1. A method for monitoring an analog data signal, said method comprising the steps of:
receiving said analog data signal;
bandpass filtering said analog data signal over one or more frequency ranges to produce corresponding one or more bandpass filtered analog data signals;
rectifying said one or more bandpass filtered analog data signals to produce corresponding one or more rectified bandpass filtered analog data signals;
integrating said one or more rectified bandpass filtered analog data signals to produce corresponding one or more integrated bandpass filtered analog data signals; and
processing said one or more integrated bandpass filtered analog data signals.
2. The method of claim 1, wherein the step of processing comprises at least one of:
triggering at least one event when said one or more integrated bandpass filtered analog data signals meets at least one trigger criteria;
converting at least one of said one or more integrated bandpass filtered analog data signals to a digital data signal comprising at least one digital data value; or
assessing said one or more integrated bandpass filtered analog data signals relative to a determined normal integrated bandpass filtered analog data signal behavior.
3. The method of claim 2, further comprising the step of:
storing said at least one digital data value in a memory.
4. The method of claim 3, further comprising the step of:
time stamping said at least one digital data value.
5. The method of claim 1, further comprising the step of:
conditioning said analog data signal prior to the step of bandpass filtering.
6. The method of claim 1, wherein said analog data signal is received from a sensor.
7. The method of claim 1, further comprising:
varying at least one of the ranges of the one or more frequency ranges in accordance with at least one rule corresponding to at least one of an acceptable integrated bandpass filtered analog data signal or an unacceptable integrated bandpass filtered analog data signal.
8. The method of claim 2, wherein said normal integrated bandpass filtered analog data signal behavior corresponds to at least one of a minimum integrated bandpass filtered analog data measurement, a maximum integrated bandpass filtered analog data measurement, an average integrated bandpass filtered analog data measurement, a mean average integrated bandpass filtered analog data measurement, or a standard deviation of integrated bandpass filtered analog data measurements
9. A system for monitoring an analog data signal comprising:
a bandpass filter circuit that receives said analog data signal and produces a bandpass filtered analog data signal corresponding to a frequency range of interest;
a rectifier circuit that rectifies said bandpass filtered analog data signal to produce a rectified bandpass filtered analog data signal;
an integrator circuit that integrates said rectified bandpass filtered analog data signal to produce an integrated bandpass filtered analog data signal; and
a processing circuit that processes said integrated bandpass filtered analog data signal.
10. The system of claim 9, further comprising at least one of:
a trigger circuit that triggers at least one event when said integrated bandpass filtered analog data signal meets at least one trigger criteria; or
an analog-to-digital converter circuit that converts said integrated bandpass filtered analog data signal to a digital data signal comprising at least one digital data value.
11. The system of claim 10, further comprising:
a memory for storing said at least one digital data value in a memory.
12. The system of claim 11, further comprising:
a clock used for time stamping said at least one digital data value.
13. The system of claim 9, further comprising:
a conditioning circuit for conditioned said analog signal, said analog signal being output to said bandpass filter circuit.
14. The system of claim 9, further comprising:
a sensor that produces said analog data signal.
15. The system of claim 9, wherein said integrator circuit comprises one of a leaky integrator circuit or a resettable integrator circuit.
16. The system of claim 9, wherein said system monitors an analog signal representing a parameter relating to at least one of a munitions, a cargo, a crate, a container, a person, a crowd, a sporting facility, a theme park, a concert facility, a parade route, a coliseum, a traffic, a vehicle, an object within a monitored area, a power plant, an airport, a water treatment plant, a pipeline, a power line, a prisoner, a feedstock yard, a pasture, a poultry facility, a swine facility, an animal, an unmanned ground sensor, a bridge, a moving part, a wheel, a gear, an engine part, a fan motor, a rotor, a drilling platform, a well, a biological condition, a ballast, a farm crop, an amusement park ride, a building structure, a frame, an infrastructure, a sound, a storm, a levee, a dam, an environmental characteristic, a restricted area, a prison, a ground moisture, a presence of chemicals in the ground, a ground temperature, a nuclear weapon, a biological weapon, or a chemical weapon.
17. The system of claim 9, further comprising:
a sealed housing.
18. The system of claim 9, further comprising:
an interface to a communications link.
19. A method of monitoring an analog data signal, said method comprising the steps of:
receiving from a sensor said analog data signal;
bandpass filtering said analog data signal;
integrating said bandpass filtered analog data signal; and
processing said integrated bandpass filtered analog data signal.
20. The method of claim 19, wherein the step of processing comprises at least one of:
triggering at least one event when said integrated bandpass filtered analog data signal meets at least one trigger criteria;
converting said integrated bandpass filtered analog data signal to a digital data signal comprising at least one digital data value; or
assessing said integrated bandpass filtered analog data signal relative to a determined normal integrated bandpass filtered analog data signal behavior.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A nozzle plate usable in an inkjet head, the nozzle plate comprising:
a silicon substrate having a nozzle;
a thermally oxidized silicon layer formed on an outer surface of the silicon substrate and an inner wall of the nozzle;
an adhesion layer deposited on the thermally oxidized silicon layer formed on the outer surface of the silicon substrate, and formed of silicon oxide; and
an ink-repellent coating layer deposited on the adhesion layer;
wherein a densely packed siloxane network is formed at an interface between the adhesion layer and the ink-repellent coating layer.
2. The nozzle plate of claim 1, wherein a surface of the adhesion layer on which the ink-repellent coating layer is formed has a root mean square (RMS) roughness of about 0.5 to 2 nm.
3. The nozzle plate of claim 1, wherein the adhesion layer is formed using an electron-beam evaporation process.
4. The nozzle plate of claim 1, wherein the ink-repellent coating layer is formed of perfluorinated silane.
5. A method of manufacturing a nozzle plate for an inkjet head, the method comprising:
preparing a silicon substrate having a nozzle;
forming a thermally oxidized silicon layer on an outer surface of the silicon substrate and an inner wall of the nozzle by thermally oxidizing the silicon substrate;
forming an adhesion layer using an evaporation process on the thermally oxidized silicon layer formed on the outer surface of the silicon substrate, the adhesion layer formed of silicon oxide; and
forming an ink-repellent coating layer on the adhesion layer;
wherein a densely packed siloxane network is formed at an interface between the adhesion layer and the ink-repellent coating layer.
6. The method of claim 5, wherein the adhesion layer is formed using a physical vapor deposition (PVD) process.
7. The method of claim 6, wherein the PVD process is an electron beam evaporation process.
8. The method of claim 5, wherein the surface of the adhesion layer on which the ink-repellent coating layer is formed has an RMS roughness of about 0.5 to 2 nm.
9. The method of claim 5, wherein the ink-repellent coating layer is formed of perfluorinated silane.
10. The method of claim 9, wherein the ink-repellent coating layer is formed using a PVD process.
11. The method of claim 10, wherein the PVD process is an electron beam evaporation process or a thermal evaporation process.
12. An inkjet head, comprising:
a nozzle plate to form a manifold, an ink chamber, and a nozzle;
an ink-philic layer formed on an outer surface of the nozzle plate and an inner wall of the nozzle;
an adhesion layer deposited on the ink-philic layer; and
an ink-repellent coating layer deposited on the adhesion layer;
wherein a densely packed siloxane network is formed at an interface between the adhesion layer and the ink-repellent coating layer.
13. The inkjet head of claim 12, wherein the ink-philic layer comprises a thermally oxidized silicon layer.
14. The inkjet head of claim 12, wherein the ink phillic layer has a first surface roughness, and the adhesion layer has a second surface roughness higher than the first surface roughness.
15. The inkjet head of claim 12, wherein:
the ink-phillic layer has a first surface roughness; and
the adhesion layer comprises a first sub-surface formed on the ink-philic layer and having a first sub-surface roughness corresponding to the first surface roughness, and a second sub-surface having a second surface roughness.
16. The inkjet head of claim 15, wherein: the ink-repellent coating layer comprises a third sub-surface corresponding to the second sub-surface of the adhesion layer, and a fourth sub-surface having a third surface roughness.
17. The inkjet head of claim 12, wherein the adhesion layer comprises a silicon oxide layer.
18. The inkjet head of claim 12, wherein the ink-repellent coating layer has a third surface roughness corresponding to a second surface roughness.