. The semiconductor device according to claim 11, wherein the silicide region does not overlap the second insulating film.
14. The semiconductor device according to claim 11, wherein a thickness of the semiconductor layer is 10 to 200 nm.
15. The semiconductor device according to claim 11, wherein the conductive layer comprises tungsten.
16. The semiconductor device according to claim 1, wherein the opening reaches the insulating surface.
17. The semiconductor device according to claim 6, wherein the opening reaches the insulating surface.
18. The semiconductor device according to claim 1, wherein the opening is surrounded by the semiconductor layer.
19. The semiconductor device according to claim 6, wherein the opening is surrounded by the semiconductor layer.
20. The semiconductor device according to claim 11,
wherein the first insulating layer is over an insulating surface,
wherein the conductive layer is connected to the insulating surface through the first opening, the second opening, and the third opening.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A control module for a motor vehicle, comprising:
a seat coupled to the vehicle;
a housing coupled to the seat;
at least one locking element coupled to the housing that is configured to resiliently deflect, and releasably secure the housing in the seat when the at least one locking element assumes a locking position;
a push button coupled to the at least one locking element, the push button configured to resiliently deflect the locking element into a position that releases the housing; and
a switch coupled to the housing, the switch having an opening therein that enables the locking element to move into the release position only when the switch is rotated to a defined switching position.
2. A control module according to claim 1, wherein the defined switching position for release of the locking element includes a position into which the switch is not moved during normal operation of the motor vehicle.
3. A control module according to claim 1, wherein each push button and each associated locking element form a slidepush connection, which transfers a movement of the push button to the locking element.
4. The control module according to claim 1, wherein the switch is configured as a rotary switch.
5. A control module for a motor vehicle, comprising:
a seat coupled to the vehicle;
a housing coupled to the seat;
a switch coupled to the housing;
at least one locking element coupled to the housing and configured to resiliently deflect, and to releasably secure the housing in the seat when the at least one locking element is in a locking position; and
a push button coupled to the at least one locking element and configured to unlock the at least one locking element enabling it to be deflected, and wherein the switch is further configured to act upon the at least one locking element and resiliently deflect it into a position that releases the housing.
6. A control module according to claim 5, wherein the push button and locking element form a groove and tongue connection that is released upon operation of the push button.
7. The control module according to claim 5, wherein the locking element is further configured such that an increased force expenditure is necessary to move the switch into the defined switching position to release the locking element.
8. A control module for a motor vehicle, comprising:
a seat coupled to the vehicle;
a housing coupled to the seat;
a switch coupled to the housing;
at least one locking element coupled to the housing and configured to resiliently deflect and releasably secure the housing in the seat when the at least one locking element is in a locking position; and
a push button configured to unlock the switch enabling it to rotate, and wherein the switch is further configured to resiliently deflect the at least one locking element to a release position and release the housing.
9. A method for releasing a vehicular control module from a seat, the control module having a housing with a switch, wherein the housing has at least one resiliently deflectable locking element, and wherein the locking element is prevented from deflecting into a release position when a groove and tongue connection is engaged, the groove and tongue connection having a pushbutton actuator, the method comprising the steps of:
releasing the groove and tongue connection by depressing the pushbutton actuator; and
moving the switch into a defined switching position to resiliently deflect the locking element into a release position.