Author: claimsbot

1. A semiconductor integrated circuit, comprising:
at least one second semiconductor chip configured to generate an internal voltage; and
a first semiconductor chip comprising:
a monitoring unit configured to monitor the internal voltage; and
a first pad configured to provide monitoring result information output from the monitoring unit to a test device.
2. The semiconductor integrated circuit of claim 1, wherein the second semiconductor chip comprises a plurality of semiconductor chips configured to generate and use respective internal voltages.
3. The semiconductor integrated circuit of claim 1, wherein the monitoring unit comprises a comparator configured to compare a reference voltage received from the test device with the internal voltage and output the monitoring result information corresponding to the comparison result.
4. The semiconductor integrated circuit of claim 3, wherein the first semiconductor chip further comprises a second pad configured to receive the reference voltage from the test device.
5. A semiconductor integrated circuit, comprising
at least one second semiconductor chip configured to generate different internal voltages and select the different internal voltages in response to an internal voltage select signal; and
a first semiconductor chip configured to generate the internal voltage select signal in response to at least one of an address and a command and monitor the selected internal voltage to output result information corresponding to the monitoring result.
6. The semiconductor integrated circuit of claim 5, wherein the second semiconductor chip comprises:
a plurality of internal voltage generation units configured to generate the different internal voltages, respectively; and
an internal voltage selection unit configured to select one of the different internal voltages in response to the internal voltage select signal and provide the selected internal voltage to the first semiconductor chip.
7. The semiconductor integrated circuit of claim 5, wherein the first semiconductor chip comprises:
a code combination unit configured to generate the internal voltage select signal through a combination using the at least one of an address and a command; and
a monitoring unit configured to monitor the selected internal voltage and generate the result information corresponding to the monitoring result.
8. The semiconductor integrated circuit of claim 7, wherein the first semiconductor chip further comprises;
a first pad configured to provide the result information to a test device; and
a second pad configured to receive a reference voltage from the test device.
9. The semiconductor integrated circuit of claim 8, wherein the monitoring unit comprises a comparator configured to compare the reference voltage with the selected internal voltage and output the result information corresponding to the comparison result.
10. The semiconductor integrated circuit of claim 6, wherein the second semiconductor chip further comprises a plurality of through chip vias (TCVs) formed to penetrate the second semiconductor chip, and
wherein the plurality of TCVs are configured to transmit the internal voltage select signal and the selected internal voltage between the first and second semiconductor chip.
11. A semiconductor integrated circuit, comprising
at least one slave chip configured to generate internal voltages and transmit the internal voltages through a plurality of through chip vias (TCVs) formed by penetrating the slave chip; and
a master chip configured to monitor the internal voltages and generate result information corresponding to the monitoring result.
12. The semiconductor integrated circuit of claim 11, wherein the slave chip comprises:
a plurality of internal voltage generation units configured to generate the internal voltages, respectively; and
an internal voltage selection unit configured to select one of the internal voltages in response to an internal voltage select signal and provide the selected internal voltage to the master chip in response to a chip select signal.
13. The semiconductor integrated circuit of claim 12, wherein the master chip comprises:
a code combination unit configured to generate the internal voltage select signal and the chip select signal in response to at least one of an address and a command and provide the internal voltage select signal and the chip select signal to the slave chip through the TCVs; and
a comparison unit configured to compare a reference voltage with the selected internal voltage provided from the slave chip and output the result information corresponding to the comparison result.
14. The semiconductor integrated circuit of claim 13, wherein the master chip further comprises:
a first pad configured to receive the reference voltage from a test device; and
a second pad configured to provide the result information to the test device.
15. The semiconductor integrated circuit of claim 13, wherein the master chip further comprises:
a plurality of internal voltage generation units configured to generate internal voltages, respectively; and
an internal voltage selection unit configured to select one of the internal voltages generated from the respective internal voltage generation units included in the master chip in response to the internal voltage select signal and provide the selected internal voltage to the comparison unit in response to the chip select signal.
16. A semiconductor integrated circuit, comprising:
a first semiconductor chip configured to be selectively connected to an external controller and a test device; and
a plurality of second semiconductor chips stacked with the first semiconductor chip and configured to generate internal voltages under a control of the first semiconductor chip,
wherein the first semiconductor chip comprises:
a first pad configured to exchange a first signal with the external controller during a normal mode and receive a reference voltage from the test device during a test mode;
a comparison unit configured to compare the reference voltage with the internal voltages provided from the second semiconductor chips during the test mode;
a second pad configured to provide an output signal of the comparison unit to the test device during the test mode and exchange a second signal with the external controller during the normal mode;
a first path selection unit configured to selectively connect the comparison unit to the first pad in response to a test mode signal; and
a second path selection unit configured to selectively connect the comparison unit to the second pad in response to the test mode signal.
17. The semiconductor integrated circuit of claim 16, wherein the first semiconductor chip further comprises a test mode control unit configured to generate the test mode signal through a combination using at least one of an address and a command.
18. A method for measuring an internal voltage of a semiconductor integrated circuit which includes a plurality of semiconductor chips configured to generate respective internal voltages and stacked vertically, the method comprising:
providing an internal voltage generated by a second semiconductor chip of the semiconductor chips to a first semiconductor chip of the semiconductor chips during a test mode; and
comparing the internal voltage provided from the second semiconductor chip to a reference voltage applied from a test device in the first semiconductor chip, and providing result information corresponding to the comparison result to the test device.
19. The method of claim 18, wherein the reference voltage is varied by a set level within a critical range in response to the result information.
20. The method of claim 18, wherein the providing of the internal voltage comprises:
transmitting control signals from the first semiconductor chip to the other semiconductor chips through a plurality of through chip vias (TCVs) to select the second semiconductor chip; and
transmitting the internal voltage generated by the second semiconductor chip to the first semiconductor chip through the TCVs.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method to remove heavy metals from contaminated water and hydrocarbons in a fractured well stratum, said method comprising: introducing into said stratum a proppant formulation that comprises solid proppant particulates associated with a contaminant removal component in a sufficient quantity to remove at least a portion of the heavy metal contaminants or other targeted contaminants in said contaminated fluids.
2. A method according to claim 1 wherein said removal component comprises second particulates comprising an ion exchange resin andor a molecular sieve that are physically blended with said solid proppant particulates in said proppant formulation.
3. A method as according to claim 1 wherein said proppant formulation comprises an insoluble coating on said proppant particulates.
4. A method according to claim 3 wherein said coating comprises said contaminant removal component which has at least one sulfonic acid moiety, carboxylic acid moiety, phenolic moiety, aminoacid moiety, glycolamine moiety, polyamine moiety, quaternary amine moiety, or polyhydroxylic moiety.
5. A method according to claim 3 wherein said contaminant removal component is a second discrete particulate solid that is bound to an outer surface of said proppant particulate with said coating.
6. A method according to claim 5 wherein said second discrete particulate solid is a natural molecular sieve.
7. A method according to claim 5 wherein said second discrete particulate solid is a synthetic molecular sieve.
8. A method according to claim 5 wherein said second discrete particulate solid is an ion exchange resin.
9. A method according to claim 1 wherein said removal component is disposed in pores found in a particulate proppant solid.
10. A method according to claim 1 wherein said particulate proppants comprise pores in which said removal component is disposed in at least a portion thereof.
11. A proppant formulation useful for removing heavy metals from water and hydrocarbons to be produced from a fractured oil and gas production well strata, said proppant formulation comprising: (a) a plurality of particulate proppant solids associated with (b) a contaminant removal component in sufficient quantity to remove at least a portion of heavy metal contaminants in water and hydrocarbons produced from the fractured well stratum.
12. A proppant formulation according to claim 11 wherein said contaminant removal component comprises ion exchange resin or molecular sieve particulates that are mixed with said particulate proppant solids in said proppant formulation.
13. A proppant formulation according to claim 11 wherein said particulate proppant solids comprise pores in which said removal component is disposed in at least a portion thereof.
14. A proppant formulation according to claim 11 wherein said proppant formulation comprises an insoluble proppant coating.
15. A proppant formulation according to claim 14 wherein said coating comprises the contaminant removal component which is a moiety selected from the group consisting of at least one sulfonic acid, carboxylic acid, phenolic, aminoacid, glycolamine, polyamine, quaternary amine, and polyhydroxylic compound.
16. A proppant formulation according to claim 11 wherein said contaminant removal component is a second discrete particulate solid that is bound to an outer surface of said proppant particulate with said coating.
17. A proppant formulation according to claim 16 wherein said second discrete particulate solid is a natural molecular sieve.
18. A proppant formulation according to claim 16 wherein said second discrete particulate solid is a synthetic molecular sieve.
19. A proppant formulation according to claim 16 wherein said second discrete particulate solid is an ion exchange resin.
20. A proppant formulation according to claim 11 wherein said contaminant removal component has a cation exchange capacity for removing normally radioactive heavy metals from said water and hydrocarbons.
21. A proppant formulation according to claim 11 wherein said contaminant removal component is an integral component of a structure of said proppant solids.
22. A proppant formulation according to claim 21 wherein said proppant solids are ceramic.
23. A proppant formulation according to claim 11 wherein said each proppant solid contains a solid core.
24. A proppant formulation according to claim 23 wherein said contaminant removal agent is integral with said solid core.
25. A method to remove heavy metals from contaminated water and hydrocarbons in a fractured well stratum, said method comprising: introducing into a well a gravel pack or filter sand bed solid particulates associated with a contaminant removal component in a sufficient quantity to remove at least a portion of the heavy metal contaminants in said contaminated water and hydrocarbons.
26. A gravel pack or filter sand formulation useful for removing heavy metals from water and hydrocarbons to be produced from a fractured oil and gas production well strata, said gravel pack or filter sand formulation comprising: (a) a plurality of particulate solids associated with (b) a contaminant removal component in sufficient quantity to remove at least a portion of heavy metal contaminants in water and hydrocarbons produced from the fractured well stratum.

1. A photosensitive element comprising a silver halide emulsion having silver halide grains containing an organic hole-trapping dopant.
2. A photosensitive element according to claim 1, wherein the organic hole-trapping dopant is represented by formula (I):

RCOOM(I)

wherein
R represents hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group or hetero-aryl group, and
M is hydrogen or any metal or organic group which can form a salt.
3. A photosensitive element according to claim 1, wherein the organic hole-trapping dopant is represented by formula (II):
5
wherein:
X and Y are independently selected from O, S, Se;
m is 1 and n is 1 or 2
R1 and R2 each independently represents hydrogen, an alkyl group, an aryl or aralkyl group or a heteroaryl group, wherein R1 and R2 may be the same or different and may form a ring;
E represents a group linked to the carbon atom by a heteroatom, having at least one free electron pair;
M is a proton or an organic or inorganic counterion.
4. A photosensitive element according to claim 2, wherein M in formula (I) representing the organic hole-trapping dopant is an alkaline or alkaline earth metal or an organic group which can be an unsubstituted or substituted ammonium-cation in form of NR3R4R5R6, wherein the groups R3 to R6 may be the same or different and wherein each of R3 to R6 independently present hydrogen, unsubstituted or substituted alkyl, unsubstituted or substituted aryl; or a phosphonium, selenonium, iodonium, telluronium or sulphonium ion.
5. A photosensitive element according to claim 3, wherein M in formula (II) representing the organic hole-trapping dopant, is an alkaline or alkaline earth metal or an organic group which can be an unsubstituted or substituted ammonium-cation in form of NR3R4R5R6, wherein the groups R3 to R6 may be the same or different and wherein each of R3 to R6 independently present hydrogen, unsubstituted or substituted alkyl, unsubstituted or substituted aryl; or a phosphonium, selenonium, iodonium, telluronium or sulphonium ion.
6. A photosensitive element according to claim 2, wherein the organic hole-trapping dopant according to the formula (I) is formic acid or an inorganic or organic salt thereof.
7. A photosensitive element according to claim 3, wherein the organic hole-trapping dopant according to the formula (II) is a rongalite, present as a sulfinic acid or an inorganic or organic salt thereof.
8. A photosensitive element according to claim 1, wherein the organic hole-trapping dopant is present in an amount of 108 up to 102 mole per mole of silver halide.
9. A photosensitive element according to claim 1, wherein the silver halide emulsion contains at least one J-aggregating dye as spectral sensitizer.
10. A photosensitive element according to claim 9, wherein the silver halide emulsion containing a spectral sensitizer further comprises a J-aggregate tuning product.
11. A photosensitive element according to claim 10, wherein the J-aggregate tuning product is a photographic stabilizer.
12. A photosensitive element according to claim 1, wherein the silver halide is composed of at least one halide selected from the group consisting of chloride, bromide and iodide.
13. A photosensitive element according to claim 1, wherein the silver halide contains at least 10 mole percent of bromide.
14. A photosensitive element according to claim 1, wherein the silver halide emulsion contains silver halide grains having a mean spherical equivalent diameter SED between 0.01 and 2.0 m.
15. A photosensitive element according to claim 1, wherein the silver halide grains containing a hole-trapping dopant are grains having a core and an outermost shell and the said outermost shell comprises said hole-trapping dopant.
16. A photosensitive element according to claim 15, wherein the shell contains less than 95 percent of the silver present in the grains.
17. A photosensitive element according to claim 1, wherein said element is a photoadressable thermographic element, comprising a substantially light-insensitive organic silver salt, an organic reducing agent therefor in thermal working relationship therewith and a binder.
18. A method for preparing a photosensitive element comprising a support and on one or both sides thereof at least one silver halide emulsion layer, comprising silver halide grains precipitated in the presence of an organic hole-trapping dopant.
19. A method according to claim 18, wherein an oxidizing agent is present together with said organic hole-trapping dopant.
20. A method according to claim 19, wherein the oxidizing agent is p-toluene thiosulphonic acid or a salt thereof.
21. A method for preparing a photosensitive silver halide element according to claim 18, wherein the precipitation is performed in following conditions of pH and pAg:
pH in the range from 1 up to 10, and
pAg in the range from 2 up to 9.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A seal assembly for sealing an opening in the wall of a blood vessel, the blood vessel having an interior wall surface, exterior wall surface, and a lumen, the seal assembly comprising:
a first sealing element for placing inside the lumen of the blood vessel;
a shaft formed with the first sealing element and in a predetermined configuration relative to the first sealing element, the shaft having a length sufficient to extend through the opening of the blood vessel and at least a portion of any overlying tissue;
a flexible member surrounding at least a portion of the shaft adjacent the first sealing element;
an outer floating element slidingly movable along the shaft, the outer floating element having a proximal surface and a distal surface; and
a second sealing element, the second sealing element slidingly movable relative to the first sealing element along the shaft to engage the outer floating element and configured to position the distal surface of the outer floating element against the exterior wall surface and the flexible gasket against the interior wall surface of the blood vessel to seal the opening in the blood vessel.
2. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the shaft and the first sealing element are a single one-piece component.
3. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the flexible member is connected to the first sealing element.
4. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the flexible member is secured to a proximally facing surface of the first sealing element.
5. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the flexible member is substantially circular and has an opening in a middle portion thereof to receive the shaft therethrough.
6. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the flexible member has a shape selected from the shapes consisting of round, oval, ellipse, square, and rectangular.
7. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the shaft has at least two sides, the at least two sides each having a groove along a portion thereof and the outer floating element has an aperture to receive the shaft therethrough, the aperture generally being rectangular and having two protrusions extending into the aperture and configured to the groove on a respective side of the shaft.
8. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the shaft has four sides, two of the four sides having a plurality of equally spaced projections along a length thereof.
9. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 7, wherein each of the protrusions has a first surface capable of engaging a first wall of the groove and a second surface capable of engaging a second wall of the groove.
10. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 9, wherein when the first surface engages the first wall of the groove, the distal surface of the outer floating element is disposed relative to the first wall at an angle of between 35 and 55 degrees.
11. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 10, wherein the angle is 45 degrees
12. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 9, wherein when the second surface engages the second wall of the groove, the second wall facing the first wall across the groove, and the distal surface of the outer floating element is disposed relative to the second wall at an angle of between 15 and 25 degrees.
13. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 12, wherein the angle is 19 degrees.
14. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the shaft has a reduced portion, the reduced portion having a cross section being smaller than a cross section of any other portion of the shaft.
15. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, further comprising an inserter, the inserter comprising
a housing have a first portion and a second portion, the first portion and second portion having a proximal end and a distal end;
a longitudinal opening extending through the housing when the first and second portion are connected to one another and opening at the proximal and distal ends;
an aperture in one of the first and second portions, the aperture configured to receive a portion of the first sealing element when the first and second portion are connected to one another and the seal assembly is inserted therein.
16. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 1, wherein the longitudinal opening has a first opening portion and a second opening portion, the first opening portion having a constant diameter and the second opening portion has a variable diameter.
17. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 16, wherein the aperture is disposed in the inserter at the second opening portion.
18. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 15, where in the distal surface of the outer floating member is disposed relative to the shaft at an angle of between 15 and 25 degrees.
19. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 16, wherein the second opening portion has a maximum diameter and the flexible member is disposed in the inserter at the maximum diameter, the flexible member having a diameter in at least one axis that is smaller than the maximum diameter of the second opening portion.
20. The seal assembly for sealing an opening in the wall of a blood vessel according to claim 15, the inserter has an outer surface, the outer surface having a first outer diameter at the distal end thereof and a second diameter between the distal and proximal ends, the second diameter being larger than the first diameter.
21. A method of sealing an opening in the wall of a blood vessel, the blood vessel having an interior wall surface, exterior wall surface, and a lumen, the method comprising the steps of:
providing a seal assembly for sealing the opening in the blood vessel, the seal assembly operatively connected to an insertion device and comprising a first sealing element for placing inside the lumen of the blood vessel,Called or were you are in a you are a you a you a you and a you a you and a you a you is required is a will you will will will a will and you and him are her and the shaft continuously fixed in a predetermined configuration relative to the first sealing element, the shaft having a length sufficient to extend through the opening of the blood vessel and at least a portion of any overlying tissue, a flexible member surrounding at least a portion of the shaft adjacent the first sealing element, an outer floating element slidingly movable along the shaft, the outer floating element having a proximal surface and a distal surface, and a second sealing element, the second sealing element slidingly movable relative to the first sealing element along the shaft to engage the outer floating element and configured to position the distal surface of the outer floating element against the exterior wall surface and the flexible gasket against the interior wall surface of the blood vessel to seal the opening in the blood vessel;
inserting a portion of the seal assembly into the lumen of the blood vessel; and
retracting the seal assembly and insertion device until the first seal element and flexible member engages the interior wall surface of the blood vessel and causes the insertion device to automatically actuate thereby pushing the second sealing element and the outer floating element toward the exterior wall surface to position the outer floating element against the exterior surface and causing the shaft to break at a reduced portion disposed within the shaft.