1. A device, comprising:
a substrate;
electronic components in the substrate;
a sensor configured to interact with the electronic components in the substrate;
an enclosure positioned on the substrate, the enclosure including:
an exterior dielectric layer having a first portion, a second portion, and a third portion that couples the first portion to the second portion; and
an interior conductive layer within the exterior dielectric layer, the interior conductive layer being on the third portion and between the first portion and the second portion; and
a cover positioned on the enclosure, the cover configured to contact the first portion and the second portion of the exterior dielectric layer and the interior conductive layer to seal the sensor within the enclosure.
2. The device of claim 1 wherein in cross-section the exterior dielectric layer is U-shaped and the first portion is substantially parallel to the second portion of the exterior dielectric layer.
3. The device of claim 1 wherein a top surface of the enclosure includes a top surface of the interior conductive layer between a top surface of the first portion and a top surface of the second portion of the exterior dielectric layer.
4. The device of claim 1 wherein a bottom surface of the enclosure includes only the third portion of the exterior dielectric layer.
5. The device of claim 1 wherein a height between a top surface and a bottom surface of the enclosure has different dimensions at locations around the sensor.
6. The device of claim 1 wherein a height of the enclosure between the substrate and the cover have different dimensions at locations around the sensor.
7. The device of claim 1 wherein a portion of the sensor is above the substrate and the cover is above the substrate and above the portion of the sensor.
8. A method, comprising:
forming electronic components in a substrate;
forming a sensor configured to interact with the electronic components in the substrate;
forming an enclosure on the substrate, the enclosure including an exterior dielectric layer and an interior conductive layer, the forming of the enclosure including:
forming an opening in a sacrificial layer;
forming the exterior dielectric layer in the opening, the exterior dielectric layer lining sidewalls of the opening; and
forming the interior conductive layer on the exterior dielectric layer in the opening; and
forming a cover on the enclosure, the cover configured to contact the exterior dielectric layer and the interior conductive layer and to seal the sensor within the enclosure.
9. The method of claim 8 wherein forming the sensor occurs before forming the enclosure.
10. The method of claim 9 where forming the enclosure includes:
forming a planar top surface by removing portions of the exterior dielectric layer and the interior conductive layer, the top surface including the interior conductive layer between a first part of the exterior layer and a second part of the exterior layer.
11. The method of claim 8 wherein the sensor is a micro-electromechanical device.
12. The method of claim 8 wherein the sensor includes a first conductive material and the interior conductive layer is a second conductive material that is different from the first conductive material.
13. The device of claim 1 wherein the enclosure has a top surface, a bottom surface, a first side surface, and a second side surface, the top surface includes a first portion of the exterior dielectric layer separated from a second portion of the exterior dielectric layer by the interior conductive layer, the bottom surface including only the exterior dielectric layer, the first side surface including only the exterior dielectric layer, and the second side surface including only the exterior dielectric layer.
14. The device of claim 1 wherein the exterior dielectric layer completely surrounds the interior conductive layer, except for on a top surface of the enclosure.
15. The device of claim 14 wherein the top surface of the enclosure includes a first portion of the exterior dielectric layer separated from a second portion of the exterior dielectric layer by the interior conductive layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of preparing one or more active 5-\u03b1-reductase inhibitor preparations, comprising the following steps:
(a) preparing a fine powder of a sample;
(b) transferring said sample fine powder to a cartridge, wherein said cartridge comprises a filler to reduce dead volume;
(c) performing a sequential procedure comprising extraction and fractionation employing carbon dioxide and an appropriate alcohol, wherein pressure is set to around 3000 psig and temperature set to around 40\xb0 C.; and
(d) collecting individual fractions.
2. The method of claim 1, wherein said sample is selected from the group consisting of Saw Palmetto, Sperol, their respective analogs or derivatives.
3. The method of claim 1, wherein said filler is selected from the group consisting of glass wool, beads, or alike.
4. The method of claim 1, wherein said appropriate alcohol is either methanol or ethanol.
5. The method of claim 1, wherein step (c) includes step extractions employing either methanol or ethanol.
6. The method of claim 5, wherein said step extractions includes extractions with said appropriate alcohol, wherein individual steps include 5, 10, 20, 30, or 40% alcohol volume.
7. A method of modulating 5-\u03b1-reductase in an individual, comprising administering to said individual a therapeutically effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
8. The method of claim 7, wherein said modulation is inhibition.
9. The method of claim 7, wherein said administration includes an additional pharmaceutical agent.
10. The method of claim 9, wherein said pharmaceutical agent includes oncolytic pharmaceuticals.
11. The method of claim 7 further comprising the administration of either resection or radiation therapy.
12. The method of claim 7, wherein said administration is effectuated through topical application.
13. A method of treating benign prostate hyperplasia, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
14. A method of treating hirsutism, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
15. A method of treating acne, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
16. A method of treating benign prostate hyperplasia, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
17. A method of treating male pattern baldness, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.
18. A method of treating seborrhea, comprising administering to a subject in need thereof an effective amount of a supercritical fluid isolate of Saw Palmetto, Sperol, their respective analogs or derivatives.