Author: claimsbot

1. An exercise arm apparatus, the apparatus comprising:
an arm;
a pivot point;
a distal end of the arm rotatably attached to the pivot point, wherein the arm is configured to rotate around the pivot point;
a resistance disposed between the distal end and a proximate end of the arm, wherein the resistance is configured to act against movement of the arm, wherein the resistance is adjustable;
the arm further comprising a first aperture configured to admit a belt hook, wherein the arm further comprising a sloping portion that slopes relative to a horizontal surface;
the arm further comprising a second aperture disposed on the sloping portion and adapted to admit the belt hook, wherein the second aperture is at a different height than the first aperture relative to the horizontal surface;
a pair of bars configured to be grasped by an exerciser for stability, to perform chin-up exercises, dip exercises, squats, or any combination thereof;
the resistance is further configured to exert a force against the movement of the arm by an exerciser in a vertical direction;
a frame, wherein the pivot point is secured to the frame; and
the frame having a base elevated above the horizontal surface and configured to allow a portion of the arm to travel lower than the base when performing the exercises.
2. The exercise arm apparatus of claim 1, wherein a height of the pair of bars is adjustable relative to the horizontal surface accommodate differently sized exercisers.
3. A method of use for an exercise arm apparatus, the method comprising:
providing an arm having a distal end rotatably attached to a pivot point, wherein the arm is configured to rotate around the pivot point;
applying a resistance disposed between the distal end and a proximate end of the arm, wherein the resistance is configured to act against movement of the arm by an exerciser when performing exercises;
providing a plurality of apertures adapted to admit a belt hook, the plurality of apertures disposed on a sloping portion of the exercise arm, wherein each aperture of the plurality of apertures are at a different height relative to a horizontal surface; and
donning a belt by the exerciser, wherein the belt having a belt line suspended from the belt and a belt hook secured to a free end of the belt line;
engaging the belt hook into a selected aperture of the plurality of apertures; and
performing exercises against the resistance.
4. The method of use of an exercise arm apparatus of claim 3, wherein the resistance is adjustable.
5. The method of use of an exercise arm apparatus of claim 3, the method further comprising providing a pair of bars configured to be grasped by an exerciser for stability, to perform chin-up exercises, dip exercises, squats, or any combination thereof.
6. The method of use of an exercise arm apparatus of claim 3, further comprising adjusting a height of the pair of bars relative to the horizontal surface to accommodate differently sized exercisers.
7. The method of use of an exercise arm apparatus of claim 3, further comprising positioning the resistance to exert a force against the movement of the arm by the exerciser in a vertical direction.
8. The method of use of an exercise arm apparatus of claim 3, further comprising securing the pivot point to a frame.
9. The method of use of an exercise arm apparatus of claim 3, further comprising adjusting a height, width, or any combination thereof, of the pair of bars to accommodate the exerciser.
10. The method of use of an exercise arm apparatus of claim 3, the frame further comprising a base elevated above the horizontal surface to allow the proximate end of the arm to travel lower than the base when performing the exercises.
11. An exercise arm apparatus, the apparatus comprising:
an arm having a sloping portion that slopes relative to a horizontal surface;
a pivot point;
a distal end of the arm rotatably attached to the pivot point, wherein the arm is configured to rotate around the pivot point;
a first aperture disposed on the arm and configured to admit a belt hook;
a second aperture disposed on the sloping portion and adapted to admit the belt hook, wherein the second aperture is at a different height than the first aperture relative to the horizontal surface; and
a resistance disposed between the distal end and a proximate end of the arm, wherein the resistance is configured to act against movement of the arm.
12. An exercise arm apparatus, the apparatus comprising:
an arm having a sloping portion that slopes relative to a horizontal surface;
a pivot point;
a distal end of the arm rotatably attached to the pivot point, wherein the arm is configured to rotate around the pivot point;
an aperture disposed on a proximate end of the arm and configured to admit a belt hook; and
a resistance disposed between the distal end and the aperture, wherein the resistance is configured to act against movement of the arm.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

We claim:

1. A shock absorbing device comprising:
a first arm;
a second arm;
a mid-filler attachment having a hollow center wherein the first arm and the second arm are permanently affixed to the mid-filler attachment.
2. The shock of claim 1 further comprising:
a shock absorbing material affixed within the hollow center of the mid-filler attachment.
3. The shock of claim 2 wherein the shock absorbing material is formed into a shape selected from the group consisting of lotus root or loofah.
4. The shock of claim 1 further comprising:
an attachment means to allow for removal or attachment of the first arm to a car frame.
5. The shock of claim 1 further comprising:
an attachment means to allow for removal or attachment of the second arm to a bumper.
6. The shock of claim 5 further comprising:
a bumper.
7. A shock absorbing device comprising:
a frame arm;
at least one bumper arm;
an ohm-shaped mid-filler attachment having a hollow center wherein the frame arm and the bumper arm are permanently affixed to the ohm-shaped mid-filler attachment.
8. The device of claim 6 further comprising a shock-absorbing material placed within the hollow of the ohm mid-filler attachment.
9. The device of claim 7 wherein the ohm-shaped mid-filler attachment has
a portion of a radius of a circle that transitions into the at least one bumper arm; and,
an angle of about 10 to 120 degrees formed between the portion of a radius of a circle and the at least one bumper arm.
10. The device of claim 7 wherein the ohm-shaped mid-filler attachment has
a portion of a radius of a circle that transitions into the at least one bumper arm;
an outside angle of about 20 to 80 degrees to the at least one bumper arm; and,
an inside angle of about 50 to 120 degrees formed between the portion of a radius of a circle and the outside angle.
11. The device of claim 7 wherein the ohm-shaped mid-filler attachment has
a portion of a radius of an oval that transitions into the at least one bumper arm; and,
an angle of about 10 to 89 degrees formed between the portion of a radius of a circle and the at least one bumper arm.
12. A shock absorbing device comprising:
a frame arm;
at least one bumper arm;
a first ohm-shaped mid-filler attachment having a hollow center wherein the frame arm is permanently affixed to the ohm-shaped mid-filler attachment;
a second ohm-shaped mid-filler attachment having a hollow center and inverted with respect to the first ohm-shaped attachment and affixed to the first ohm-shaped mid filler attachment in a back-to-back position;
a cross span wherein the frame arm is permanently affixed to the cross span and to the second ohm-shaped mid-filler.
13. The device of claim 12 further comprising:
a shock absorbing material affixed within the hollow center of at least one of the ohm mid-filler attachments.
14. A shock absorbing device comprising:
at least one s-bumper arm comprising:
a first angle; and,
a second angle;

a frame arm permanently affixed to the s-bumper;
a top arm permanently affixed to the s-bumper.
15. The device of claim 14 further comprising:
a second s-bumper positioned parallel to the at least one s-bumper arm;
a cross piece attaching the top arm of the second s-bumper arm to the top arm of the at least one s-bumper arm, wherein the frame arm is connected to the top arm through the cross piece.
16. A shock absorbing device comprising:
at least one ohm mid-filler attachment having a hollow center;
a frame arm permanently affixed to the ohm mid-filler attachment;
at least one bumper arm;
at least one s-bumper attached to the ohm mid-filler attachment;
a frame arm permanently affixed to the s-bumper.
17. The device of claim 16 further comprising:
a cross span attached to two s-bumpers and permanently affixed to the frame arm.
18. A unitized shock absorbing device comprising:
a main body having an interior portion; and,
at least one midair pipe within the interior portion of the main body.
19. The device according to claim 18 further comprising:
a top connector affixed to the main body; and,
a bottom connector affixed to the main body and dimensioned to mechanically interlock with the top connector.
20. The device according to claim 18 further comprising:
a right connector affixed to the main body; and,
a left connector affixed to the main body and dimensioned to mechanically interlock with the top connector.
21. The device according to claim 19 further comprising:
a right connector affixed to the main body; and,
a left connector affixed to the main body and dimensioned to mechanically interlock with the top connector.
22. The device according to claim 18 wherein the main body is an extruded tube cut to a length.
23. The device according claim 19 wherein the midair pipe is cut to about the length of the main body.
24. The device according to claim 21 further comprising:
at least one additional unitized shock absorbing device wherein the right connector of at least one unitized shock absorbing device is mechanically interlocked with at least one left connector.
25. The device according to claim 21 further comprising:
at least one additional unitized shock absorbing device wherein the top connector of at least one unitized shock absorbing device is mechanically interlocked with at least one bottom connector.
26. The device according to claim 25 further comprising:
at least one additional unitized shock absorbing device wherein the top connector of at least one unitized shock absorbing device is mechanically interlocked with at least one bottom connector.
27. The device according to claim 21 further comprising:
a housing dimensioned to receive at least two unitized shock absorbing devices that are interlocked.
28. A method of making a unitized shock absorbing device comprising:
forming a main body having an interior portion and at least one pair of connectors dimensioned to mechanically interlock with each other;
cutting the main body into at least two pieces of a desired length;
providing a midair pipe with a length similar to that of the main body;
inserting the midair pipe into the interior portion.
29. The method of claim 28 further comprising:
interlocking the connectors of the two pieces of the main body;
providing a housing;
placing the interlocked connectors into the housing.
30. The method of claim 29 further comprising:
installing the housing into an automobile to absorb impact energy.
31. The method of claim 28 wherein the main body is formed through an extrusion process.

1. A semiconductor device comprising:
a first semiconductor layer disposed over and above a substrate;
a second semiconductor layer disposed over and above the first semiconductor layer;
a gate recess disposed, through removal of a part of or all the second semiconductor layer, in a predetermined region over and above the first semiconductor layer;
an insulating film disposed over the gate recess and the second semiconductor layer;
a gate electrode disposed over the gate recess with the insulating film therebetween; and
a source electrode and a drain electrode disposed over and above the first semiconductor layer or the second semiconductor layer,
whereby a central portion of the gate recess is higher than peripheral portions of the gate recess along each sidewall of the gate recess, and
a bottom of the gate recess is below a bottom surface of each of the source electrode and the drain electrode,
wherein in the bottom of the gate recess, the insulating film directly contacts the first semiconductor layer at the peripheral portions.
2. A semiconductor device comprising:
a first semiconductor layer disposed over a substrate;
a second semiconductor layer disposed over the first semiconductor layer;
a third semiconductor layer disposed over the second semiconductor layer;
a gate recess disposed, through removal of all the third semiconductor layer and a part of or all the second semiconductor layer, in a predetermined region over the first semiconductor layer;
an insulating film disposed over the gate recess and the third semiconductor layer;
a gate electrode disposed over the gate recess with the insulating film therebetween; and
a source electrode and a drain electrode disposed over the first semiconductor layer or the second semiconductor layer,
whereby a central portion of the gate recess is higher than peripheral portions of the gate recess along each sidewall of the gate recess, and
a bottom of the gate recess is below a bottom surface of each of the source electrode and the drain electrode,
wherein in the bottom of the gate recess, the insulating film directly contacts the first semiconductor layer at the peripheral portions.
3. The semiconductor device according to claim 2,
wherein the third semiconductor layer comprises n-GaN.
4. The semiconductor device according to claim 1,
wherein the first semiconductor layer and the second semiconductor layer are formed from a nitride semiconductor.
5. The semiconductor device according to claim 1,
wherein the first semiconductor layer comprises i-GaN.
6. The semiconductor device according to claim 1,
wherein the second semiconductor layer comprises any one of AlGaN or InAlN.
7. A semiconductor device comprising:
a first semiconductor layer disposed over and above a substrate;
a second semiconductor layer disposed over and above the first semiconductor layer;
a gate recess disposed, through removal of a part of or all the second semiconductor layer, in a predetermined region over and above the first semiconductor layer;
an insulating film disposed over the gate recess and the second semiconductor layer;
a gate electrode disposed over the gate recess with the insulating film therebetween; and
a source electrode and a drain electrode disposed over and above the first semiconductor layer or the second semiconductor layer,
whereby a central portion of the gate recess is higher than peripheral portions of the gate recess along each sidewall of the gate recess, and
a bottom of the gate recess is below a bottom surface of each of the source electrode and the drain electrode,
wherein a third semiconductor layer is disposed between the first semiconductor layer and the second semiconductor layer,
wherein in the bottom of the gate recess, the insulating film directly contacts the third semiconductor layer at any one of the central portion, the peripheral portions, and both the central portion and the peripheral portions.
8. The semiconductor device according to claim 7,
wherein both the second semiconductor layer and the third semiconductor layer comprise AlGaN, and
the composition ratio of Al in the third semiconductor layer is lower than that in the second semiconductor layer.
9. The semiconductor device according to claim 1,
wherein the insulating film is formed from at least one material selected from the group consisting of oxides, nitrides, and oxynitrides of Si, Al, Hf, Zr, Ti, Ta, and W.
10. The semiconductor device according to claim 1,
wherein the semiconductor device is HEMT.
11. A semiconductor device comprising:
a first semiconductor layer disposed over a substrate;
a second semiconductor layer disposed over the first semiconductor layer;
a third semiconductor layer disposed over the second semiconductor layer;
a gate recess disposed, through removal of all the third semiconductor layer and a part of or all the second semiconductor layer, in a predetermined region over the first semiconductor layer;
an insulating film disposed over the gate recess;
a gate electrode disposed over the gate recess with the insulating film therebetween; and
a source electrode and a drain electrode disposed over the first semiconductor layer or the second semiconductor layer,
whereby a central portion of the gate recess is higher than peripheral portions of the gate recess along each sidewall of the gate recess, and
a bottom of the gate recess is below a bottom surface of each of the source electrode and the drain electrode,
wherein a fourth semiconductor layer is disposed between the first semiconductor layer and the second semiconductor layer,
wherein in the bottom of the gate recess, the insulating film directly contacts the fourth semiconductor layer at any one of the central portion, the peripheral portions, and both the central portion and the peripheral portions.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method comprising:
generating at an ingress routing bridge in a TRansparent Interconnection of Lots of Links (TRILL) network, a trace message for a specified flow along a path from the ingress routing bridge to a destination reachable through the TRILL network;
transmitting the trace message from the ingress routing bridge to a next-hop routing bridge in the TRILL network;
receiving at the ingress routing bridge, a plurality of reply messages from routing bridges in response to transmitting said trace message; and
chaining said plurality of reply messages together to formulate said path and identify the routing bridges in said path and a location of any fault in said path;
wherein each of said plurality of reply messages comprises a TRILL header, identification of an ingress port and egress port at a routing bridge transmitting the reply message, a next-hop routing bridge identifier, and a hop count contained in an Operations, Administration, and Maintenance (OAM) field, the reply message transmitted based on a lookup in a forwarding information base at the routing bridge.
2. The method of claim 1 wherein generating said trace message comprises setting a bit in a TRILL header to identify said trace message as an Operations, Administration, and Maintenance (OAM) packet.
3. The method of claim 1 wherein generating said trace message comprises setting a time-to-live in a TRILL header to one.
4. The method of claim 1 wherein said trace message comprises a hop count and an identifier of the ingress routing bridge transmitting said trace message.
5. The method of claim 1 wherein the next-hop routing bridge is configured to update said trace message and forward said updated trace message to its next-hop routing bridge.
6. The method of claim 1 wherein said plurality of reply messages are received from the routing bridges in said path.
7. An apparatus comprising:
a processor for generating a trace message for a specified flow along a path from the apparatus to a destination reachable through a TRansparent Interconnection of Lots of Links (TRILL) network, transmitting the trace message to a next-hop routing bridge in the TRILL network, receiving a plurality of reply messages in response to transmitting said trace message, and chaining said plurality of reply messages together to formulate said path and identify routing bridges in said path and a location of any fault in said path; and
memory for storing path information received in said plurality of reply messages;
wherein each of said plurality of reply messages comprises a TRILL header, identification of an ingress port and egress port at a routing bridge transmitting the reply message, a next-hop routing bridge identifier, and a hop count contained in an Operations, Administration, and Maintenance (OAM) field, the reply message transmitted based on a lookup in a forwarding information base at the routing bridge.
8. The apparatus of claim 7 wherein said trace message comprises a bit set in a TRILL header to identify said trace message as an OAM packet.
9. The apparatus of claim 7 wherein a time-to-live in said trace message is set to one.
10. The apparatus of claim 7 wherein said trace message comprises a hop count and an identifier of the ingress routing bridge transmitting said trace message.
11. A routing bridge comprising:
a processor for receiving a trace message for a specified flow along a path from an ingress routing bridge to a destination reachable through a TRansparent Interconnection of Lots of Links (TRILL) network, performing a lookup in a forwarding information base to identify a next-hop routing bridge, transmitting a reply message to the ingress routing bridge, updating said trace message, and forwarding said updated trace message to a next-hop routing bridge; and
memory for storing the forwarding information base;
wherein the trace message comprises hop count and an identifier of the ingress routing bridge transmitting said trace message;
wherein the ingress routing bridge is operable to identify a location of any fault in said path based on the reply message;
wherein the reply message comprises, a TRILL header, identification of an ingress port and egress port at the routing bridge transmitting the reply message, the next-hop routing bridge identifier, and Operations, Administration, and Maintenance (OAM) field.
12. The routing bridge of claim 11 wherein said trace message comprises a bit set in a TRILL header to identify said trace message as an OAM packet.
13. The routing bridge of claim 11 wherein a time-to-live in said trace message is set to one.