1. A solid state multi-spectral light source comprising:
a plurality of light-emitting diodes,
wherein:
at least two of the light-emitting diodes produce two different colors, and
the light source is configured to produce at least two different color light bars that scroll through selective activation of like colored light-emitting diodes in dependence upon an image signal.
2. The light source according to claim 1, wherein the light-emitting diodes are arranged in groups, each group having at least two light-emitting diodes which produce the two different colors.
3. The light source according to claim 2, wherein the light-emitting diode groups each include three light-emitting diodes which produce three different colors.
4. The light source according to claim 1, wherein
the light-emitting diodes are defined on a wafer.
5. The light source according to claim 1, wherein
the light-emitting diodes are formed by a plurality of substrates disposed on a circuit board,
each of the light-emitting diodes corresponding to one of the plurality of substrates.
6. A multi-spectral light source system comprising:
a light valve; and
a solid state multi-spectral light source that scrolls different colored light bars onto the light valve to produce a color image, the light source including a plurality of light-emitting diodes, wherein at least two of the light-emitting diodes produce two different colors.
7. The light source system according to claim 6, wherein the light-emitting diodes of the light source are arranged in groups, each group having at least two light-emitting diodes which produce the two different colors.
8. The light source system according to claim 7, wherein the light emitting diode groups of the light source each include three light-emitting diodes which produce three different colors.
9. The light source system according to claim 7, wherein the light-emitting diode groups of the light source produce two different color light bars that scroll through selective actuation of like colored light-emitting diodes.
10. The light source system according to claim 6, wherein the light-emitting diodes of the light source are defined on a wafer.
11. The light source system according to claim 6, wherein the light-emitting diodes of the light source are defined by a plurality of substrates disposed on a circuit board, each of the light-emitting diodes corresponding to one of the plurality of substrates.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A waterproof structure for zippers, comprising two tapes and two toothed bars, said two toothed bars respectively fixed at opposite inner side edges of said two tapes, said two tapes having one side surface applied with bonding glue, said bonding glue having its topside closely stuck with an electroplating membrane for preventing external water from seeping in said tapes.
2. The waterproof structure for zippers as claimed in claim 1, wherein said waterproof structure is formed by:
a first step of inputting material;
a second step of applying bonding glue, said bonding glue evenly applied to one side surface of said two tapes of a half-finished zipper by a roller unit;
a third step of gluing said electroplating membrane; said electroplating membrane closely stuck to a superficial layer of said bonding glue;
a fourth step of drying; said half-finished zipper with said bonding glue and said electroplating membrane on its surface conveyed to a roaster oven to be roasted and dried;
a fifth step of hot pressing and shaping, said bonding glue and said electroplating membrane on a surface of said tapes of said half-finished zipper pressed and closely bonded together by a hot-pressing device;
a sixth step of drying for a second time; said half-finished zipper, after pressed, conveyed to a roaster oven to be roasted and dried again;
a seventh step of keeping static for maturity; said half-finished zipper cooling off and then kept static to let said bonding glue of said half-finished zipper matured; and
an eighth step of moving-out of products.
3. The waterproof structure for zippers as claimed in claim 2, wherein a time of roasting carried out in said fourth step of drying is set according to an amount of said bonding glue and said electroplating membrane applied on said tapes.
4. The waterproof structure for zippers as claimed in claim 2, wherein a hot pressing temperature in said fifth step of hot pressing and shaping is 80\xb0 C. to 220\xb0 C.
5. The waterproof structure for zippers as claimed in claim 2, wherein an output pressure needed in said fifth step of hot pressing and shaping is 0.5 to 12 kgcm2.
6. The waterproof structure for zippers as claimed in claim 2, wherein a time of keeping static for maturity needed in said seventh step is above 6 hours.