1. A semiconductor device comprising:
a first semiconductor element that includes:
a semiconductor substrate,
a plurality of connecting pads arranged on the semiconductor substrate,
insulation films arranged over an upper surface of the semiconductor substrate excluding center portions of the connecting pads,
distributing wiring layers electrically connected to the connecting pads and arranged over upper surfaces of the insulation films,
a plurality of columnar electrodes for external connection which are arranged on upper surfaces of the distributing wiring layers and electrically connected thereto, and
a sealing film arranged on the upper surfaces of the insulation films and the distributing wiring layers such that an upper surface of the sealing film is flush with upper surfaces of the columnar electrodes;
wherein the first semiconductor element defines a periphery between a lower, outer edge of the semiconductor substrate and an upper, outer edge of the sealing film,
an insulation member surrounding the periphery of the first semiconductor element such that the insulation member is situated around the semiconductor substrate, the connecting pads, the insulation films, the distributing wiring layers, the columnar electrodes and the sealing film;
an upper wiring structure arranged over an upper surface of the first semiconductor element and the insulation member;
a lower wiring structure arranged below a lower surface of the first semiconductor element and the insulation member; and
a second semiconductor element that is mounted on at least one of the upper wiring structure and the lower wiring structure.
2. The semiconductor device according to claim 1, further comprising a conductor that penetrates the insulation member to electrically connect the upper wiring structure and the lower wiring structure.
3. The semiconductor device according to claim 1, wherein the second semiconductor element is mounted only on one of the upper wiring structure and the lower wiring structure, and solder balls are mounted on the other of the upper wiring structure and the lower wiring structure.
4. The semiconductor device according to claim 1, wherein the upper wiring structure comprises upper insulation films having a multiple-layer structure, and upper wiring layers having a multiple-layer structure.
5. The semiconductor device according to claim 4, wherein a top layer of the upper wiring layers includes at least one connecting pad, and the upper layer wiring structure includes a top insulation film that covers the top layer of the upper wiring layers except for the at least one connecting pad.
6. The semiconductor device according to claim 5, further comprising at least one solder ball provided on the at least one connecting pad of the top layer of the upper wiring layers.
7. The semiconductor device according to claim 5, further comprising surface layers provided on the top layer of the upper wiring layers.
8. The semiconductor device according to claim 7, wherein the second semiconductor element is mounted on the top insulation film.
9. The semiconductor device according to claim 7, wherein the second semiconductor element comprises bonding wires connected to the surface layers.
10. The semiconductor device according to claim 1, wherein the lower wiring structure comprises a base plate, a lower insulation film, and a lower wiring layer.
11. The semiconductor device according to claim 10, wherein the base plate comprises at least one of an upper layer wiring provided on an upper surface of the base plate and a lower layer wiring provided on a lower surface of the base plate.
12. The semiconductor device according to claim 11, wherein at least one of the upper layer wiring and the lower layer wiring is a ground wiring.
13. The semiconductor device according to claim 10, wherein the base plate is made of thermosetting resin including a reinforcer.
14. The semiconductor device according to claim 1, wherein the lower wiring structure includes lower insulation films having a multiple-layer structure, and lower wiring layers having a multiple-layer structure.
15. The semiconductor device according to claim 14, wherein a bottom layer of the lower wiring layers includes at least one connecting pad, and the lower wiring structure includes a bottom insulation film that covers the bottom layer of the lower wiring layers except for the at least one connecting pad.
16. The semiconductor device according to claim 15, further comprising a solder ball intervened between the second semiconductor element and the bottom layer of the lower wiring layers.
17. The semiconductor device according to claim 15, further comprising surface layers provided on the bottom layer of the lower wiring layers.
18. The semiconductor device according to claim 17, wherein the second semiconductor element is mounted on the bottom insulation film.
19. The semiconductor device according to claim 18, wherein the second semiconductor element comprises bonding wires that are connected to the surface layers.
20. The semiconductor device according to claim 1, wherein each of the columnar electrodes has a height of at least 60 \u03bcm.
21. The semiconductor device according to claim 1, wherein an upper surface of the insulation member is flush with an upper surface of the first semiconductor element.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for informing a user of related information, said method comprising:
(a) receiving a request for media item information from an online media store;
(b) determining whether there is available related information at a partner online store that is related to the media item information; and
(c) responding, if it is determined that there is available related information at a partner online store, to the request with a response that includes at least the media item information as well as the available related information or an indication thereto.
2. A method as recited in claim 1, wherein said method further comprises:
(d) responding, if it is determined that there is no available related information at a partner online store, to the request with a response that includes at least the media item information and does not include the available related information or the indication thereto.
3. A method as recited in claim 1, wherein the indication to the available related information is a hyperlink.
4. A method as recited in claim 1, wherein the response includes the media item information as well as the indication to the available related information.
5. A method as recited in claim 4, wherein said determining (b) comprises:
(b1) determining an artist associated with the media item information being requested; and
(b2) determining, based on the determined artist, whether the partner online store has available related information that is related to the media item information.
6. A method as recited in claim 5, wherein the partner online store is provided by a business partner, and
wherein said determining (d2) comprises examining a data file provided by the partner that specifies artists that the partner online store has available related information therefor.
7. A method as recited in claim 1, wherein the requested media item information concerns a song or collection of songs available for purchase on the online media store.
8. A method as recited in claim 1, wherein the available related information pertains to an event.
9. A computer readable medium including executable computer program code tangibly stored therein for informing a user of related information, said computer readable medium comprising:
computer program code for receiving a request for media item information from an online media store;
computer program code for determining whether there is available related information at a partner online store that is related to the media item information; and
computer program code for responding, if the computer program code for determining determines that there is available related information at a partner online store, to the request with a response that includes at least the media item information as well as the available related information or an indication thereto.
10. A computer readable medium as recited in claim 9, wherein said method further comprises:
computer program code for responding, if the computer program code for determining determines that there is no available related information at a partner online store, to the request with a response that includes at least the media item information and does not include the available related information or the indication thereto.
11. A computer readable medium as recited in claim 9, wherein the indication to the available related information is a hyperlink.
12. A computer readable medium as recited in claim 9, wherein said computer program code for determining comprises:
computer program code for determining an artist associated with the media item information being requested; and
computer program code for determining, based on the determined artist, whether the partner online store has available related information that is related to the media item information.
13. A computer readable medium as recited in claim 12, wherein the partner online store is provided by a business partner, and
wherein said computer program code for determining comprises computer program code for examining a data file provided by the partner that specifies artists that the partner online store has available related information therefor.
14. A computer readable medium as recited in claim 9, wherein the requested media item information concerns a song or collection of songs available for purchase on the online media store.
15. A computer readable medium as recited in claim 9, wherein the available related information pertains to an event.
16. A system for informing a user of related information, said system comprising:
a computing device capable of executing computer program code for informing a user of related information, the computer program code including at least:
computer program code for receiving a request for media item information from an online media store;
computer program code for determining whether there is available related information at a partner online store that is related to the media item information; and
computer program code for responding, if the computer program code for determining determines that there is available related information at a partner online store, to the request with a response that includes at least the media item information as well as the available related information or an indication thereto.
17. A computer readable medium as recited in claim 16, wherein said computer program code for determining comprises:
computer program code for determining an artist associated with the media item information being requested; and
computer program code for determining, based on the determined artist, whether the partner online store has available related information that is related to the media item information.
18. A computer readable medium as recited in claim 17, wherein the partner online store is provided by a business partner, and
wherein said computer program code for determining comprises computer program code for examining a data file provided by the partner that specifies artists that the partner online store has available related information therefor.
19. A computer readable medium as recited in claim 16,
wherein the indication to the available related information is a hyperlink,
wherein the response includes the media item information as well as the indication to the available related information, and
wherein the available related information pertains to an event.