1461160656-34ac7fd4-d201-4e92-a32d-b5a9c56cc9be

1. A method for monitoring an analog data signal, said method comprising the steps of:
receiving said analog data signal;
bandpass filtering said analog data signal over one or more frequency ranges to produce corresponding one or more bandpass filtered analog data signals;
rectifying said one or more bandpass filtered analog data signals to produce corresponding one or more rectified bandpass filtered analog data signals;
integrating said one or more rectified bandpass filtered analog data signals to produce corresponding one or more integrated bandpass filtered analog data signals; and
processing said one or more integrated bandpass filtered analog data signals.
2. The method of claim 1, wherein the step of processing comprises at least one of:
triggering at least one event when said one or more integrated bandpass filtered analog data signals meets at least one trigger criteria;
converting at least one of said one or more integrated bandpass filtered analog data signals to a digital data signal comprising at least one digital data value; or
assessing said one or more integrated bandpass filtered analog data signals relative to a determined normal integrated bandpass filtered analog data signal behavior.
3. The method of claim 2, further comprising the step of:
storing said at least one digital data value in a memory.
4. The method of claim 3, further comprising the step of:
time stamping said at least one digital data value.
5. The method of claim 1, further comprising the step of:
conditioning said analog data signal prior to the step of bandpass filtering.
6. The method of claim 1, wherein said analog data signal is received from a sensor.
7. The method of claim 1, further comprising:
varying at least one of the ranges of the one or more frequency ranges in accordance with at least one rule corresponding to at least one of an acceptable integrated bandpass filtered analog data signal or an unacceptable integrated bandpass filtered analog data signal.
8. The method of claim 2, wherein said normal integrated bandpass filtered analog data signal behavior corresponds to at least one of a minimum integrated bandpass filtered analog data measurement, a maximum integrated bandpass filtered analog data measurement, an average integrated bandpass filtered analog data measurement, a mean average integrated bandpass filtered analog data measurement, or a standard deviation of integrated bandpass filtered analog data measurements
9. A system for monitoring an analog data signal comprising:
a bandpass filter circuit that receives said analog data signal and produces a bandpass filtered analog data signal corresponding to a frequency range of interest;
a rectifier circuit that rectifies said bandpass filtered analog data signal to produce a rectified bandpass filtered analog data signal;
an integrator circuit that integrates said rectified bandpass filtered analog data signal to produce an integrated bandpass filtered analog data signal; and
a processing circuit that processes said integrated bandpass filtered analog data signal.
10. The system of claim 9, further comprising at least one of:
a trigger circuit that triggers at least one event when said integrated bandpass filtered analog data signal meets at least one trigger criteria; or
an analog-to-digital converter circuit that converts said integrated bandpass filtered analog data signal to a digital data signal comprising at least one digital data value.
11. The system of claim 10, further comprising:
a memory for storing said at least one digital data value in a memory.
12. The system of claim 11, further comprising:
a clock used for time stamping said at least one digital data value.
13. The system of claim 9, further comprising:
a conditioning circuit for conditioned said analog signal, said analog signal being output to said bandpass filter circuit.
14. The system of claim 9, further comprising:
a sensor that produces said analog data signal.
15. The system of claim 9, wherein said integrator circuit comprises one of a leaky integrator circuit or a resettable integrator circuit.
16. The system of claim 9, wherein said system monitors an analog signal representing a parameter relating to at least one of a munitions, a cargo, a crate, a container, a person, a crowd, a sporting facility, a theme park, a concert facility, a parade route, a coliseum, a traffic, a vehicle, an object within a monitored area, a power plant, an airport, a water treatment plant, a pipeline, a power line, a prisoner, a feedstock yard, a pasture, a poultry facility, a swine facility, an animal, an unmanned ground sensor, a bridge, a moving part, a wheel, a gear, an engine part, a fan motor, a rotor, a drilling platform, a well, a biological condition, a ballast, a farm crop, an amusement park ride, a building structure, a frame, an infrastructure, a sound, a storm, a levee, a dam, an environmental characteristic, a restricted area, a prison, a ground moisture, a presence of chemicals in the ground, a ground temperature, a nuclear weapon, a biological weapon, or a chemical weapon.
17. The system of claim 9, further comprising:
a sealed housing.
18. The system of claim 9, further comprising:
an interface to a communications link.
19. A method of monitoring an analog data signal, said method comprising the steps of:
receiving from a sensor said analog data signal;
bandpass filtering said analog data signal;
integrating said bandpass filtered analog data signal; and
processing said integrated bandpass filtered analog data signal.
20. The method of claim 19, wherein the step of processing comprises at least one of:
triggering at least one event when said integrated bandpass filtered analog data signal meets at least one trigger criteria;
converting said integrated bandpass filtered analog data signal to a digital data signal comprising at least one digital data value; or
assessing said integrated bandpass filtered analog data signal relative to a determined normal integrated bandpass filtered analog data signal behavior.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A nozzle plate usable in an inkjet head, the nozzle plate comprising:
a silicon substrate having a nozzle;
a thermally oxidized silicon layer formed on an outer surface of the silicon substrate and an inner wall of the nozzle;
an adhesion layer deposited on the thermally oxidized silicon layer formed on the outer surface of the silicon substrate, and formed of silicon oxide; and
an ink-repellent coating layer deposited on the adhesion layer;
wherein a densely packed siloxane network is formed at an interface between the adhesion layer and the ink-repellent coating layer.
2. The nozzle plate of claim 1, wherein a surface of the adhesion layer on which the ink-repellent coating layer is formed has a root mean square (RMS) roughness of about 0.5 to 2 nm.
3. The nozzle plate of claim 1, wherein the adhesion layer is formed using an electron-beam evaporation process.
4. The nozzle plate of claim 1, wherein the ink-repellent coating layer is formed of perfluorinated silane.
5. A method of manufacturing a nozzle plate for an inkjet head, the method comprising:
preparing a silicon substrate having a nozzle;
forming a thermally oxidized silicon layer on an outer surface of the silicon substrate and an inner wall of the nozzle by thermally oxidizing the silicon substrate;
forming an adhesion layer using an evaporation process on the thermally oxidized silicon layer formed on the outer surface of the silicon substrate, the adhesion layer formed of silicon oxide; and
forming an ink-repellent coating layer on the adhesion layer;
wherein a densely packed siloxane network is formed at an interface between the adhesion layer and the ink-repellent coating layer.
6. The method of claim 5, wherein the adhesion layer is formed using a physical vapor deposition (PVD) process.
7. The method of claim 6, wherein the PVD process is an electron beam evaporation process.
8. The method of claim 5, wherein the surface of the adhesion layer on which the ink-repellent coating layer is formed has an RMS roughness of about 0.5 to 2 nm.
9. The method of claim 5, wherein the ink-repellent coating layer is formed of perfluorinated silane.
10. The method of claim 9, wherein the ink-repellent coating layer is formed using a PVD process.
11. The method of claim 10, wherein the PVD process is an electron beam evaporation process or a thermal evaporation process.
12. An inkjet head, comprising:
a nozzle plate to form a manifold, an ink chamber, and a nozzle;
an ink-philic layer formed on an outer surface of the nozzle plate and an inner wall of the nozzle;
an adhesion layer deposited on the ink-philic layer; and
an ink-repellent coating layer deposited on the adhesion layer;
wherein a densely packed siloxane network is formed at an interface between the adhesion layer and the ink-repellent coating layer.
13. The inkjet head of claim 12, wherein the ink-philic layer comprises a thermally oxidized silicon layer.
14. The inkjet head of claim 12, wherein the ink phillic layer has a first surface roughness, and the adhesion layer has a second surface roughness higher than the first surface roughness.
15. The inkjet head of claim 12, wherein:
the ink-phillic layer has a first surface roughness; and
the adhesion layer comprises a first sub-surface formed on the ink-philic layer and having a first sub-surface roughness corresponding to the first surface roughness, and a second sub-surface having a second surface roughness.
16. The inkjet head of claim 15, wherein: the ink-repellent coating layer comprises a third sub-surface corresponding to the second sub-surface of the adhesion layer, and a fourth sub-surface having a third surface roughness.
17. The inkjet head of claim 12, wherein the adhesion layer comprises a silicon oxide layer.
18. The inkjet head of claim 12, wherein the ink-repellent coating layer has a third surface roughness corresponding to a second surface roughness.

1461160645-b977825e-5663-450a-8314-11aef6beeee8

1-7. (canceled)
8. A roll machine for the pressure treatment of granular material, having rolls which are mounted rotatably in bearing housings, are driven in opposite directions and are separated from one another by a roll nip, the bearing housings being mounted with their lower and upper sides on sliding tracks of machine brackets, with the use of hydraulic cylinders for pressing one roll against the opposite rolls via the material which is situated in the roll nip, comprising:
two roll pairs having in each case one roll nip being mounted next to one another on the sliding tracks of the machine brackets;
two material feeding chutes which are connected to a common material inlet via a material flow divider being arranged above the roll nips of the two roll pairs; and
material discharge chutes being arranged below the roll nips of the two roll pairs are guided to one of a common material discharge device or to material inlet openings of two separator devices.
9. A roll machine according to claim 8, wherein the two roll pairs are arranged back-to-back such that two of the rolls are arranged on the inside and two of the rolls are arranged on the outside, such that the two rolls which lie on the inside and face one another are configured as a fixed roll, while the two rolls which lie on the outside are configured as floating rolls which can be moved transversely with respect to the respective roll nip.
10. A roll machine according to claim 9, wherein hydraulic cylinders which can be pressed onto the bearing housings of the two floating rolls are supported on side parts of the machine frame.
11. A roll machine according to claim 10, wherein the hydraulic cylinders are arranged in such a way that per roll nip, they act in each case both on bearing housings of one roll and on the bearing housings which lie opposite in each case of the respectively other roll, with the formation of a self-contained system of milling pressing forces without a closed machine frame which is loaded by the radial roll pressing forces.
12. A roll machine according to claim 8, including a vertical central dividing wall arranged between the two roll pairs, the two roll pairs lying symmetrically on both sides of said dividing wall.
13. A roll machine according to claim 8, wherein the two roll pairs are arranged back-to-back such that two of the rolls are arranged on the inside and two of the rolls are arranged on the outside, and an expansion of the roll nip for each of the two roll pairs takes place to the outside towards the corresponding sides transversely with respect to the respective roll nip.
14. A roll machine according to claim 8 including two separator devices arranged below the two roll pairs which are static cascade separators, through which separating air flows and which deagglomerate and separate roller-press material scabs.
15. A roll machine according to claim 14, including a dynamic rod-cage separator with a rotating rod cage arranged to adjoin each of the two static cascade separators.
16. A roll machine for the pressure treatment of granular material, comprising:
rolls mounted rotatably in bearing housings,
the rolls being driven in opposite directions by a motor,
the rolls being separated from one another by a roll nip,
the bearing housings being mounted with lower and upper sides on sliding tracks of machine brackets,
hydraulic cylinders arranged to press one roll against an opposite roll via the granular material which is situated in the roll nip,
the rolls comprising two roll pairs, each pair having one roll nip, the two pairs of rolls being mounted next to one another on the sliding tracks of the machine brackets;
two material feeding chutes connected to a common material inlet via a material flow divider being arranged above the roll nips of the two roll pairs; and
material discharge chutes being arranged below the roll nips of the two roll pairs to guide discharge material to one of a common material discharge device or material inlet openings of two separator devices.
17. A roll machine according to claim 16, wherein the two roll pairs are arranged back-to-back such that two of the rolls are arranged on the inside and two of the rolls are arranged on the outside, such that the two rolls which lie on the inside and face one another are configured as fixed rolls, while the two rolls which lie on the outside are configured as floating rolls which can be moved transversely with respect to the respective roll nip.
18. A roll machine according to claim 17, wherein hydraulic cylinders are supported on side parts of the machine frame to press onto the bearing housings of the two floating rolls.
19. A roll machine according to claim 18, wherein the hydraulic cylinders are arranged in such a way that, per roll nip, they act in each case both on bearing housings of one roll and on the bearing housings which lie opposite in each case of the respectively other roll, with the formation of a self-contained system of milling pressing forces without a closed machine frame which is loaded by the radial roll pressing forces.
20. A roll machine according to claim 16, including a vertical central dividing wall arranged between the two roll pairs, the two roll pairs lying symmetrically on both sides of said dividing wall.
21. A roll machine according to claim 16, wherein the two roll pairs are arranged back-to-back such that two of the rolls are arranged on the inside and two of the rolls are arranged on the outside, and an expansion of the roll nip for each of the two roll pairs takes place to the outside towards the corresponding sides transversely with respect to the respective roll nip.
22. A roll machine according to claim 16 including two separator devices arranged below the two roll pairs which are static cascade separators, through which separating air flows and which deagglomerate and separate roller-press material scabs.
23. A roll machine according to claim 22, including a dynamic rod-cage separator with a rotating rod cage arranged to adjoin each of the two static cascade separators.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of producing a barrier film comprising at least one organic layer and two or more inorganic layers on a surface of a plastic film comprising the steps of:
forming an organic layer of photosensitive resin by applying a photosensitive resin composition comprising an acrylate compound in wet method on at least one surface of the plastic film, under a pressure of 0.3 atmosphere or more but 1.1 atmosphere or less (1 atmosphere being 1.01325\xd7105 Pa);
after the forming step, applying an inorganic layer coating liquid comprising a silazane compound on the organic layer, to laminate 2-6 inorganic layers, under a pressure of 0.3 atmosphere or more but 1.1 atmosphere or less; and
carrying out a conversion treatment on at least two layers among the laminated inorganic layers.
2. The method of claim 1, wherein forming the organic layer and laminating the inorganic layers are carried out under a pressure of 0.8 atmosphere-1.1 atmosphere.
3. The method of claim 1, wherein the conversion treatment applied to the inorganic layers is a plasma treatment.
4. The method of claim 1, wherein the conversion treatment applied to the inorganic layers is irradiation of vacuum ultraviolet light.
5. The method of claim 1, wherein a sum of a number of the organic layer and a number of the inorganic layers is 3 or more but 7 or less.
6. A barrier film produced by the method of claim 1.
7. The method of claim 1, wherein the conversion treatment applied to the inorganic layers is irradiation of vacuum ultraviolet light.
8. The method of claim 1, wherein a bleedout preventing layer is provided on the surface of the plastic film opposite to the surface on which the organic layer is provided.
9. The method of claim 1, wherein a corona treatment is conducted on the plastic film before providing an organic film or an inorganic film.
10. The method of claim 1, wherein the barrier film has a layer constitution of:
Organic layerInorganic layerInorganic layer, formed on the plastic layer.
11. The method of claim 1, wherein the barrier film has a layer constitution of:
Organic layerInorganic layerInorganic layerInorganic layer, formed on the plastic layer.
12. The method of claim 1, wherein the barrier film has a layer constitution of:
Organic layerInorganic layerOrganic layerInorganic layer, formed on the plastic layer.
13. An organic photoelectric conversion element sealed by employing the barrier film of claim 6.