1. A luminescent compound of formula I,
A is hydrogen or -LA-R1;
B is hydrogen or -LB-R1;
C is hydrogen or -LC-R1;
wherein R1 is
E is a hydrogen, halogen, -G, \u2014O-G, or NG2;
G is an aryl, substituted aryl, heteroaryl, substituted heteroaryl, or alkyl;
wherein -LA-, -LB-, and -LC- are independently a bond or ethynyl;
at least one of A, B and C is -LA-R1, -LB-R1, or -LC-R1;
if B is -LB-R1 and -LB- is a bond, then E is hydrogen, G, or \u2014O-G;
and salts thereof.
2. The compound of claim 1, wherein G is phenyl, substituted phenyl, biphenyl, substituted biphenyl, pyridyl, substituted pyridyl, naphthyl, substituted naphthyl, quinolyl, substituted quinolyl, isoquinolyl, substituted isoquinolyl, fluorenyl, substituted fluorenyl, terphenyl, substituted terphenyl, methyl, ethyl, propyl, isopropyl, or t-butyl.
3-5. (canceled)
6. The compound of claim 1, wherein G is phenyl, biphenyl, pyridyl, naphthyl, quinolyl, isoquinolyl, fluorenl or terphenyl.
7-11. (canceled)
12. The compound of claim 1, wherein G is phenyl.
13. (canceled)
14. The compound of claim 1, wherein G is 2-pyridyl.
15. The compound of claim 1, wherein G is methyl, ethyl, propyl, isopropyl, or t-butyl.
16. The compound of claim 1, wherein A is -LA-R1 and -LA- is a bond; B is hydrogen; and C is hydrogen.
17. The compound of claim 1, wherein B is -LB-R1 and -LB-R1 is a bond; A is hydrogen; and C is hydrogen.
18. The compound of claim 1, wherein A is -LA-R1 and -LA- is ethynyl; B is hydrogen; and C is hydrogen.
19. The compound of claim 1, wherein substitution on G is one or more of alkyl, aryl, alkoxy, alkylamino, halogen, aryloxy, arylamino, alkylsilyl, or arylsilyl.
20. (canceled)
21. The compound of claim 1, wherein substitution on G is t-butylphenyl, dimethylaminophenyl, methoxyphenyl, or cyanophenyl.
22. The compound of claim 1, wherein G is a para substituted phenyl.
23. The compound of claim 1, wherein G is p-t-butylphenyl, p-dimethylaminophenyl, p-methoxyphenyl, or p-cyanophenyl.
24. The compound of claim 1, wherein E is hydrogen.
25. The compound of claim 1, wherein E is G.
26. The compound of claim 1, wherein E is \u2014O-G.
27. The compound of claim 1, wherein E is \u2014N(G)2.
28. (canceled)
29. The compound of claim 1, wherein A is -LA-R1, B is hydrogen, C is hydrogen.
30-31. (canceled)
32. The compound of claim 1, wherein A is -LA-R1, B is hydrogen, and C is -LC-R1 and -LA- and -LC- are bonds.
33. The compound of claim 1, wherein A is -LA-R1, B is hydrogen, C is -LC-R1, and -LA- and -LC- are ethynyl.
34. The compound of claim 1, wherein the compound is a salt.
35-37. (canceled)
38. The compound of claim 1, wherein E is halogen.
39. The compound of claim 1, wherein E is bromo.
40. The compound of claim 1, wherein the compound is:
6-(anthracen-9-yl)-N-(pyridin-2-yl)pyridin-2-amine;
4-(10-((6-(pyridin-2-ylamino)pyridin-2-yl)ethynyl)anthracen-9-yl)benzonitrile;
N-(anthracen-9-yl)-N-(pyridin-2-yl)pyridin-2-amine;
6-(anthracen-9-ylethynyl)-N-(pyridin-2-yl)pyridin-2-amine;
6-((10-(4-methoxyphenyl)anthracen-9-yl)ethynyl)-N-(pyridin-2-yl)pyridin-2-amine;
6-((10-(4-(dimethylamino)phenyl)anthracen-9-yl)ethynyl)-N-(pyridin-2-yl)pyridin-2-amine;
bis(6-(anthracen-9-ylethynyl)pyridin-2-yl)amine;
6-((10-(bis(4-tert-butylphenyl)amino)anthracen-9-yl)ethynyl)-N-(pyridini-2-yl)pyridin-2-amine;
6-((10-(bis(4-methoxyphenyl)amino)anthracen-9-yl)ethynyl)-N-(pyridin-2-yl)pyridin-2-amine; and
6-((10-bromoanthracen-9-yl)ethynyl)-N-(pyridin-2-yl)pyridin-2-amine;
or salts thereof.
41-76. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A cooling assembly for cooling a thermal body for an aircraft, the cooling assembly comprising:
a Peltier element having a hot side and a cold side;
a thermal body;
wherein the thermal body is arranged in heat-conductive contact with the cold side of the Peltier element;
wherein the hot side of the Peltier element is adapted to dissipate thermal energy to an aircraft structure, such that the thermal body is coolable; and
a cooling device;
wherein the cooling device has at least one first cooling element with a first inflow surface and at least one second cooling element with a second inflow surface;
wherein the first cooling element is adapted to dissipate thermal energy to the aircraft structure;
wherein the second cooling element is adapted to absorb thermal energy from the hot side of the Peltier element;
wherein the first inflow surface may have the air flow flow against it in such a way that thermal energy is absorbable using the first cooling element;
wherein the second inflow surface may have the air flow flow against it in such a way that thermal energy may be dissipated to the air flow; and
wherein the cooling device is retained between the thermal body and the aircraft structure in such a way that the thermal energy may be dissipated from the Peltier element to the aircraft structure by means of the cooling device.
2. The cooling assembly according to claim 1,
wherein the cooling device forms a closed air channel;
wherein the cooling device has a fan for generating an air flow in the air channel; and
wherein the cooling device is adapted to absorb thermal energy from the hot side of the Peltier element using the air flow and dissipate the thermal energy to the aircraft structure.
3. The cooling assembly according to claim 2,
further comprising a control unit;
wherein the control unit is adapted to control the fan.
4. The cooling assembly according to claim 1,
wherein the cooling device has air deflector plates for controlling the air flow.
5. The cooling assembly according to claim 1,
wherein the thermal body is an aircraft apparatus.
6. The cooling assembly according to claim 1,
further comprising a feed pipe and a drain pipe;
wherein the thermal body has a fluid channel;
wherein the feed pipe is adapted to provide a fluid with a first temperature from the aircraft apparatus to the fluid channel;
wherein the fluid channel is adapted to dissipate the thermal energy of the fluid to the thermal body; and
wherein the fluid may be provided with a second temperature to the drain pipe.
7. The cooling assembly according to claim 1,
further comprising a condensate precipitator;
wherein the condensate precipitator is connected to the first drain pipe;
wherein the fluid is cathode exhaust air of a fuel-cell system;
wherein the cathode exhaust air may be fed to the condensate precipitator by means of the first drain pipe; and
wherein the condensate precipitator is adapted to precipitate a condensed water component of the cathode exhaust air.
8. The cooling assembly according to claim 7,
further comprising a condensate storage tank; and
wherein the condensed water component may be fed to the condensate storage tank.
9. The cooling assembly according to claim 1,
wherein the drain pipe is adapted to provide the fluid with the second temperature to the aircraft apparatus.
10. The cooling assembly according to claim 9,
wherein the aircraft apparatus is a fuel-cell system.
11. The cooling assembly according to claim 1,
wherein the cooling device and the thermal body are implemented integrally.
12. The cooling assembly according to claim 1,
wherein the cooling device has a plurality of Peltier elements.
13. The cooling assembly according to claim 1,
further comprising at least one of the plurality of first cooling elements, second cooling elements, and cooling devices.
14. The cooling assembly according to claim 1,
wherein the aircraft structure is selected from the group comprising: cylindrical aircraft fuselages, stringers, and frames.
15. An aircraft having a cooling assembly according to claim 1.
16. A method of cooling a thermal body for an aircraft, comprising:
a) providing a Peltier element having a hot side and a cold side;
b) arranging a thermal body in heat-conductive contact with the cold side of the Peltier element wherein the hot side of the Peltier element is adapted to dissipate thermal energy to an aircraft structure such that the thermal body is coolable;
c) providing a cooling device wherein the cooling device has at least one first cooling element with a first inflow surface and at least one second cooling element with a second inflow surface;
wherein the first cooling element is adapted to dissipate thermal energy to the aircraft structure;
wherein the second cooling element is adapted to absorb thermal energy from the hot side of the Peltier element;
wherein the first inflow surface may have the air flow flow against it in such a way that thermal energy is absorbable using the first cooling element;
wherein the second inflow surface may have the air flow flow against it in such a way that thermal energy may be dissipated to the air flow; and
wherein the cooling device is retained between the thermal body and the aircraft structure in such a way that the thermal energy may be dissipated from the Peltier element to the aircraft structure by means of the cooling device.