1460757158-e576a2d6-7f2f-4973-adf3-b687078df060

1. A device, comprising:
a substrate;
electronic components in the substrate;
a sensor configured to interact with the electronic components in the substrate;
an enclosure positioned on the substrate, the enclosure including:
an exterior dielectric layer having a first portion, a second portion, and a third portion that couples the first portion to the second portion; and
an interior conductive layer within the exterior dielectric layer, the interior conductive layer being on the third portion and between the first portion and the second portion; and

a cover positioned on the enclosure, the cover configured to contact the first portion and the second portion of the exterior dielectric layer and the interior conductive layer to seal the sensor within the enclosure.
2. The device of claim 1 wherein in cross-section the exterior dielectric layer is U-shaped and the first portion is substantially parallel to the second portion of the exterior dielectric layer.
3. The device of claim 1 wherein a top surface of the enclosure includes a top surface of the interior conductive layer between a top surface of the first portion and a top surface of the second portion of the exterior dielectric layer.
4. The device of claim 1 wherein a bottom surface of the enclosure includes only the third portion of the exterior dielectric layer.
5. The device of claim 1 wherein a height between a top surface and a bottom surface of the enclosure has different dimensions at locations around the sensor.
6. The device of claim 1 wherein a height of the enclosure between the substrate and the cover have different dimensions at locations around the sensor.
7. The device of claim 1 wherein a portion of the sensor is above the substrate and the cover is above the substrate and above the portion of the sensor.
8. A method, comprising:
forming electronic components in a substrate;
forming a sensor configured to interact with the electronic components in the substrate;
forming an enclosure on the substrate, the enclosure including an exterior dielectric layer and an interior conductive layer, the forming of the enclosure including:
forming an opening in a sacrificial layer;
forming the exterior dielectric layer in the opening, the exterior dielectric layer lining sidewalls of the opening; and
forming the interior conductive layer on the exterior dielectric layer in the opening; and

forming a cover on the enclosure, the cover configured to contact the exterior dielectric layer and the interior conductive layer and to seal the sensor within the enclosure.
9. The method of claim 8 wherein forming the sensor occurs before forming the enclosure.
10. The method of claim 9 where forming the enclosure includes:
forming a planar top surface by removing portions of the exterior dielectric layer and the interior conductive layer, the top surface including the interior conductive layer between a first part of the exterior layer and a second part of the exterior layer.
11. The method of claim 8 wherein the sensor is a micro-electromechanical device.
12. The method of claim 8 wherein the sensor includes a first conductive material and the interior conductive layer is a second conductive material that is different from the first conductive material.
13. The device of claim 1 wherein the enclosure has a top surface, a bottom surface, a first side surface, and a second side surface, the top surface includes a first portion of the exterior dielectric layer separated from a second portion of the exterior dielectric layer by the interior conductive layer, the bottom surface including only the exterior dielectric layer, the first side surface including only the exterior dielectric layer, and the second side surface including only the exterior dielectric layer.
14. The device of claim 1 wherein the exterior dielectric layer completely surrounds the interior conductive layer, except for on a top surface of the enclosure.
15. The device of claim 14 wherein the top surface of the enclosure includes a first portion of the exterior dielectric layer separated from a second portion of the exterior dielectric layer by the interior conductive layer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of preparing one or more active 5-\u03b1-reductase inhibitor preparations, comprising the following steps:
(a) preparing a fine powder of a sample;
(b) transferring said sample fine powder to a cartridge, wherein said cartridge comprises a filler to reduce dead volume;
(c) performing a sequential procedure comprising extraction and fractionation employing carbon dioxide and an appropriate alcohol, wherein pressure is set to around 3000 psig and temperature set to around 40\xb0 C.; and
(d) collecting individual fractions.
2. The method of claim 1, wherein said sample is selected from the group consisting of Saw Palmetto, Sperol, their respective analogs or derivatives.
3. The method of claim 1, wherein said filler is selected from the group consisting of glass wool, beads, or alike.
4. The method of claim 1, wherein said appropriate alcohol is either methanol or ethanol.
5. The method of claim 1, wherein step (c) includes step extractions employing either methanol or ethanol.
6. The method of claim 5, wherein said step extractions includes extractions with said appropriate alcohol, wherein individual steps include 5, 10, 20, 30, or 40% alcohol volume.
7. A method of modulating 5-\u03b1-reductase in an individual, comprising administering to said individual a therapeutically effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
8. The method of claim 7, wherein said modulation is inhibition.
9. The method of claim 7, wherein said administration includes an additional pharmaceutical agent.
10. The method of claim 9, wherein said pharmaceutical agent includes oncolytic pharmaceuticals.
11. The method of claim 7 further comprising the administration of either resection or radiation therapy.
12. The method of claim 7, wherein said administration is effectuated through topical application.
13. A method of treating benign prostate hyperplasia, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
14. A method of treating hirsutism, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
15. A method of treating acne, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
16. A method of treating benign prostate hyperplasia, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
17. A method of treating male pattern baldness, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
18. A method of treating seborrhea, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.

1460757149-cf4a186c-8bae-4a6a-abeb-63e11c87e11e

What is claimed is:

1. A software-defined radio comprising:
a transceiver configured to transmit and receive a plurality of waveforms under a plurality of communications standards; and
a reconfigurable resource configured to execute a plurality of software programs, each of the plurality of software programs reconfiguring the reconfigurable resource to emulate one of a plurality of processors to process a portion of the plurality of waveforms under one of the plurality of communications standards,
wherein:
the reconfigurable resource is implemented on a single chip.
2. The software-defined radio of claim 1 wherein:
the reconfigurable resource comprises a field programmable gate array.
3. The software-defined radio of claim 1 wherein:
at least one of the plurality of processors is a digital signal processor.
4. The software-defined radio of claim 1 wherein:
at least one of the plurality of processors is adapted to implement an instruction set architecture;
the instruction set architecture defines a standard for performing sequencing of a plurality of instructions to implement at least one of the plurality of waveforms; and
the reconfigurable resource can switch context to match the instruction set architecture to at least one of the plurality of waveforms.
5. The software-defined radio of claim 4 wherein:
the reconfigurable resource further comprises an arithmetic logic unit.
6. The software-defined radio of claim 5 wherein:
the arithmetic logic unit is configured to match signal processing requirements of at least one of the plurality of waveforms.
7. The software-defined radio of claim 5 wherein:
the arithmetic logic unit and the at least one of the plurality of processors perform instructions in parallel with each other.
8. The software-defined radio of claim 7 wherein:
the arithmetic logic unit is configured to be context switched.
9. The software-defined radio of claim 1 wherein:
the software-defined radio is implemented in a handheld form factor.
10. The software-defined radio of claim 1 wherein:
the software-defined radio is implemented in an embedded form factor.
11. A software-defined radio comprising:
a field programmable gate array capable of being configured as a plurality of software-based digital signal processing units; and
a transceiver,
wherein:
each of the plurality of software-based digital signal processing units are capable of being reconfigured to match signal processing requirements of one of the plurality of waveforms.
12. The software-defined radio of claim 11 wherein:
at least one of the plurality of software-based digital signal processing units is adapted to implement an instruction set architecture;
the instruction set architecture is selected from among one or more standard instruction set architecture standards for handling at least one of the plurality of waveforms; and
the field programmable gate array can switch context to perform a sequence of processes on multiple blocks of data.
13. The software-defined radio of claim 12 wherein:
the field programmable gate array further comprises an arithmetic logic unit.
14. The software-defined radio of claim 13 wherein:
the arithmetic logic unit is configured to match signal processing requirements of at least one of the plurality of waveforms.
15. The software-defined radio of claim 13 wherein:
the arithmetic logic unit and the at least one of the plurality of software-based digital signal processing units perform instructions in parallel with each other.
16. The software-defined radio of claim 15 wherein:
the arithmetic logic unit is configured to be context switched.
17. The software-defined radio of claim 11 wherein:
the software-defined radio is implemented in a handheld form factor.
18. A handheld software-defined radio comprising:
a single-chip field programmable gate array; and
a transceiver adapted to transmit and receive a waveform,
wherein:
the waveform is processed by a plurality of signal processing functions; and
the plurality of signal processing functions are implemented on the single-chip field programmable gate array.
19. The handheld software-defined radio of claim 18 wherein:
at least one of the plurality of signal processing functions is implemented by a digital signal processor.
20. The handheld software-defined radio of claim 19 wherein:
at least one of the plurality of signal processing functions is adapted to implement an instruction set architecture;
the instruction set architecture implements a standard instruction set architecture for which software and waveform development tools and libraries are available; and
the single-chip field programmable gate array can switch context to match the instruction set architecture to the waveform.
21. The handheld software-defined radio of claim 20 wherein:
the single-chip field programmable gate array further comprises an arithmetic logic unit.
22. The handheld software-defined radio of claim 21 wherein:
the arithmetic logic unit is configured to match signal processing requirements of the waveform.
23. The handheld software-defined radio of claim 21 wherein:
the arithmetic logic unit and at least one of the plurality of signal processing functions perform instructions in parallel with each other.
24. The handheld software-defined radio of claim 21 wherein:
the arithmetic logic unit is configured to be context switched.
25. The handheld software-defined radio of claim 18 wherein:
the handheld software-defined radio is implemented in a handheld form factor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A distributed heating system for a power train of a ram air turbine, which ram air turbine has a stowed position and a deployed position, comprising:
multiple electrical resistance heater elements, with each electrical resistance heater element mounted on lubrication surfaces for the power train; and
an electrical controller that directs power to energize each electrical resistance heater element to heat the lubricant to a temperature that reduces the viscosity of the lubricant in order to enhance lubrication of the power train;
the electrical resistance heater elements being energized when the ram air turbine is in the stowed position and ambient temperatures causes the viscosity of the lubricant to be above acceptable levels.
2. The distributed heating system of claim 1, wherein the power train comprises a gear box with bearings and a gear set.
3. The distributed heating system of claim 1, wherein the power train comprises a drive line.
4. The distributed heating system of claim 1, wherein the power train comprises an electrical generator.
5. The distributed heating system of claim 1, wherein the power train comprises a hydraulic pump.
6. The distributed heating system of claim 1, wherein each lubrication surface comprises a lubrication surface of bearings in the power train.
7. The distributed heating system of claim 1, wherein each lubrication surface comprises a lubrication surface of gears in the power train.
8. The distributed heating system of claim 1, wherein each electrical resistance heater element is of the flexible circuit type.
9. The distributed heating system of claim 1, wherein each electrical resistance heater element is of the resistance wire type.
10. The distributed heating system of claim 1, wherein each electrical resistance heater element mounts along a surface of the power train proximate at least one respective lubrication surface for the power train.
11. The distributed heating system of claim 1, wherein the electrical controller receives the electrical power from an electrical power supply line, couples the electrical power to each electrical resistance heater unit by means of an electrical wiring line, monitors an ambient temperature signal that it receives from an electrical temperature signal line and monitors a ram air turbine deployment signal that it receives from a deployment signal line.
12. A distributed heating system for a power train of a ram air turbine, which ram air turbine has a stowed position and a deployed position, comprising:
multiple electrical resistance heater elements, with each electrical resistance heater element mounted along a surface of the power train proximate at least a respective one of multiple lubrication surfaces for the power train;
an electrical wiring line to interconnect each electrical resistance heater element; and
an electrical controller that monitors an ambient temperature signal received from a temperature signal line and a ram air turbine deployment signal received from a deployment signal line for coupling electrical power received from an electrical power supply line to the electrical wiring line to feed the electrical power to each electrical resistance heater element to heat a section of the power train proximate at least the respective one of its lubrication surfaces to a temperature that reduces the viscosity of the lubricant in order to enhance lubrication of the power train when the ram air turbine is in the stowed position and ambient temperatures causes the viscosity of the lubricant to be above acceptable levels.
13. The distributed heating system of claim 12, wherein the power train comprises a gear box with bearings and a gear set.
14. The distributed heating system of claim 12, wherein the power train comprises a drive line.
15. The distributed heating system of claim 12, wherein the power train comprises an electrical generator.
16. The distributed heating system of claim 12, wherein the power train comprises a hydraulic pump.
17. The distributed heating system of claim 12, wherein each lubrication surface comprises a lubrication surface of bearings in the power train.
18. The distributed heating system of claim 12, wherein each lubrication surface comprises a lubrication surface of gears in the power train.
19. The distributed heating system of claim 12, wherein each electrical resistance heater element is of the flexible circuit type.
20. The distributed heating system of claim 12, wherein each electrical resistance heater element is of the resistance wire type.