Author: claimsbot

1. A dual-band antenna, comprising:
a substrate;
an inverted F antenna printed circuit supported by said substrate and tuned to resonate in a first frequency band, said inverted F antenna having a ground plane and a radiator located on one plane of said substrate; and
a monopole antenna printed circuit supported by said substrate and located on a different plane than said ground plane, said monopole antenna printed circuit tuned to resonate in a second frequency band.
2. The antenna as recited in claim 1 further comprising a feed line located on an other plane of said substrate from said radiator.
3. The antenna as recited in claim 2 further comprising a conductive interconnection coupling said feed line to said radiator.
4. The antenna as recited in claim 1 wherein said radiator has multiple portions with a first portion located on said one plane and a second portion located on a different plane from said one plane.
5. The antenna as recited in claim 1 wherein said ground plane is coupled to and spaced apart from said radiator of said inverted F antenna printed circuit and said monopole antenna printed circuit.
6. The antenna as recited in claim 1 wherein said monopole antenna printed circuit comprises first and second traces tuned to differing resonance in said second frequency band.
7. The antenna as recited in claim 5 wherein a footprint of a radiator of said inverted F antenna printed circuit lies between footprints of said first and second traces.
8. A wireless networking card, comprising:
wireless networking circuitry;
a dual-band transceiver coupled to said wireless networking circuitry; and
a dual-band antenna coupled to said dual-band transceiver and including:
a substrate;
an inverted F antenna printed circuit supported by said substrate and tuned to resonate in a first frequency band, said inverted F antenna having a ground plane and a radiator located on one plane of said substrate; and
a monopole antenna printed circuit supported by said substrate and located on a different plane than said ground plane, said monopole antenna printed circuit tuned to resonate in a second frequency band.
9. The wireless networking card as recited in claim 8 further comprising a feed line located on an other plane of said substrate from said radiator.
10. The wireless networking card as recited in claim 9 further comprising a conductive interconnection coupling said feed line to said radiator.
11. The wireless networking card as recited in claim 8 wherein said radiator has multiple portions with a first portion located on said one plane and a second portion located on a different plane from said one plane.
12. The wireless networking card as recited in claim 8 wherein said monopole antenna printed circuit comprises first and second traces tuned to differing resonance in said second frequency band.
13. The wireless networking card as recited in claim 12 wherein said first trace is directly coupled to said second trace.
14. The wireless networking card as recited in claim 12 wherein a footprint of said radiator lies between footprints of said first and second traces.
15. The wireless networking card as recited in claim 8 further comprising a second dual-band antenna coupled to said dual-band transceiver.
16. The wireless networking card as recited in claim 15 further comprising a switch that selectively connects one of said first dual-band antenna and said second dual-band antenna to said dual-band transceiver and connects another of said first dual-band antenna and said second dual-band antenna to ground.
17. A method of manufacturing a dual-band antenna, comprising:
forming an inverted F antenna printed circuit on a substrate, said inverted F antenna printed circuit tuned to resonate in a first frequency band and having a ground plane and a radiator located on one plane of said substrate; and
forming a monopole antenna printed circuit on said substrate and on a different plane than said ground plane, said monopole antenna printed circuit tuned to resonate in a second frequency band.
18. The method as recited in claim 17 further comprising forming a feed line on an other plane of said substrate from said radiator and coupling said monopole antenna printed circuit to said feed line.
19. The method as recited in claim 17 further comprising forming a feed line on an other plane of said substrate and forming a conductive interconnection to couple said feed line to said radiator.
20. The method as recited in claim 17 wherein said radiator has multiple portions with a first portion formed on said one plane and a second portion formed on a different plane from said one plane.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A test instrument probe, comprising:
a probe body housing a conductive member, wherein at least a portion of said conductive member defines an electrically conductive probe tip; and
a voltage detector being mounted on the probe body, said voltage detector having means for detecting a voltage, and a voltage indicator responsive to said detected voltage.
2. A test instrument probe in accordance with claim 1 wherein said means for detecting a voltage is a sensing element coupled to a detector circuit, said sensing element electrically insulated from said conductive member.
3. A test instrument probe in accordance with claim 2 wherein said sensing element is disposed adjacent said electrically conductive probe tip and insulated therefrom.
4. A test instrument probe in accordance with claim 1 wherein said means for detecting a voltage is an electrically conductive contacting tip coupled to a detector circuit.
5. A test instrument probe in accordance with claim 4 wherein said electrically conductive contacting tip is electrically connected to said electrically conductive probe tip.
6. A combined test instrument probe and voltage detector, comprising:
an elongated probe body having a longitudinal axis;
a conductive member disposed along said longitudinal axis, wherein at least a portion of said conductive member extends from said probe body to define an electrically conductive probe tip; and
a voltage detector disposed in juxtaposition with said conductive member, said voltage detector including means for detecting a voltage, and a voltage indicator responsive to said detected voltage.
7. A combined test instrument probe and voltage detector in accordance with claim 6 wherein said means for detecting a voltage is a sensing element coupled to a detector circuit, said sensing element electrically insulated from said conductive member.
8. A combined test instrument probe and voltage detector in accordance with claim 7 wherein said sensing element is disposed adjacent said electrically conductive probe tip and insulated therefrom.
9. A combined test instrument probe and voltage detector in accordance with claim 8 wherein said means for detecting a voltage is an electrically conductive contacting tip coupled to a detector circuit.
10. A combined test instrument probe and voltage detector in accordance with claim 6 wherein said electrically conductive contacting tip is electrically connected to said electrically conductive probe tip.
11. A voltage detector adapted for mounting on a test instrument probe, comprising:
a voltage detector circuit, a voltage indicator responsive to detected voltage, and a battery for providing operating power to said detector circuit and said indicator mounted within an insulative housing; and
a mounting medium on said housing for mounting said voltage detector on said test instrument probe.
12. A voltage detector adapted for mounting on a test instrument probe in accordance with claim 11 wherein said mounting medium comprises at least one annular member for grasping said test instrument probe.
13. A voltage detector in accordance with claim 12 wherein said at least one annular member comprises a partial ring formed of a pair of flexible members.
14. A voltage detector in accordance with claim 11 wherein said mounting medium comprises an adhesive medium.
15. A voltage detector in accordance with claim 11, wherein said voltage detector is a non-contact detector.
16. A voltage detector in accordance with claim 11, wherein said voltage detector is adapted for mounting adjacent a contact portion of the test instrument probe.
17. A test instrument probe in accordance with claim 1, wherein said voltage detector is a non-contact detector.
18. A test instrument probe in accordance with claim 1, wherein said voltage detector is adapted for mounting adjacent said electrically conductive probe tip.
19. A combined test instrument probe and voltage detector in accordance with claim 6, wherein said voltage detector is a non-contact detector.
20. A combined test instrument probe and voltage detector in accordance with claim 6, wherein said voltage detector is adapted for mounting adjacent said electrically conductive probe tip.

1. A molded lens for use in an optical pickup device, said molded lens comprising:
(a) a plane of incidence including a first optical surface;
(b) a plane of emergence including a second optical surface provided on an opposite side of the molded lens with respect to the plane of incidence; and
(c) an outer circumference surface having a shape formed by: (i) a first straight line portion which is substantially parallel to a plane including an optical axis of the molded lens, (ii) a second straight line portion which is substantially parallel with the first straight line portion and is symmetric with the first straight line portion about the plane including the optical axis of the molded lens, and (iii) two circular arcs each connecting end portions of the first and second straight line portions;
wherein a flash projects from a side of at least one of the two circular arc portions at at least one position apart from a point of intersection where a straight line that perpendicularly crosses the optical axis and that is parallel to the first and second straight line portions intersects the corresponding circular arc portion, and wherein the flash does not project past a line that is tangent to the corresponding circular arc portion at the point of intersection.
2. The molded lens of claim 1, wherein a length of the flash in a direction of the optical axis is not more than 0.03 mm.
3. The molded lens of claim 1, wherein the flash is formed on one side of the at least one the circular arc portion with respect to the point of intersection.
4. A molding die for molding the molded lens according to in claim 1, said molding die comprising:
(a) a first molding die for molding a portion of the molded lens including the plane of incidence thereof; and
(b) a second molding die for molding a portion of the molded lens including the plane of emergence thereof;
wherein an air vent port is formed in one of the first molding die and the second molding die.
5. A molded lens for an optical pickup device, comprising:
(a) a plane of incidence including a first optical surface;
(b) a plane of emergence including a second optical surface provided on an opposite side of the molded lens with respect to the plane of incidence; and
(c) a flange portion at a periphery of the plane of incidence and a periphery of the plane of emergence;
wherein a reference surface for positioning the molded lens is formed by one of: a surface of the flange portion on a side of the plane of incidence and a surface of the flange portion on a side of the plane of emergence, and wherein the reference surface projects from a corresponding one of the plane of incidence and the plane of emergence in an optical axis direction of the molded lens;
wherein a flash projects from the molded lens from the side of the one of the plane of incidence and the plane of emergence corresponding to the reference surface, said flash being generated between a sleeve and a core of a molding die for forming the molded lens, and said core staying in contact with the molded lens after injection molding and being movable with respect to the sleeve to push the molded lens out of the molding die; and
wherein the reference surface projects farther in the optical axis direction than the flash.
6. A molding die for molded lens for molding the molded lens described in claim 5, comprising:
(a) a first molding die for molding a portion of the molded lens including the plane of incidence thereof; and
(b) a second molding die for molding a portion of the molded lens including the plane of emergence thereof;
wherein one of the first molding die and the second molding die comprises the sleeve and the core.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1: A method of providing recovery in a computer system, comprising:
intercepting events comprising at least one of a plurality of method calls, component activations, and component deactivations;
logging the events during execution of stateful piece-wise deterministic (PWD) components having a component state;
detecting a failure of one of the components based on an error detected during execution; and
replaying the logged events to transparently and automatically recover the component state.
2: The method of claim 1, further comprising:
intercepting non-deterministic events;
providing a policy mechanism that, upon interception of the events, permits the logging of the intercepted events;
providing an error handler that is invoked when an error is detected, such error handler being capable of masking the error from the component.
3: The method of claim 1, further comprising:
logging information about how the component is mapped to a first set of resources such that the component can be re-mapped to a different set of resources should a system failure result in a termination of the first set of resources, said re-mapping enabling scalability and load balancing.
4: The method of claim 3, wherein the information includes a logical identifier for the component that identifies logged state information for the component.
5: The method of claim 1, further comprising exactly-once execution comprising:
uniquely identifying messages at a sender;
detecting an original message and at least one duplicate message at a receiver;
eliminating the at least one duplicate message; and
providing a reply to the at least one duplicate message that is the same as a reply to the original message.
6: The method of claim 1, further comprising:
notifying an error handler when the error is detected;
contacting a recovery manager to recover the component that has failed;
re-trying an interaction that failed at the time of the failure; and
returning the result of the re-tried interaction to the component.
7 (Cancelled)
8: The method of claim 1, further comprising:
retrieving information related to the failed call; and
identifying the component based on the retrieved information.
9: The method of claim 1, further comprising:
updating references to the component with an interface pointer corresponding to the component; and
logging the recovery of the component.
10: The method of claim 1, further comprising verifying that the component state has not already been recovered prior to recovering the component state.
11: The method of claim 1, further comprising intercepting the method call and response, and invoking a policy on at least one of the call and the response.
12: The method of claim 1, wherein the computer system comprises a client and a server, and detecting the failure of the component comprises the client or server detecting the failure, and further comprising a component runtime associated with the client invoking an error handler associated with the client and providing information related to the failed call to the error handler.
13: The method of claim 12, further comprising identifying a recovery manager responsible for the component and passing the information to the recovery manager.
14 (Cancelled)
15: A system for providing recovery in a computer system, comprising:
a storage device that logs events comprising at least one of a plurality of method calls, component activations, and component deactivations during execution of stateful piece-wise deterministic (PWD) components having a component state;
a component runtime that receives the events from the storage device;
a error handler that receives the events from the component runtime and identifies the component based on the events; and
a recovery manager that receives the events from the storage device and replays the events to transparently and automatically recover the component state.
16: The system of claim 15, wherein the error handler is notified of an error and contacts the recovery manager to recover the component state.
17: The system of claim 15, wherein the recovery manager logs the recovery of the component state in the storage device, verifies that the component state has not already been recovered prior to recovering the component state, and communicates to the error handler additional information about the component.
18: The system of claim 15, wherein the component runtime intercepts the at least one method call and invokes a policy on the at least one method call.
19: The system of claim 15, further comprising an activation hook that logs information in the storage device that is sufficient to re-create the component.
20-23 (Cancelled)
24: A computer readable medium having computer-executable instructions for performing the steps comprising:
intercepting events comprising at least one of a plurality of method calls, component activations, and component deactivations;
logging the events during execution of at least one stateful piece-wise deterministic (PWD) component having a component state in a computer system;
detecting a failure of one of the components based on an error detected during execution; and
replaying the logged events to transparently and automatically recover the component state.
25: The computer readable medium of claim 24, having further computer-executable instructions for:
intercepting non-deterministic events;
providing a policy mechanism that, upon interception of the events, permits the logging of the intercepted events;
providing an error handler that is invoked when an error is detected, such error handler being capable of masking the error from the component.
26: The computer readable medium of claim 24, having further computer-executable instructions for:
logging information about how the component is mapped to a first set of resources such that the component can be re-mapped to a different set of resources should a system failure result in a termination of the first set of resources, said re-mapping enabling scalability and load balancing.
27: The computer readable medium of claim 26, wherein the information includes a logical identifier for the component that identifies logged state information for the component.
28: The computer readable medium of claim 24, having further computer-executable instructions for providing exactly-once execution comprising:
uniquely identifying messages at a sender;
detecting an original message and at least one duplicate message at a receiver;
eliminating the at least one duplicate message; and
providing a reply to the at least one duplicate message that is the same as a reply to the original message.
29: The computer readable medium of claim 24, having further computer-executable instructions for:
notifying an error handler when the error is detected;
contacting a recovery manager to recover the component that has failed;
re-trying an interaction that failed at the time of the failure; and
returning the result of the re-tried interaction to the component.
30 (Cancelled)
31: The computer readable medium of claim 24, having further computer-executable instructions for:
retrieving information related to the failed call; and
identifying the component based on the retrieved information.
32: The computer readable medium of claim 24, having further computer-executable instructions for:
updating references to the component with an interface pointer corresponding to the component; and
logging the recovery of the component.
33: The computer readable medium of claim 24, having further computer-executable instructions for verifying that the component state has not already been recovered prior to recovering the component state.