Author: claimsbot

1. A rechargeable battery pack comprising at least one power interface for transferring power from the battery pack to an appliance during use and a single charger input terminal to which an output terminal of a battery charger is connectable during use for charging the battery pack, wherein the single charger input terminal is connectable to the output terminal of the battery charger when the battery pack is connected to the appliance and when the battery pack is not connected to the appliance, the rechargeable battery pack further comprising a connecting portion which in use allows the battery pack to be physically connected to the appliance, wherein the connecting portion is an upstanding protrusion which extends from a top surface of a casing of the battery pack, wherein the connecting portion is insertable into a docking portion on the appliance, and wherein the charger input terminal is located on a part of the protrusion that is insertable into the docking portion.
2. The rechargeable battery pack of claim 1 further comprising one or more logic terminals.
3. The rechargeable battery pack of claim 1 wherein the charger input terminal is in the form of a recess in the battery pack.
4. A battery powered handheld vacuum cleaner including a removable rechargeable battery pack having a single charger input terminal, wherein the rechargeable battery pack is chargeable via the single charger input terminal when the battery pack is attached to the vacuum cleaner and when the battery pack is removed from the vacuum cleaner, wherein the rechargeable battery pack further comprises an upstanding protrusion which is insertable into a docking portion on the vacuum cleaner, and wherein the docking portion further comprises an aperture which lines up with the charger input terminal on the battery pack when the battery pack is docked in the docking portion and prevents the battery pack from being removed from the docking portion while an output terminal of a battery charger remains inserted through the aperture and into the charger input terminal.
5. The battery powered handheld vacuum cleaner of claim 4 wherein the rechargeable battery pack further comprises at least one power interface for transferring power from the battery pack to the handheld vacuum cleaner during use.
6. The battery powered handheld vacuum cleaner of claim 4 wherein the docking portion is a recess in a handle on the handheld vacuum cleaner.
7. The battery powered handheld vacuum cleaner of claim 4 wherein the docking portion further comprises a locking mechanism.
8. The battery powered handheld vacuum cleaner of claim 4 wherein the aperture is circular in cross section.
9. The battery powered handheld vacuum cleaner of claim 4 wherein the aperture is formed in and entirely surrounded by a wall of the docking portion.
10. The battery powered handheld vacuum cleaner of claim 4 wherein the vacuum cleaner is configured to not work while the battery pack is attached to the vacuum cleaner and being charged.
11. A kit for a battery powered handheld vacuum cleaner comprising:
a battery powered vacuum cleaner,
a rechargeable battery pack removably attached to the vacuum cleaner, comprising at least one power interface for transferring power from the battery pack to the handheld vacuum cleaner during use and a single charger input terminal, and
a charger having an output terminal,
wherein the output terminal is connectable to the single charger input terminal to charge the battery pack when the battery pack is removed from the vacuum cleaner and when the battery pack is attached to the vacuum cleaner, wherein the rechargeable battery pack further comprises an upstanding protrusion which is insertable into a docking portion on the vacuum cleaner, and wherein the docking portion further comprises an aperture which lines up with the charger input terminal on the battery pack when the battery pack is docked in the docking portion and prevents the battery pack from being removed from the docking portion while the output terminal of the charger remains inserted through the aperture and into the charger input terminal.
12. The kit of claim 11 wherein the docking portion is a recess in a handle on the vacuum cleaner.
13. The kit of claim 11 wherein the docking portion further comprises a locking mechanism.
14. The kit of claim 11 wherein the aperture is circular in cross section.
15. The kit of claim 11 wherein the aperture is formed in and entirely surrounded by a wall of the docking portion.
16. The kit of claim 11 wherein the vacuum cleaner is configured to not work while the battery pack is attached to the vacuum cleaner and being charged.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A stacked memory module, comprising:
a primary circuit board having a first and second surface adapted for mounting electronic components;
wherein one surface of the primary board has at least one primary connector;
a daughter board having a first and second surface adapted for mounting electronic components;
wherein one surface of the daughter board has at least one daughter connector;
the primary connectors being adapted for removeably receiving and electrically coupling the daughter connectors;
a control connector adapted to engage with a connecting port on a supporting structure;
the control connector being provided at an end of the primary board;
wherein the primary circuit board and the daughter circuit board are interconnected in a spaced and substantially parallel relation.
2. A stacked memory module, comprising:
a primary circuit board having a first and second surface adapted for mounting electronic components;
wherein one surface of the primary board has a plurality of primary connectors;
a daughter circuit board having a first and second surface adapted for mounting electronic components;
wherein one surface of the daughter circuit board has a plurality of daughter connectors;
the primary circuit connectors being adapted for removeably receiving and electrically coupling the daughter connectors;
a control connector adapted to engage with a connecting port at an end of the primary circuit board;
wherein the primary circuit board and the daughter circuit board are interconnected in a spaced and substantially parallel relation.
3. The module of claim 2 wherein the at least one primary connector is oriented perpendicular to the first and second surface of the primary circuit board.
4. The module of claim 2 wherein the at least one daughter connector is oriented perpendicular to the first and second surface of the daughter circuit board.
5. The module of claim 2 wherein the primary and daughter connectors align each other and are perpendicular to the first and second surface of the primary and the daughter board, whereby a conductive path is minimized between each of the primary and daughter circuit boards.
6. The module of claim 5 wherein the plurality of primary and daughter circuit connectors are spaced such that a channel is created for airflow between the plurality of primary and daughter connectors.
7. The module of claim 2 wherein the at least one primary connector is located between the electronic components and the control connector.
8. The module of claim 2 further comprising a plurality of via connections on the primary board and the daughter boards for electrically coupling the electronic components on the first and second surfaces.
9. The module of claim 2 wherein the electronic components are memory integrated circuits.
10. The module of claim 2 further comprising a memory driver mounted on at least one of the primary circuit board and the daughter circuit boards.
11. A stacked memory module, comprising:
a primary circuit board having a first and second surface adapted for mounting electronic components;
wherein at least one surface of the primary circuit board has at least one primary connector;
at least one daughter circuit board having a first and second surface adapted for mounting electronic components;
wherein at least one surface of each of the daughter circuit boards has at least one daughter connector;
the primary connectors being adapted for removeably receiving and electrically coupling at least one of the daughter connectors;
each of the daughter connectors being adapted for removeably interconnecting and electrically coupling at least one of the remaining daughter connectors on at least one of the remaining daughter circuit boards;
a control connector adapted to engage with a connecting port on a supporting structure;
the control connector being provided at an end of at least one of the primary circuit board and the daughter circuit boards;
wherein the primary circuit board and each of the daughter circuit boards are connected in a spaced and substantially parallel relation.
12. A stacked memory module, comprising:
a primary circuit board having a first and second surface for mounting electronic components;
wherein at least one surface of the primary circuit board has a plurality of primary connectors;
at least one daughter board having a first and second surface adapted for mounting electronic components;
wherein at least one surface of the daughter circuit board has a plurality of daughter connectors;
the primary connectors being adapted for removeably receiving and electrically coupling at least one of the daughter connectors;
each of the daughter connectors being adapted for removeably receiving and electrically coupling at least one of the remaining daughter connectors on at least one of the remaining daughter circuit boards;
a control connector adapted to engage with a connecting port on a supporting structure;
the control connector being provided at an end of at least one of the primary circuit board and the daughter circuit boards;
wherein the primary circuit board and each of the daughter circuit boards are connected in a spaced and substantially parallel relation.
13. The module of claim 12 wherein each of the plurality of primary connectors is oriented perpendicular to the first surface and second surface of the primary circuit board.
14. The module of claim 12 wherein each of the plurality of daughter connectors is oriented perpendicular to the first surface and second surface of each of the daughter boards.
15. The module of claim 12 wherein each of the primary and daughter connectors align each other and are perpendicular to the first and second surface of the primary and daughter circuit boards, whereby a conductive path is minimized between each of the primary and daughter circuit boards.
16. The module of claim 15 wherein the plurality of primary and daughter circuit connectors are spaced such that a channel is created for airflow between the plurality of primary and daughter connectors.
17. The module of claim 12 wherein each of the plurality of primary connectors is located between the electronic components and the control connector.
18. The module of claim 12 further comprising a plurality of via connections on the primary board and the daughter boards for electrically coupling the electronic components on the first and second surfaces.
19. The module of claim 12 wherein the electronic components are memory integrated circuits.
20. The module of claim 12 further comprising a memory driver mounted on at least one of the primary circuit board and the daughter boards.

1. A method of fabricating a monolithically integrated device comprising:
growing a first set of Group III nitride epitaxial layers on a substrate for a first heterostructure field effect transistor;
depositing a mask layer over the first set of Group III nitride epitaxial layers;
selectively etching the mask layer to remove the mask layer in a first region;
etching the first set of Group III nitride epitaxial layers in the first region; and
growing a second set of Group III nitride epitaxial layers in the first region for a second heterostructure field effect transistor;
wherein etching the first set of Group III nitride epitaxial layers in the first region comprises etching the first set of Group III nitride epitaxial layers in the first region to the substrate.
2. The method of claim 1 wherein etching the first set of Group III nitride epitaxial layers in the first region comprises partially etching the first set of Group III nitride epitaxial layers in the first region.
3. The method of claim 2 wherein partially etching the first set of Group III nitride epitaxial layers comprises etching through an active region of the first set of Group III nitride epitaxial layers.
4. The method of claim 1 wherein:
the first set of Group III nitride epitaxial layers comprise AlN, GaN, or InN or any combination of AlN, GaN, or InN; and
the second set of Group III nitride epitaxial layers comprise AlN, GaN, or InN or any combination of AlN, GaN, or InN.
5. The method of claim 1 wherein the mask layer comprises a photoresist, a metal or a dielectric such as SiO2 or SiN.
6. The method of claim 1 wherein selectively etching the mask layer comprises using a wet chemical or dry plasma-based process.
7. The method of claim 1 wherein etching the first set of Group III nitride epitaxial layers comprises using a wet chemical or dry plasma-based process.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for forming a compact from a powder, comprising the steps of:
applying a solution obtained by dissolving a lubricant in a solvent to a forming portion of a mold body;
evaporating the solution to form a crystallized layer on a surface of the forming portion; filling the forming portion of the mold body with a raw powders; and fitting upper and lower punches into the forming portion.
2. The method for forming a compact from a powder according to claim 1, wherein the lubricant comprises an oxo-acid-based metal salt.
3. The method for forming a compact from a powder according to claim 1, wherein the lubricant is at least one selected from a group consisting of a phosphate metal salt, a sulfate metal salt, a borate metal salt, a silicate metal salt, a tungstate metal salt, an organic-acid-based metal salt, a nitrate metal salt and a carbonate metal salt.
4. The method for forming a compact from a powder according to claim 3, wherein the lubricant is at least one selected from a group consisting of dipotassium hydrogen phosphate, disodium hydrogen phosphate, tripotassium phosphate, trisodium phosphate, potassium polyphosphate, sodium polyphosphate, riboflavin potassium phosphate and riboflavin sodium phosphate.
5. The method for forming a compact from a powder according to claim 3, wherein the lubricant is at least one selected from a group consisting of potassium sulfate, sodium sulfate, potassium sulfite, sodium sulfite, potassium thiosulfate, sodium thiosulfate, potassium dodecyl sulfate, sodium dodecyl sulfate, potassium dodecylbenzensulfonate, sodium dodecylbenzenesulfonate, Food Blue No. 1., Food Yellow No. 5., potassium ascorbyl sulfate and sodium ascorbyl sulfate.
6. The method for forming a compact from a powder according to claim 3, wherein the lubricant is potassium tetraborate or sodium tetraborate.
7. The method for forming a compact from a powder according to claim 3, wherein the lubricant is potassium silicate or sodium silicate.
8. The method for forming a compact from a powder according to claim 3, wherein the lubricant is potassium tungstate or sodium tungstate.
9. The method for forming a compact from a powder according to claim 3, wherein the lubricant is at least one selected from a group consisting of potassium acetate, sodium acetate, potassium benzoate, sodium benzoate, potassium ascorbate, sodium ascorbate, potassium stearate and sodium stearate.
10. The method for forming a compact from a powder according to claim 3, wherein the lubricant is potassium nitrate or sodium nitrate.
11. The method for forming a compact from a powder according to claim 3, wherein the lubricant is at least one of potassium carbonate, sodium carbonate, potassium hydrogen carbonate and sodium hydrogen carbonate.
12. (canceled)
13. The method for forming a compact from a powder according to claim 1, wherein said solution has said lubricant completely dissolved in water to have a concentration greater than or equal to a concentration at which the thickness of a crystallized layer is formed by one molecule of the lubricant, but less than a concentration of a saturated solution.
14. The method for forming a compact from a powder according to claim 13, wherein the lubricant is a potassium salt or a sodium salt.
15. The method for forming a compact from a powder set forth in claim 1, wherein an antiseptic substance is added into the lubricant.
16. The method for forming a compact from a powder set forth in claim 1, wherein a defoaming agent is added into the lubricant.
17. The method for forming a compact from a powder set forth in claim 1, wherein soluble solvent is added into the lubricant.
18. The method for forming a compact from a powder according to claim 17, wherein said solvent is alcohol or ketone.
19. The method for forming a compact from a powder according to claim 1, wherein no halogen element is included in the lubricant.
20. A mold apparatus for powder molding, comprising:
a mold body with a through-hole for forming a side of a compact;
a lower punch for fitting into the through-hole from beneath;
an upper punch for fittingh into the through-hole from above;
a spray pump for spraying a lubricant solution to the through-hole;
a heater provided around a forming portion of the mold body, the forming portion being defined by the through-hole and the lower punch; and
a temperature control system for keeping a temperature of the heater higher than an evaporating temperature of the solution.
21. A mold apparatus for powder molding, comprising:
a mold body with a through-hole for forming a side of a compact;
a lower punch for fitting into the through-hole from beneath;
an upper punch for fitting into the through-hole from above;
a spray pump for spraying a lubricant solution to the through-hole;
a heater provided around a forming portion of the mold body, the forming portion being defined by the through-hole and the lower punch; and
a temperature control system for keeping a temperature of the heater higher than an evaporating temperature of the solution, but lower than a melting temperature of the lubricant.