1. An image processing apparatus comprising:
a storage medium on which a moving picture for a sample is stored; and
a processor which generates a first sample moving picture image by setting image quality of at least a portion of the moving picture read from the storage medium into a first state, and a second sample moving picture image by setting the image quality of at least a portion of the moving picture read from the storage medium into a second state that is different from the first state;
wherein the first sample moving picture image and the second sample moving picture image are displayed on a same screen of a display unit.
2. The image processing apparatus according to claim 1, wherein the first sample moving picture image and the second sample moving picture image are substantially simultaneously displayed on the same screen of the display unit.
3. The image processing apparatus according to claim 1, wherein the storage medium comprises a hard disk.
4. The image processing apparatus according to claim 1, wherein the storage medium comprises a semiconductor memory.
5. The image processing apparatus according to claim 4, wherein the semiconductor memory comprises a flash memory.
6. The image processing apparatus according to claim 1, wherein:
the first sample moving picture image and the second sample moving picture image are different from each other in at least one kind of the image quality adjustment selected from among: scanning method including InterlaceProgressive scanning method, the number of frame rates, sharpness, noise reduction, contrast, hue, saturation, gamma, and brightness, and
the first and second sample moving picture images are the same in one or more other image quality adjustments.
7. An image display apparatus for displaying an image, based on an input image signal, on a screen of a display unit, comprising:
a storage medium on which a moving picture for a sample is stored;
a processor which generates a plurality of sample moving picture images, which are different from each other in image quality using the moving picture for a sample read from the storage medium, wherein the sample moving picture images are displayed on the screen of the display unit; and
wherein the processor performs an image quality adjustment to the input image signal in accordance with the image quality of one of the sample moving picture images selected from the plurality of sample moving picture images displayed on the screen of the display unit.
8. The image processing apparatus according to claim 7, wherein the processor performs the image quality adjustment to the input image signal in accordance with the image quality of one sample moving picture image selected from the plurality of sample moving picture images displayed substantially simultaneously on the screen of the display unit.
9. The image processing apparatus according to claim 7, wherein the image signal is a television broadcasting signal or an image signal output from an image reproducing apparatus.
10. The image processing apparatus according to claim 7, wherein the processor generates a first sample moving picture image by setting the image quality of the moving picture for a sample read from the storage medium into a first state, and generates a second sample moving picture image by setting the image quality of the moving picture for a sample into a second state that is different from the first state, and simultaneously displays the first sample image and the second sample image on the screen of the display unit.
11. The image processing apparatus according to claim 7, wherein:
the storage medium stores a first moving picture for a sample whose image quality is set into a first state in advance and a second moving picture for a sample whose image quality is set into a second state in advance, and
the processor reads the first moving picture for a sample from the storage medium as a first of the sample moving picture images, and reads the second moving picture for a sample read from the storage medium as a second of the sample moving picture images.
12. The image processing apparatus according to claim 10, wherein the image quality adjustment circuit sets one or more parameters for setting the image quality of the input image signal into the first state when the first sample moving picture image is selected, and sets one or more parameters for setting the image quality of the input image signal into the second state when the second sample moving picture image is selected.
13. The image processing apparatus according to claim 11, wherein the image quality adjustment circuit sets one or more parameters for setting the image quality of the input image signal into the first state when the first sample moving picture image is selected, and sets one or more parameters for setting the image quality of the input image signal into the second state when the second sample moving picture image is selected.
14. The image processing apparatus according to claim 7, wherein the storage medium stores a plurality of moving pictures for samples associated with kinds of image qualities.
15. The image processing apparatus according to claim 7, further comprising:
a connector that enables a connection to a network;
wherein a setting parameter for image quality adjustment can be transmitted or received through the network.
16. The image processing apparatus according to claim 6, further comprising:
a connector that enables a connection to a network;
wherein the moving picture for a sample can be received through the network and the received moving picture for a sample is stored on the storage medium.
17. The image processing apparatus according to claim 7, wherein reading of the moving picture for a sample from the storage medium is repeated until the image quality adjustment is completed.
18. An image display apparatus comprising:
a display device, which displays a plurality of sample moving picture images that are different from each other in an image quality on a screen when operating in an image quality adjustment mode for setting an image quality of an input image signal, and which displays the input image when operating in a normal operation mode in which an input image signal is displayed;
a operation device capable of selecting one of the image quality adjustment mode and the normal operation mode and capable of selecting at least one of the plurality of sample moving picture images displayed on the screen of the display device in the image quality adjusting mode; and
a processor which adjusts the image quality of the input image signal in accordance with a setting parameter for the image quality of the sample moving picture image selected by using the operation device, when the normal operation mode is selected by using the operation device.
19. The image display apparatus according to claim 18, further comprising a storage medium which stores information related to the sample moving picture image.
20. The image display apparatus according to claim 18, wherein:
the operation device is capable of controlling a cursor displayed with the plurality of sample moving picture images on the screen, and
the cursor indicates a selection of one of the plurality of sample moving picture images displayed on the screen of the display device.
21. The image display apparatus according to claim 18, wherein:
the display device displays an identification number with each of the plurality of sample moving picture images;
the operation device comprises a remote controller; and
the sample moving picture image having the identification number that is the same as a number input from the remote controller is selected.
22. An image processing method comprising:
reading a moving picture for a sample;
setting image quality of the moving picture for a sample into a first state and a second state that is different from the first state; and
outputting a first sample moving picture image having the first state and a second sample moving picture image having the second state so as to display the first and second sample moving picture images on a same screen.
23. An image displaying method for displaying an image based on an input image signal comprising:
reading a moving picture for a sample;
displaying a first sample moving picture image and a second sample moving picture image having different image quality from the first sample moving picture image on a same screen using the moving picture for a sample; and
adjusting an image quality of the input image signal in accordance with the image quality of one sample moving picture image selected from the first and second sample moving picture images displayed on the screen.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multi-chip module comprising:
a substrate having a plurality of interconnections formed on a top surface thereof;
a lowest chip and at least one top chip sequentially stacked on the top surface, the top chip having an insulating tape attached to a backside thereof, the lowest chip and the top chip each having pads formed thereon;
an insulator interposed between the chips, the insulator exposing the pads; and
a first group of bonding wires connecting the pads of the lowest chip with a first group of interconnections on the substrate.
2. The multi-chip module of claim 1, further comprising:
a second group of bonding wires connecting the pads of the top chip with a second group of interconnections on the substrate.
3. The multi-chip module of claim 1 wherein all the chips have substantially the same dimension and fully cover each other.
4. The multi-chip module of claim 1 wherein the top chip has a greater planar area than the lowest chip located thereunder.
5. The multi-chip module of claim 1 further comprises an adhesive interposed between the lowest chip and the substrate.
6. The multi-chip module of claim 1 further comprises bumps formed on the pads of the chips, the bonding wires being in contact with the bumps.
7. The multi-chip module of claim 1 further comprises an epoxy molding compound that encapsulates the stacked chips and the bonding wires.
8. The multi-chip module of claim 1 wherein the lowest chip and the top chip each have peripheral pads formed on a top surface thereof.
9. The multi-chip module of claim 1 wherein the insulator has a smaller width than the chips to expose the pads.
10. A multi-chip module comprising:
a substrate having a plurality of interconnections formed on a top surface thereof, the interconnections including a first group of interconnections and a second group of interconnections;
a bottom chip and a top chip sequentially stacked on the top surface, the top chip having an insulating tape attached to its backside and the bottom chip and the top chip each having peripheral pads on a top surface thereof;
an insulator interposed between the bottom chip and the top chip, the insulator having a smaller width than the chips to expose the pads of the bottom chip;
a first group of bonding wires connecting the pads of the bottom chip with the first group of interconnections; and
a second group of bonding wires connecting the pads of the top chip with the second group of interconnections.
11. The multi-chip module of claim 10 wherein the substrate is a lead frame or a printed circuit board.
12. The multi-chip module of claim 10 wherein the top chip has substantially the same dimensions as the bottom chip.
13. The multi-chip module of claim 10 wherein the top chip has a greater planar area than the bottom chip.
14. The multi-chip module of claim 10 further comprises an adhesive interposed between the bottom chip and the substrate.
15. The multi-chip module of claim 10 further comprises conductive bumps formed on the pads of the chips, the bonding wires being in contact with the bumps.
16. The multi-chip module of claim 10 further comprises an epoxy molding compound that encapsulates the bottom chip, the top chip and the bonding wires.
17. A method of fabricating a multi-chip module, the method comprising:
preparing a substrate having first and second groups of interconnections formed on a top surface thereof;
mounting a bottom chip on the top surface, the bottom chip having pads formed thereon;
forming a first group of bonding wires that connect the pads of the bottom chip to the first group of interconnections;
attaching an insulator on an upper surface of the bottom chip, the insulator being surrounded by the pads of the bottom chip; and
mounting a top chip on the insulator, the top chip including a insulating tape attached to a backside thereof, the top chip having pads formed thereon.
18. The method of claim 17 further comprising:
forming a second group of bonding wires that connect the pads of the top chip to the second group of interconnections.
19. The method of claim 17 further comprises providing an adhesive on the substrate before mounting the bottom chip on the substrate, the bottom chip being fixed to the substrate by the adhesive.
20. The method of claim 17 further comprises forming bumps on the pads of the bottom chip before forming the first group of bonding wires, the first group of bonding wires being connected to the bumps on the pads of the bottom chip.
21. The method of claim 20, wherein the first group of bonding wires are formed using a bump reverse bonding technique.
22. The method of claim 17 further comprises forming bumps on the pads of the top chip before forming the second group of bonding wires, the second group of bonding wires being connected to the bumps on the pads of the top chip.
23. The method of claim 17 further comprises forming an epoxy molding compound that encapsulates the bottom chip, the top chip and the bonding wires.
24. The method of claim 17, wherein the pads are formed on edges of the top surfaces of the chips.
25. The method of claim 17, wherein the insulator is attached on a central region of the bottom chip, thereby having a width smaller than the bottom chip and the top chip.