1. A method for making a shielding member, the method comprising:
providing a metal plate; and
making the shielding member from the metal plate by stamping; wherein the shielding member comprises two shielding plates connected with each other, each shielding plate comprises a base portion, a first extending portion, a second extending portion and at least one third extending portion; the first extending portion and the second extending portion extend from opposite ends of the base portion; the at least one third extending portion extends from the base portion and is positioned between the first extending portion and the second extending portion; the first to third extending portions of one shielding plate are located in alternate positions relative the first to third extending portions of the other shielding plate; a plurality of finger pieces are located on the first to third extending portions of each shielding plate.
2. The method of claim 1, wherein extending directions of the first to third extending portions of each shielding plate are the same.
3. The method of claim 2, wherein the extending directions of the first to third extending portions of each shielding plate are perpendicular to the base portion thereof.
4. The method of claim 3, wherein the extending directions of the first to third extending portions of the one shielding plate reverse to the extending directions of the first to third extending portions of the other shielding plate.
5. The method of claim 1, wherein a plurality of connecting pieces are located between the shielding plates so as to connect the shielding plates with each other.
6. The method of claim 5, furthering comprising: separating the shielding plates from each other by breaking of the connecting pieces.
7. The method of claim 1, wherein a first bent piece with a first through hole is bent from the first extending portion of each shielding plate.
8. The method of claim 1, wherein a second bent piece with a cutout is bent from the second extending portion of each shielding plate.
9. The method of claim 1, wherein a third bent piece with a third through hole is bent from the third extending portion of each shielding plate.
10. The method of claim 1, furthering comprising: separating the shielding plates from each other.
11. A method for making a shielding plate, the method comprising:
providing a plate made of Electro-Magnetic-Interference-proof material;
forming two shielding plates integrated with each other from the plate; wherein each shielding plate comprises a base portion, a first extending portion, a second extending portion and at least one third extending portion; the first extending portion and the second extending portion extends from opposite ends of the base portion; the at least one third extending portion extends from the base portion and is positioned between the first extending portion and the second extending portion; a plurality of connecting pieces that connect the first to third extending portions of one shielding plate with the third to first extending portions of another shielding plate, and a first bent piece with a first through hole is bent from the first extending portion of each of the shielding plates; and
separating the two shielding plates from each other by breaking off the connecting pieces.
12. The method of claim 11, wherein extending directions of the first to third extending portions of each of the two shielding plates are same.
13. The method of claim 11, wherein the extending directions of the first to third extending portions are perpendicular to the base portion.
14. The method of claim 11, wherein a plurality of finger pieces are located on the first to third extending portions of each of the two shielding plates.
15. The method of claim 11, wherein a second bent piece with a cutout is bent from the second extending portion of each of the shielding plates.
16. The method of claim 11, wherein a third bent piece with a third through hole is bent from the third extending portion of each of the shielding plates.
17. The method of claim 11, wherein the first to third extending portions of the one shielding plate are located in alternate positions relative the first to third extending portions of the another shielding plate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A surface mount module adapted for transfer of a microwave signal between the surface mount module and a motherboard, the surface mount module comprising:
a substrate;
a first microstrip conductor on a first side of the substrate; and
a second microstrip conductor on a second, opposite side of the substrate,
wherein the first microstrip conductor and the second microstrip conductor are connected with a connection through the surface mount module,
wherein the connection comprises the first microstrip conductor being connected to a first foil of electrically conducting material coated on the first side of the substrate,
wherein the first foil comprises an approximately rectangular shape having first, second, third, and fourth sides, wherein the first and third sides are opposite one another, and the first microstrip conductor is in direct contact with the first foil,
wherein the first foil is surrounded by electrically conducting trenches running through the substrate from the first side to the second side of the substrate forming a substrate integrated waveguide,
wherein the trenches on the second side surround a second foil of electrically conducting material coated on the second side of the substrate and connected to the second microstrip conductor, and
wherein the second foil comprises the approximately rectangular shape having first, second, third, and fourth sides, wherein the first and third sides are opposite one another, and the second microstrip conductor is in direct contact with the second foil, and
wherein the trenches are located only along the first side and the third side of the first foil, wherein the first microstrip conductor is located at the second side of the first foil, and wherein the trenches are located only along the first side and the third side of the second foil, and wherein the second microstrip conductor is located at the second side of the second foil.
2. The surface mount module according to claim 1, wherein the second conductor is adapted to be connected to a conductor on the motherboard.
3. The surface mount module according to claim 1, wherein the trenches are a plurality of via-holes.
4. The surface mount module according to claim 1, wherein the module is a surface mount package.
5. The surface mount module according to claim 1, wherein the trenches comprise a plurality of via-holes, and wherein distances between each of the plurality of via-holes comprise one-eighth of a wavelength of a signal transferred in the surface mount module.
6. The surface mount module according to claim 1, wherein the first foil comprises a continuous piece of conducting material that extends between the first side, the second side, the third side, and the fourth side of the first foil, and wherein the second foil comprises another continuous piece of conducting material that extends between the first side, the second side, the third side, and the fourth side of the second foil.
7. A coupling arrangement comprising:
a motherboard; and
a surface mount module connected to the motherboard,
wherein the surface mount module comprises a substrate, a first microstrip conductor on a first side of the substrate, and a second microstrip conductor on a second, opposite side of the substrate,
wherein the first microstrip conductor and the second microstrip conductor are connected with a connection through the surface mount module,
wherein the connection comprises the first microstrip conductor being connected to a first foil of electrically conducting material coated on the first side of the substrate,
wherein the first foil comprises an approximately rectangular shape having first, second, third, and fourth sides, wherein the first and third sides are opposite one another, and the first microstrip conductor is in direct contact with the first foil,
wherein the first foil is surrounded by electrically conducting trenches running through the substrate from the first side to the second side of the substrate forming a substrate integrated waveguide,
wherein the trenches on the second side surround a second foil of electrically conducting material coated on the second side of the substrate and connected to the second microstrip conductor,
wherein the second foil comprises the approximately rectangular shape having first, second, third, and fourth sides, wherein the first and third sides are opposite one another, and the second microstrip conductor is in direct contact with the second foil,
wherein the motherboard comprises a substrate with a motherboard conductor,
wherein the second microstrip conductor of the surface mount module is connected to the motherboard conductor,
wherein a ground plane of the motherboard on an opposite side of the motherboard conductor is connected by a through connection to a ground patch on the same side as the motherboard conductor,
wherein the trenches are located only along the first side and the third side of the first foil, wherein the first microstrip conductor is located at the second side of the first foil, and wherein the trenches are located only along the first side and the third side of the second foil, and wherein the second microstrip conductor is located at the second side of the second foil, and
wherein the ground patch is connected with the trenches of the surface mount module.
8. The coupling arrangement according to claim 7, wherein the through connection is a plurality of via-holes.
9. The coupling arrangement according to claim 7, wherein the module is a surface mount package.
10. The coupling arrangement according to claim 7, wherein the trenches comprise a plurality of via-holes, and wherein distances between each of the plurality of via-holes comprise one-eighth of a wavelength of a signal transferred in the surface mount module.
11. The coupling arrangement according to claim 7, wherein the first foil comprises a continuous piece of conducting material that extends between the first side, the second side, the third side, and the fourth side of the first foil, and wherein the second foil comprises another continuous piece of conducting material that extends between the first side, the second side, the third side, and the fourth side of the second foil.
12. An apparatus comprising:
a motherboard; and
a surface mount module connected to the motherboard,
wherein the surface mount module comprises a substrate, a first microstrip conductor on a first side of the substrate, and a second microstrip conductor on a second, opposite side of the substrate,
wherein the first microstrip conductor and the second microstrip conductor are connected with a connection through the surface mount module,
wherein the connection comprises the first microstrip conductor being connected to a first foil of electrically conducting material coated on the first side of the substrate,
wherein the first foil comprises an approximately rectangular shape having first, second, third, and fourth sides, wherein the first and third sides are opposite one another, and the first microstrip conductor is in direct contact with the first foil,
wherein the first foil is surrounded by electrically conducting trenches running through the substrate from the first side to the second side of the substrate forming a substrate integrated waveguide,
wherein the trenches on the second side surround a second foil of electrically conducting material coated on the second side of the substrate and connected to the second microstrip conductor, and
wherein the second foil comprises the approximately rectangular shape having first, second, third, and fourth sides, wherein the first and third sides are opposite one another, and the second microstrip conductor is in direct contact with the second foil, and
wherein the trenches are located only along the first side and the third side of the first foil, wherein the first microstrip conductor is located at the second side of the first foil, and wherein the trenches are located only along the first side and the third side of the second foil, and wherein the second microstrip conductor is located at the second side of the second foil.
13. The apparatus according to claim 12, wherein the motherboard comprises a substrate with a motherboard conductor, wherein the second microstrip conductor of the surface mount module is connected to the motherboard conductor, wherein a ground plane of the motherboard on an opposite side of the motherboard conductor is connected by a through connection to a ground patch on the same side as the motherboard conductor, and wherein the ground patch is connected with the trenches of the surface mount module.
14. The apparatus according to claim 13, wherein the through connection is a plurality of via-holes.
15. The apparatus according to claim 12, wherein the module is a surface mount package.
16. The apparatus according to claim 12, wherein the trenches comprise a plurality of via-holes, and wherein distances between each of the plurality of via-holes comprise one-eighth of a wavelength of a signal transferred in the surface mount module.
17. The apparatus according to claim 12, wherein the first foil comprises a continuous piece of conducting material that extends between the first side, the second side, the third side, and the fourth side of the first foil, and wherein the second foil comprises another continuous piece of conducting material that extends between the first side, the second side, the third side, and the fourth side of the second foil.