Author: claimsbot

1. An electrical terminal for electrically connecting an integrated circuit (IC) to a printed circuit board (PCB) comprising:
a base portion;
a contacting portion extending from the base portion;
a solder portion extending from the base portion for connecting to the PCB; wherein,
the contacting portion is provided with a nickel-plating layer, a wear-resistant layer disposed on the nickel-plating layer and a gold-plating layer disposed on the wear-resistant layer, wherein said wear-resistant layer is different from said nickel-plating layer and said gold-plating layer.
2. The electrical terminal as described in claim 1, wherein said wear-resistant layer is a silver-plating layer.
3. The electrical terminal as described in claim 2, wherein the thickness of the silver-plating layer is 3-6 times of that of the nickel-plating layer.
4. The electrical terminal as described in claim 2, wherein the thickness of the silver-plating layer is 3-6 times of that of the gold-plating layer.
5. An electrical terminal stamped from a conductive strip comprising conductive base material, nickel-plating layer disposed on the conductive base material, silver plating layer disposed on the nickel-plating layer and gold-plating layer disposed on the silver-plating layer.
6. The electrical terminal as described in claim 5, wherein the terminal comprises a base portion, a contacting portion extending from the base portion and a solder portion extending from the base portion.
7. The electrical terminal as described in claim 6, wherein the plate layers are disposed on the contacting portion.
8. The electrical terminal as described in claim 6, wherein the thickness of the silver-plating layer is 3-6 times of that of the nickel-plating layer.
9. The electrical terminal as described in claim 6, wherein the thickness of the silver-plating layer is 3-6 times of that of the gold-plating layer.
10. A method for manufacturing an electrical terminal comprising following steps:
(a) stamping step for providing a general terminal shape from a conductive strip;
(b) forming step for providing the terminal normal configuration;
(c) nickel plating step for providing nickel-plating layer on the terminal;
(d) silver plating step providing silver-plating layer on the nickel-plating layer; and
(e) gold plating step providing gold-plating layer on the silver-plating layer.
11. The method as described in claim 10 further comprising silver pre-plating step prior to the silver plating step.
12. The method as described in claim 10 further comprising splitting step for cutting the terminal from the strip.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A vehicle charging equipment, comprising:
a charging equipment main body;
a charging cable to be pulled out of the charging equipment main body;
a charge connector that is provided at a tip of the charging cable, is to be fitted to a vehicle-side connector on a vehicle and has a release button to be pressed for removal from the vehicle-side connector;
a release button circuit to which voltage is applied from the vehicle to detect depression of the release button, the release button circuit having a resistance value that varies depending on whether or not the release button is pressed;
a winding-up device on the charging equipment main body to wind up the charging cable;
a fit determination means for determining whether or not the charge connector is fitted to the vehicle-side connector; and
an automatic winding-up controller for controlling the winding-up device to wind up the charging cable,
wherein the fit determination means comprises a voltage detection unit and a fit determination portion, the voltage detection unit detecting the voltage applied to the release button circuit from the vehicle to detect depression of the release button when the charge connector is fitted to the vehicle-side connector and the fit determination portion determining, based on the voltage detected by the voltage detection unit, whether or not the charge connector is fitted to the vehicle-side connector, and
wherein the automatic winding-up controller determines removal of the charge connector from the vehicle-side connector based on the determination made by the fit determination means and causes the winding-up device to wind up the charging cable after the charge connector is removed from the vehicle-side connector.
2. The vehicle charging equipment according to claim 1, wherein the charge connector conforms to one of SAE J1772 (trademark) and IEC 62196 part 3.
3. The vehicle charging equipment according to claim 1, wherein the fit determination means is provided on the charging equipment main body, and
wherein the charging cable comprises at least five cores including a core wire for detecting the voltage applied to the release button circuit from the vehicle to detect depression of the release button.
4. The vehicle charging equipment according to claim 1, further comprising a release button depression determination means that determines depression of the release button based on the voltage detected by the voltage detection unit.
5. The vehicle charging equipment according to claim 1, further comprising a release button depression performing means that renders the release button circuit into a same circuit condition as the release button-pressed state when a remote interrupt signal is input from outside.
6. The vehicle charging equipment according to claim 1, further comprising an alarm means that stops winding the charging cable and sets off an alarm in the event of occurrence of abnormality during winding up of the charging cable.
7. The vehicle charging equipment according to claim 1, wherein the automatic winding-up controller is configured to control the winding-up device to wind up the charging cable at a predetermined time after removal of the charge connector from the vehicle-side connector.

1. A method of manufacturing a semiconductor package, the method comprising:
attaching a semiconductor piece to a carrier, the semiconductor piece comprising a signal inputoutput area;
forming an encapsulated semiconductor arrangement by depositing an encapsulant onto the semiconductor piece; and
cutting the encapsulated semiconductor arrangement through the signal inputoutput area such that each of at least two semiconductor packages comprises a sidewall including a portion of the signal input output area.
2. The method of claim 1, wherein each semiconductor package comprises a semiconductor die, and wherein the semiconductor comprises the sidewall that is not covered with the encapsulant.
3. The method of claim 2, wherein after cutting, wherein all other sidewalls are completely covered with the encapsulant.
4. The method of claim 2, wherein the semiconductor die comprises an optical edge emitter or an optical edge sensor.
5. The method of claim 2, wherein the semiconductor die comprises a pressure sensor.
6. The method of claim 1, further comprising:
electrically connecting a first electrode pad of the semiconductor piece to a first section of the carrier before depositing the encapsulant.
7. The method of claim 6, further comprising:
electrically connecting a second electrode pad of the semiconductor piece to a second section of the carrier before depositing the encapsulant.
8. The method of claim 7, wherein the second section of the carrier is separated into at least two sub-sections when cutting the encapsulated semiconductor arrangement.
9. The method of claim 7, wherein electrically connecting the second electrode pad to the second section of the carrier comprises wire bonding, ribbon bonding or wedge bonding.
10. The method of claim 6, wherein the first section of the carrier is separated into at least two sub-sections when cutting the encapsulated semiconductor arrangement.
11. The method of claim 6, wherein electrically connecting the first electrode pad to the first section of the carrier comprises soldering.
12. The method of claim 1, wherein the carrier comprises a leadframe.
13. A method of manufacturing a semiconductor package, the method comprising:
attaching a semiconductor piece to a carrier, the semiconductor piece comprising multiple semiconductor dies and a sensor or emitter area;
forming an encapsulated semiconductor arrangement by depositing an encapsulant onto the semiconductor piece; and
cutting the encapsulated semiconductor arrangement through the sensor or emitter area forming at least two separate semiconductor packages, each semiconductor package comprising a die having an exposed sensor or emitter on a first sidewall.
14. The method of claim 13, wherein the exposed sensor or emitter comprises an optical edge emitter, an optical edge sensor or a pressure sensor.
15. The method of claim 13, further comprising forming a first opening in the encapsulated semiconductor arrangement thereby exposing a first electrode pad of the semiconductor piece and forming a second opening in the encapsulated semiconductor arrangement thereby exposing an upper portion of the carrier.
16. The method of claim 15, further comprising disposing a conductive paste over the encapsulated semiconductor arrangement thereby filling the first opening and the second opening.
17. The method of claim 16, further comprising structuring the conductive paste so that a first portion of the conductive paste in the first opening is insulated from a second portion of the conductive paste in the second opening.
18. The method of claim 13, wherein the sensor or emitter area comprises a first cavity and a second cavity.
19. A method of manufacturing a semiconductor packages, the method comprising:
attaching a first main surface of a first semiconductor arrangement to a metal band, the semiconductor arrangement comprising a first active area;
attaching a first main surface of a second semiconductor arrangement to the metal band, the semiconductor arrangement comprising a second active area;
contacting a first electrode pad disposed on a second main surface of the first semiconductor arrangement to a first contact pad of a metal band between the first semiconductor arrangement and the second semiconductor arrangement;
contacting a first electrode pad disposed on a second main surface of the second semiconductor arrangement to the first contact pad;
encapsulating the first semiconductor arrangement and the second semiconductor arrangement by embedding the first and second semiconductor arrangements in an encapsulant;
singulating the first and second encapsulated semiconductor arrangements through the first and second active areas; and
singulating the contact pad of the metal band thereby forming the semiconductor packages, wherein each semiconductor package comprises an exposed first sidewall and a portion of the contact pad.
20. The method of claim 19, wherein the encapsulant comprises a mold compound material.
21. The method of claim 19, wherein the exposed first sidewall comprises an optical edge emitter or an optical edge sensor.
22. The method of claim 19, wherein the exposed first sidewall comprises a pressure sensor.
23. The method of claim 19, wherein contacting a second electrode pad disposed on the second main surface of the first semiconductor arrangement to the first contact pad.
24. The method of claim 23, wherein contacting a second electrode pad disposed on the second main surface of the second semiconductor arrangement to the first contact pad.
25. The method of claim 19, wherein contacting a second electrode pad disposed on the second main surface of the first semiconductor arrangement to a second contact pad.
26. The method of claim 25, wherein contacting a second electrode pad disposed on the second main surface of the second semiconductor arrangement to a third contact pad.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A compound of the formula I:
or a pharmaceutically acceptable salt thereof;
wherein
A is
R1 is selected from H, halo, C1-C4 alkyl, and C1-C4 haloalkyl;
R2, R3, and R4 are independently selected from H, halo, methyl, and C1-C2 haloalkyl;
X is CH;
R5 is H or \u2014OR12;
R6 is H or C1-C6 haloalkyl;
R7 and R8 are H;
R9 is \u2014NR13C(O)R14 or \u2014C(O)NR10R11;
R10 and R11 are independently selected from H, C1-C6 alkyl, C1-C6 haloalkyl, aryl, C3-C6 cycloalkyl, C1-C6 alkylaryl, C1-C6 alkyl-C3-C6 cycloalkyl or R10 and R11 combine with the N of R9 to form piperidinyl;
where R10 or R11 are aryl or C1-C6 alkylaryl the aryl substituent is optionally substituted with 1-3 substituents selected from methoxy;
R12 is H or C1-C6 alkyl;
R13 H;
R14 is C1-C6 alkyl.
2. A compound according to claim 1 of the formula I:
wherein
R9 is \u2014C(O)NR10R11; and
R10 and R11 are independently selected from H, C1-C6 alkyl, C1-C6 haloalkyl, aryl, C1-C6 alkylaryl, or R10 and R11 combine with the N of R9 to form piperidinyl; or a pharmaceutically acceptable salt thereof.
3. A compound according to claim 1 wherein R5 is \u2014OR12.
4. A compound according to claim 1 of the formula IIb:
or a pharmaceutically acceptable salt thereof.
5. A compound according to claim 1 wherein R1, R2, R3, and R4 are independently selected from H, F, Cl, CH3 and CF3.
6. A compound according to claim 1 wherein R1 and R4 are independently selected from H, F, Cl, CH3 and CF3 and R2 and R3 are independently selected from H, F and Cl.
7. A compound according to claim 6 wherein R1 and R4 are independently selected from F, Cl and CH3.
8. A compound according to claim 7 wherein R1 is F and R4 is either Cl or F.
9. A compound according to claim 1 wherein R3 is selected from H and F.
10. A compound according to claim 9 wherein R3 is F.
11. A compound according to claim 1 wherein R2 is H.
12. A compound according to claim 1 wherein R6, R7 and R8 are H.
13. A compound according to claim 1 wherein R10 and R11 are independently selected from H, C1-C4 alkyl, aryl and C1-C4 alkylaryl wherein the aryl substituent of C1-C4 alkylaryl is optionally substituted with methoxy.
14. A compound according to claim 13 wherein R10 and R11 are independently selected from H, methyl, isopropyl, t-butyl, phenyl, benzyl, 1-methyl benzyl and 1,1-dimethyl benzyl wherein phenyl and benzyl substituents are optionally substituted with methoxy.
15. A compound according to claim 1 wherein R10 is H.
16. A compound according to claim 1 wherein R11 is t-butyl.
17. A compound according to claim 1 wherein R12 is H.
18. A pharmaceutical composition comprising a compound of claim 1, or a pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable diluent or carrier.
19. A method for treatment of type II diabetes which comprises administering an effective amount a compound of claim 1, or a pharmaceutically acceptable salt thereof, to a human being or animal in need thereof.