1460756855-ea26b304-f84b-4d93-829f-cd046d0146e6

1. A Group III nitride semiconductor light-emitting device, comprising:
a substrate including an embossed main surface;
a Group III nitride semiconductor layer formed on the main surface of the substrate; and
non-translucent electrodes which are electrically conducted to the Group III nitride semiconductor layer,
wherein the substrate comprises a heterogeneous substrate having a chemical composition different from that of the Group III nitride semiconductor layer;
wherein the heterogeneous substrate includes a first region including a plurality of protrusions, and a second region including a plurality of protrusions which are arranged at a pitch larger than that of the protrusions in the first region, each of the protrusions of the second region has a hexagonal pyramidal shape,
wherein the second region has a perimeter being included within a region defined by a region perimeter located 6 \u03bcm or less outward from a perimeter of a projection area of each of the non-translucent electrodes as viewed through the main surface of the heterogeneous substrate, and is defined by a region perimeter located 6 \u03bcm or less inward from the perimeter of the projection area,
wherein a portion of the semiconductor layer above the second region exhibits a threading dislocation density higher than that of a portion of the semiconductor layer above the first region, and
wherein light distribution in the second region is larger than light distribution in the first region.
2. The Group III nitride semiconductor light-emitting device according to claim 1, wherein, in the second region, the protrusions located more distant from a boundary between the first region and the second region are arranged at a larger pitch.
3. The Group III nitride semiconductor light-emitting device according to claim 2, wherein a relation of L2=a\xd7L1 and a relation of 1.1\u2266a\u22663 are satisfied, wherein L1 represents a pitch between adjacent protrusions in the first region, and L2 represents a pitch between adjacent protrusions in the second region.
4. The Group III nitride semiconductor light-emitting device according to claim 3, which comprises a transparent electrode, wherein the Group III nitride semiconductor layer includes a p-type contact layer, and the transparent electrode is formed on the p-type contact layer.
5. The Group III nitride semiconductor light-emitting device according to claim 3, wherein at least one of the non-translucent electrodes comprises a pad electrode which is to be electrically conducted to an external electrode.
6. The Group III nitride semiconductor light-emitting device according to claim 5, wherein the non-translucent electrodes comprise a plurality of dot electrodes which are distributed with respect to a light-emitting surface, and one or more wiring electrodes for electrically connecting the dot electrodes to the pad electrodes, the wiring electrodes comprising comb electrodes.
7. The Group III nitride semiconductor light-emitting device according to claim 2, wherein at least one of the non-translucent electrodes comprises a pad electrode which is to be electrically conducted to an external electrode.
8. The Group III nitride semiconductor light-emitting device according to claim 7, wherein the non-translucent electrodes comprise a plurality of dot electrodes which are distributed with respect to a light-emitting surface, and one or more wiring electrodes for electrically connecting the dot electrodes to the pad electrodes, the wiring electrodes comprising comb electrodes.
9. The Group III nitride semiconductor light-emitting device according to claim 2, which comprises a transparent electrode, wherein the Group III nitride semiconductor layer includes a p-type contact layer, and the transparent electrode is formed on the p-type contact layer.
10. The Group III nitride semiconductor light-emitting device according to claim 1, wherein a relation of L2=a\xd7L1 and a relation of 1.1\u2266a\u22663 are satisfied, wherein L1 represents a pitch between adjacent protrusions in the first region, and L2 represents a pitch between adjacent protrusions in the second region.
11. The Group III nitride semiconductor light-emitting device according to claim 10, wherein at least one of the non-translucent electrodes comprises a pad electrode which is to be electrically conducted to an external electrode.
12. The Group III nitride semiconductor light-emitting device according to claim 11, wherein the non-translucent electrodes comprise a plurality of dot electrodes which are distributed with respect to a light-emitting surface, and one or more wiring electrodes for electrically connecting the dot electrodes to the pad electrodes, the wiring electrodes comprising comb electrodes.
13. The Group III nitride semiconductor light-emitting device according to claim 10, which comprises a transparent electrode, wherein the Group III nitride semiconductor layer includes a p-type contact layer, and the transparent electrode is formed on the p-type contact layer.
14. The Group III nitride semiconductor light-emitting device according to claim 1, wherein at least one of the non-translucent electrodes comprises a pad electrode which is to be electrically conducted to an external electrode.
15. The Group III nitride semiconductor light-emitting device according to claim 1, which comprises a transparent electrode, wherein the Group III nitride semiconductor layer includes a p-type contact layer, and the transparent electrode is formed on the p-type contact layer.
16. A Group III nitride semiconductor light-emitting device comprising:
a substrate including an embossed main surface;
a Group III nitride semiconductor layer formed on the main surface of the substrate; and
non-translucent electrodes which are electrically conducted to the Group III nitride semiconductor layer, the non-translucent electrodes comprising a pad electrode, a plurality of dot electrodes which are distributed with respect to a light-emitting surface, and one or more wiring electrodes for electrically connecting the dot electrodes to the pad electrodes, the wiring electrodes comprising comb electrodes,
wherein the substrate comprises a heterogeneous substrate including a chemical composition different from that of the Group III nitride semiconductor layer,
wherein the heterogeneous substrate includes a first region including a plurality of protrusions, and a second region including a plurality of protrusions which are arranged at a pitch larger than that of the protrusions in the first region, and each of the protrusions of the second region has a hexagonal pyramidal shape,
wherein the second region has a perimeter being included within a region defined by a region perimeter located 6 \u03bcm or less outward from a perimeter of a projection area of each of the non-translucent electrodes as viewed through the main surface of the heterogeneous substrate, and is defined by a region perimeter located 6 \u03bcm or less inward from the perimeter of the projection area.
17. A Group III nitride semiconductor light-emitting device, comprising:
a substrate including an embossed main surface;
a Group III nitride semiconductor layer formed on the main surface of the substrate; and
non-translucent electrodes which are electrically conducted to the Group III nitride semiconductor layer,
wherein the substrate comprises a heterogeneous substrate including a chemical composition different from that of the Group III nitride semiconductor layer,
wherein the heterogeneous substrate includes a first region including a plurality of protrusions, and a second region including a plurality of protrusions which are arranged at a pitch larger than that of the protrusions in the first region,
wherein the second region has a perimeter being included within a region defined by a region perimeter located 6 \u03bcm or less outward from a perimeter of a projection area of each of the non-translucent electrodes as viewed through the main surface of the heterogeneous substrate, and is defined by a region perimeter located 6 \u03bcm or less inward from the perimeter of the projection area, and
wherein a region between a projection area of the non-translucent electrodes as viewed through the main surface of the heterogeneous substrate and an edge of the light-emitting device includes the first region.
18. The Group III nitride semiconductor light-emitting device according to claim 17, wherein the first region, the second region, the first region, the second region, and the first region are disposed in order from an edge of the light-emitting device to another edge of the light-emitting device.
19. The Group III nitride semiconductor light-emitting device according to claim 17, wherein the first region is disposed in an outermost portion of the light-emitting device.
20. The Group III nitride semiconductor light-emitting device according to claim 19, wherein, with respect to the first region, the second region is disposed in an inner portion of the light-emitting device.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor element mounting board, comprising:
a board having surfaces;
a semiconductor element mounted on one of the surfaces of the board;
a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board;
a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and
surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer,
wherein each of the surface layers has rigidity higher than that of each of the first and second layers.
2. The semiconductor element mounting board as claimed in claim 1, wherein in the case where a Young’s modulus of each surface layer at 25\xb0 C. is defined as X GPa and a Young’s modulus of the first layer at 25\xb0 C. is defined as Y GPa, the X and the Y satisfy a relation of 0.5\u2266X\u2212Y\u226613.
3. The semiconductor element mounting board as claimed in claim 2, wherein the Young’s modulus of the surface layer at 25\xb0 C. is in the range of 4 to 15 GPa.
4. The semiconductor element mounting board as claimed in claim 2, wherein the Young’s modulus of the first layer at 25\xb0 C. is in the range of 2 to 10 GPa.
5. The semiconductor element mounting board as claimed in claim 1, wherein in the case where a coefficient of thermal expansion of the surface layer in an inplane direction thereof measured based on JIS C 6481 at a temperature of 20\xb0 C. to a glass-transition temperature Tga\xb0 C. thereof, which is measured based on JIS C 6481, is defined as A ppm\xb0 C. and a coefficient of thermal expansion of the first layer in an inplane direction thereof measured based on JIS C 6481 at a temperature of 20\xb0 C. to a glass-transition temperature Tgb\xb0 C. thereof, which is measured based on JIS C 6481, is defined as B ppm\xb0 C., the A and the B satisfy a relation of 0.5\u2266B-A\u226650.
6. The semiconductor element mounting board as claimed in claim 5, wherein the coefficient of thermal expansion of the surface layer in the inplane direction thereof measured based on JIS C 6481 at the temperature of 20\xb0 C. to the glass-transition temperature Tga\xb0 C., which is measured based on JIS C 6481, is 40 ppm\xb0 C. or lower.
7. The semiconductor element mounting board as claimed in claim 5, wherein the coefficient of thermal expansion of the first layer in the inplane direction thereof measured based on JIS C 6481 at the temperature of 20\xb0 C. to the glass-transition temperature Tgb\xb0 C., which is measured based on JIS C 6481, is in the range of 25 to 50 ppm\xb0 C.
8. The semiconductor element mounting board as claimed in claim 1, wherein a glass-transition temperature Tga of the surface layer, which is measured based on JIS C 6481, is in the range of 100 to 300\xb0 C.
9. The semiconductor element mounting board as claimed in claim 1, wherein a glass-transition temperature Tgb of the first layer, which is measured based on JIS C 6481, is in the range of 100 to 250\xb0 C.
10. The semiconductor element mounting board as claimed in claim 1, wherein a Young’s modulus of the board at 25\xb0 C. is in the range of 20 to 50 GPa.
11. The semiconductor element mounting board as claimed in claim 1, wherein a coefficient of thermal expansion of the board in an inplane direction thereof measured based on JIS C 6481 at a temperature of 20\xb0 C. to a glass-transition temperature Tgc\xb0 C. thereof, which is measured based on JIS C 6481, is 13 ppm\xb0 C. or lower.
12. The semiconductor element mounting board as claimed in claim 1, wherein the semiconductor element is mounted on the board through a film.
13. The semiconductor element mounting board as claimed in claim 1, wherein the surface layer is mainly composed of a resin material containing cyanate resin and an inorganic filler.
14. The semiconductor element mounting board as claimed in claim 13, wherein an amount of the resin material contained in the surface layer is in the range of 30 to 70 wt %.
15. The semiconductor element mounting board as claimed in claim 13, wherein an amount of the inorganic filler contained in the surface layer is in the range of 5 to 40 wt %.
16. The semiconductor element mounting board as claimed in claim 13, wherein the resin material further contains epoxy resin, and
wherein in the case where an amount of the cyanate resin contained in the resin material is defined as C wt % and an amount of the epoxy resin contained in the resin material is defined as D wt %, the C and the D satisfy a relation of 0.5\u2266DC\u22664.
17. The semiconductor element mounting board as claimed in claim 13, wherein the resin material further contains phenoxy resin, and
wherein in the case where an amount of the cyanate resin contained in the resin material is defined as C wt % and an amount of the phenoxy resin contained in the resin material is defined as E wt %, the C and the E satisfy a relation of 0.2\u2266EC\u22662.

1460756847-9ab503b0-3446-441c-8268-10285be11721

1. A method for tracking changes in documents exchanged over email applications, the method comprising:
identifying, by a processor implementing a compare service, a first file attached to a first email received via an email application;
comparing, by the compare service, a first identifier associated with the first file to identifiers associated with one or more files previously transmitted via the email application;
identifying a second file from the one or more previously transmitted files that corresponds to the first identifier;
comparing the first file and the second file to identify one or more changes made to contents of the first file in relation to the second file;
based on the comparison, computing a difference value between contents of the first file and the second file; and
displaying the difference value in the email application in relation to an indicator of the first email.
2. The method of claim 1, wherein the difference value is represented as one or more of:
a percentage of difference in contents of the first file in relation to contents of the second file; or
a graphical icon representing difference in contents of the first file in relation to contents of the second file.
3. The method of claim 1, wherein the difference value is displayed as one or more of:
a hovering field when a user directs a pointer over the indicator of the first email;
an embedded field in the email application in relation to the indicator of the first email; or
a change in background color of the indicator of the first email in the email application, where the background color is indicative of a degree of change between contents of the first file and the second file.
4. The method of claim 1, further comprising:
prior to transmitting a given email via the email application, identifying, by the compare service, presence of a given file attachment to the given email;
upon identifying the given file attachment, attaching, by the compare service, a given tag to the given file attachment prior to the email application transmitting the given email.
5. The method of claim 1, wherein the step of comparing the first file and the second file includes one or more of:
comparing a change in formatting;
comparing a change in textual data;
comparing a change in image data; or
comparing a change in presentation-related information when the first file and the second file are slide decks.
6. A method for monitoring attachments in an email application, the method comprising:
identifying, by a processor implementing a compare service, a first file attached to a first email that a user intends to transmit via an email application;
assigning, by the compare service, a first tag to the first file prior to the email application transmitting the first email;
identifying a second file attached to a second email that is received by the email application;
comparing a second tag associated with the second email and the first tag associated with the first file;
comparing the second tag with the first tag;
upon identifying that the second tag matches the first tag, comparing contents of the first file and the second file to identify one or more changes made to contents of the second file in relation to the first file;
based on the comparison of contents of the first file and the second file, computing a difference value between contents of the first file and the second file; and
displaying the difference value in the email application in relation to an indicator of the second email.
7. The method of claim 6, wherein the difference value is represented as one or more of:
a percentage of difference in contents of the second file in relation to contents of the first file; or
a graphical icon representing difference in contents of the second file in relation to contents of the first file.
8. The method of claim 6, wherein the difference value is displayed as one or more of:
a hovering field when a user directs a pointer over the indicator of the second email;
an embedded field in the email application in relation to the indicator of the second email; or
a change in background color of the indicator of the second email in the email application, where the background color is indicative of a degree of change between contents of the first file and the second file.
9. The method of claim 6, further comprising:
maintaining, by the compare service, a compare database, wherein the compare database includes one or more tags identifying corresponding files transmitted via the email application.
10. The method of claim 9, further comprising:
maintaining, by the compare service, a copy of the corresponding files for use in later comparison steps.
11. The method of claim 9, wherein the compare database is local in relation to the email application.
12. The method of claim 9, wherein the compare database is located in a remote server in relation to the email application.
13. The method of claim 6, wherein the step of comparing the first file and the second file includes one or more of:
comparing a change in formatting;
comparing a change in textual data;
comparing a change in image data; or
comparing a change in presentation-related information when the first file and the second file are slide decks.
14. The method of claim 6, further comprising:
generating a report file, wherein the report file is a redline representation of the comparison of the first and second files; and
including the report file as an attachment to the first email.
15. The method of claim 6, further comprising:
generating a report file, wherein the report file is a redline representation of the comparison of the first and second files; and
embedding contents of the report file directly within a body of the first email.
16. A system for tracking changes in documents exchanged over email applications, the system comprising:
a receiving module configured to identify a first file attached to a first email received via an email application;
a matching module configured to:
compare a first identifier associated with the first file to identifiers associated with one or more files previously transmitted via the email application; and
identify a second file from the one or more previously transmitted files that corresponds to the first identifier;

a comparing module configured to compare the first file and the second file to identify one or more changes made to contents of the first file in relation to the second file; and
a reporting module configured to:
based on the comparison, compute a difference value between contents of the first file and the second file; and
display the difference value in the email application in relation to an indicator of the first email.
17. The system of claim 16, wherein the difference value is represented as one or more of:
a percentage of difference in contents of the first file in relation to contents of the second file; or
a graphical icon representing difference in contents of the first file in relation to contents of the second file.
18. The system of claim 16, wherein the difference value is displayed as one or more of:
a hovering field when a user directs a pointer over the indicator of the first email;
an embedded field in the email application in relation to the indicator of the first email; or
a change in background color of the indicator of the first email in the email application, where the background color is indicative of a degree of change between contents of the first file and the second file.
19. The system of claim 16, wherein the receiving module is further configured to identify, prior to transmitting a given email via the email application, presence of a given file attachment to the given email, and wherein the system further comprises:
a tagging module configured to attach, upon identifying the given file attachment, a given tag to the given file attachment prior to the email application transmitting the given email.
20. The system of claim 16, wherein the step of comparing the first file and the second file, as executed by the comparing module, includes one or more of:
comparing a change in formatting;
comparing a change in textual data;
comparing a change in image data; or
comparing a change in presentation-related information when the first file and the second file are slide decks.
21. The system of claim 16, wherein the reporting module is further configured to:
generate a report file, wherein the report file is a redline representation of the comparison of first and second files; and
include the report file as an attachment to the first email.
22. The system of claim 16, wherein the reporting module is further configured to:
generate a report file, wherein the report file is a redline representation of the comparison of the first and second files; and
embed contents of the report file directly within a body of the first email.
23. A system for monitoring attachments in an email application, the system comprising:
a processor;
a memory configured to store a set of instructions, which when executed by the processor cause the system to perform a method, the method including:
identifying, by a processor implementing a compare service, a first file attached to a first email that a user intends to transmit via an email application;
assigning, by the compare service, a first tag to the first file prior to the email application transmitting the first email;
identifying a second file attached to a second email that is received by the email application;
comparing a second tag associated with the second email and the first tag associated with the first file;
comparing the second tag with the first tag;
upon identifying that the second tag matches the first tag, comparing contents of the first file and the second file to identify one or more changes made to contents of the second file in relation to the first file;
based on the comparison of contents of the first file and the second file, computing a difference value between contents of the first file and the second file; and
displaying the difference value in the email application in relation to an indicator of the second email.
24. The system of claim 23, wherein the difference value is represented as one or more of:
a percentage of difference in contents of the second file in relation to contents of the first file; or
a graphical icon representing difference in contents of the second file in relation to contents of the first file.
25. The system of claim 23, wherein the difference value is displayed as one or more of:
a hovering field when a user directs a pointer over the indicator of the second email;
an embedded field in the email application in relation to the indicator of the second email; or
a change in background color of the indicator of the second email in the email application, where the background color is indicative of a degree of change between contents of the first file and the second file.
26. The system of claim 23, wherein the step of comparing the first file and the second file includes one or more of:
comparing a change in formatting;
comparing a change in textual data;
comparing a change in image data; or
comparing a change in presentation-related information when the first file and the second file are slide decks.
27. The system of claim 23, wherein the method further comprises:
generating a report file, wherein the report file is a redline representation of the comparison of the first and second files; and
including the report file as an attachment to the first email.
28. The system of claim 23, wherein the method further comprises:
generating a report file, wherein the report file is a redline representation of the comparison of the first and second files; and
embedding contents of the report file directly within a body of the first email.
29. A system for tracking changes in documents exchanged over email applications, the system comprising:
receiving means for identifying a first file attached to a first email received via an email application;
matching means for:
comparing a first identifier associated with the first file to identifiers associated with one or more files previously transmitted via the email application; and
identifying a second file from the one or more previously transmitted files that corresponds to the first identifier;

comparing means for comparing the first file and the second file to identify one or more changes made to contents of the first file in relation to the second file; and
reporting means for:
based on the comparison, computing a difference value between contents of the first file and the second file; and
displaying the difference value in the email application in relation to an indicator of the first email.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A caster wheel and ring assembly comprising a caster wheel; said caster wheel being spherical in shape; an inner housing; said inner housing being cylindrical in shape; said caster wheel being mounted freely rotatably within said inner housing; a cap; said cap having a cylindrical interior; a plurality of ball bearings; said plurality of ball bearings being disposed within said cap; said inner housing being rotatably mounted within said plurality of ball bearings within said cap.
2. The caster wheel and ring assembly of claim 1 wherein a plurality of said caps is provided as a kit such that said plurality of said caps may be affixed to the legs of a pre-existing chair on an aftermarket basis.
3. The caster wheel and ring assembly of claim 1 wherein a plurality of said caps is provided, and further comprising a chair; said chair having a plurality of legs; each of said plurality of legs terminating in and being affixed to one of said plurality of said caps.
4. The caster wheel and ring assembly of claim 3 wherein said chair is stackable.
5. The caster wheel and ring assembly of claim 3 wherein said chair is made of rigid plastic.
6. The caster wheel and ring assembly of claim 5 wherein said chair is made of rigid plastic.
7. Method of use of the caster wheel and ring assembly of claim 3 comprising sitting in said chair, moving said chair across said chair’s environment, and being unable to lean back in said chair.
8. Method of use of the caster wheel and ring assembly of claim 4 comprising sitting in said chair, moving said chair across said chair’s environment, and being unable to lean back in said chair.
9. Method of use of the caster wheel and ring assembly of claim 5 comprising sitting in said chair, moving said chair across said chair’s environment, and being unable to lean back in said chair.
10. Method of use of the caster wheel and ring assembly of claim 6 comprising sitting in said chair, moving said chair across said chair’s environment, and being unable to lean back in said chair.