1460754549-503456b2-fa58-44a6-88e3-73651be9121c

1. A connection module for a portable device, the connection module comprising:
a case having an upper portion and a lower portion:
an upper plug connection terminal unit having a plurality of upper connection terminals disposed along the upper portion;
a lower plug connection terminal unit having a plurality of lower connection terminals disposed along the lower portion, the plurality of lower connection terminals being spaced apart from the plurality of upper connection terminals and alternately arranged at staggered positions such that the plurality of upper and lower connection terminals engage each other when positioned on a same plane; and
an outer case surrounding the case and upper and lower plug terminal units and having a stopper protruding downward from the upper surface of the outer case and corresponding to placement of the plurality of upper and lower connection terminals.
2. The connection module according to claim 1, wherein the case includes an installation case to which the upper plug connection terminal unit and the lower plug connection terminal unit are disposed.
3. The connection module according to claim 2, wherein the installation case includes an insert molded upper mount that exposes a lower surface of each of the plurality of upper connection terminals.
4. The connection module according to claim 3, wherein the installation case includes a lower mount having a lower insertion groove into which each of the plurality of lower connection terminals are assembled.
5. The connection module according to claim 4, wherein a length of the insert molded upper mount is greater than a length of the lower mount.
6. The connection module according to claim 2, wherein the case further includes the outer case surrounding the installation case.
7. The connection module according to claim 6, further comprising a plug coupling receiving passageway disposed on the outer case.
8. A connection module for a portable device, the connection module comprising:
a case having an upper portion with a plurality of upper terminal exposure grooves and a lower portion with a plurality of lower installation grooves such that the plurality of upper exposure grooves and the plurality of lower installation grooves are alternately staggered with respect to each other;
an upper plug connection terminal unit having a plurality of upper connection terminals disposed along a lower surface of the upper portion and inserted into the plurality of upper terminal exposure grooves; and
a lower plug connection terminal unit having a plurality of lower connection terminals disposed along an upper surface of the lower portion and inserted into the plurality of lower terminal exposure grooves and having a length less than a length of the plurality of upper connection terminals, the plurality of lower connection terminals being spaced apart from the plurality of upper connection terminals and alternately arranged at staggered positions such that the plurality of upper and lower connection terminals engage each other when positioned on a same plane.
9. The connection module according to claim 1, wherein a distance between each of the plurality of upper connection terminals corresponds to a width of the plurality of lower connection terminals installed to the lower portion of the case.
10. The connection module according to claim 9, wherein the plurality of lower connection terminals disposed along the lower portion of the case have a length less than a length of the plurality of upper connection terminals disposed along the upper portion of the case.
11. The connection module according to claim 8, wherein the upper portion has a length corresponding to that of the upper connection terminals and is configured to expose lower surfaces of the plurality of upper connection terminals.
12. The connection module according to claim 10, wherein each of the plurality of lower connection terminals includes a front end having a downwardly bulged curved surface.
13. The connection module according to claim 10, wherein the plurality of lower connection terminals are securely fit in the case.
14. The connection module according to claim 1, further comprising a support extends horizontally from a rear end of the upper portion and being bent downward to extend along a rear surface of the outer case.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for plasma dicing a substrate, the method comprising:
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
providing the substrate having a top surface and a bottom surface, the top surface of the substrate having a plurality of device structures and street areas, the plurality of device structures having a protective material while the street areas remain unprotected, the substrate being mounted on a support film on a frame to form a work piece;
providing an electrostatic chuck within said work piece support;
loading the work piece with the protected plurality of device structures and the unprotected street areas on the top surface of the substrate facing upward onto the work piece support;
generating a plasma through the plasma source;
etching the unprotected street areas on the top surface of the substrate of the work piece through the generated plasma;
providing an RF power source coupled to the work piece support, said RF power source generating an RF frequency to the substrate during the plasma etching step;
varying the RF frequency from 100’s of MHz down to a few hundred kHz during the plasma etching step;
electrostatically clamping a portion of the support film that is exposed to the generated plasma during the plasma etching step using said electrostatic chuck;
electrostatically clamping the substrate during the plasma etching step using said electrostatic chuck;
cooling the portion of the support film that is exposed to the generated plasma during the plasma etching step through said electrostatic chuck during the plasma etching step; and
cooling the bottom surface of the substrate through said electrostatic chuck during the plasma etching step.
2. The method according to claim 1 further comprising:
pulsing the RF power at a low frequency as an interface between the substrate and the support film is approached during the plasma etching step.
3. The method according to claim 1 further comprising providing an RF power source coupled to at least one electrode of the electrostatic chuck, said RF power source generating an RF frequency to the substrate during the plasma etching step.
4. The method according to claim 3 further comprising a coupling capacitor.
5. A method for plasma dicing a substrate, the method comprising:
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
providing the substrate having a top surface and a bottom surface, the top surface of the substrate having a plurality of device structures and street areas, the plurality of device structures having an integrated protective material while the street areas remain unprotected, the substrate; being mounted on a support film on a frame to form a work piece;
providing an electrostatic chuck within said work piece support;
loading the work piece with the protected plurality of device structures and the unprotected street areas on the top surface of the substrate facing upward onto the work piece support;
generating a plasma through the plasma source;
etching the unprotected street areas on the top surface of the substrate of the work piece through the generated plasma;
providing an RF power source coupled to the work piece support, said RF power source generating an RF frequency to the substrate during the plasma etching step;
varying the RF frequency from 100’s of MHz down to a few hundred kHz during the plasma etching step;
electrostatically clamping a portion of the support film that is exposed to the generated plasma during the plasma etching step using said electrostatic chuck;
electrostatically clamping the substrate during the plasma etching step using said electrostatic chuck;
cooling the portion of the support film that is exposed to the generated plasma during the plasma etching step through said electrostatic chuck during the plasma etching step; and
cooling the bottom surface of the substrate through said electrostatic chuck during the plasma etching step.
6. The method according to claim 5 further comprising:
pulsing the RF power at a low frequency as an interface between the substrate and the support film is approached during the plasma etching step.
7. The method according to claim 5 further comprising providing an RF power source coupled to at least one electrode of the electrostatic chuck, said RF power source generating an RF frequency to the substrate during the plasma etching step.
8. The method according to claim 7 further comprising a coupling capacitor.
9. A method for plasma dicing a substrate, the method comprising:
providing a process chamber having a wall;
providing a plasma source adjacent to the wall of the process chamber;
providing a work piece support within the process chamber;
providing the substrate having a top surface and a bottom surface, the top surface of the substrate having a plurality of device structures and street areas, the substrate being mounted on a support film on a frame to form a work piece;
providing an electrostatic chuck within said work piece support;
applying photoresist to the plurality of device structures and the street areas on the top surface of the substrate;
patterning the applied photoresist to allow the street areas to be unprotected;
loading the work piece with the protected plurality of device structures and the unprotected street areas on the top surface of the substrate facing upward onto the work piece support;
generating a plasma through the plasma source;
etching the unprotected street areas on the top surface of the substrate of the work piece through the generated plasma;
providing an RF power source coupled to the work piece support, said RF power source generating an RF frequency to the substrate during the plasma etching step;
varying the RF frequency from 100’s of MHz down to a few hundred kHz during the plasma etching step;
electrostatically clamping a portion of the support film that is exposed to the generated plasma during the plasma etching step using said electrostatic chuck;
electrostatically clamping the substrate during the plasma etching step using said electrostatic chuck;
cooling the portion of the support film that is exposed to the generated plasma during the plasma etching step through said electrostatic chuck during the plasma etching step; and
cooling the bottom surface of the substrate through said electrostatic chuck during the plasma etching step.
10. The method according to claim 9 further comprising:
pulsing the RF power at a low frequency as an interface between the substrate and the support film is approached during the plasma etching step.
11. The method according to claim 9 further comprising providing an RF power source coupled to at least one electrode of the electrostatic chuck, said RF power source generating an RF frequency to the substrate during the plasma etching step.
12. The method according to claim 11 further comprising a coupling capacitor.

1460754541-9bdffb5f-9b08-42ae-b9db-763112005ba7

We claim:

1. A suction muffler for a hermetic sealed reciprocating compressor which comprises (i) a muffling chamber having a body of a synthetic polymeric material and (ii) a synthetic polymeric perforated tube passing through the muffling chamber carrying refrigerant fluid from the suction tube of the compressor to the suction port on the valve plate of a cylinder in which a piston reciprocates.
2. A suction muffler for a hermetic reciprocating compressor as claimed in claim 1, in which the diameter of the perforated tube varies from 0.1 to 1.
3. A suction muffler for a hermetic reciprocating compressor as claimed in claim 1, in which the number of perforations in the perforated tube vary from 4 to 120.
4. A suction muffler for a hermetically sealed compressor as claimed in claim 1 , in which the diameter of the perforations of the muffler tube vary from 0.01 to 0.25
5. A suction muffler for a hermetically sealed compressor as claimed in claim 1, in which a drain hole is provided at the bottom of the muffler chamber to drain lubricating oil present along with refrigerant fluid flowing through the muffler.
6. A suction muffler for a hermetically sealed compressor as claimed in claim 1, in which the perforated tube diverges at least 10 percent along its length from its inlet to its outlet.
7. A suction muffler for a hermetically sealed compressor as claimed in claim 1, in which the perforated tube and the muffling chamber are integrally molded as two separate halves joined together by bonding or ultrasonic welding.
8. A suction muffler for a hermetically sealed compressor as claimed in claim 1, in which the perforated tube has a projection tongue near its outlet end for mounting the muffler in a complementary slot formed in the cylinder head such that the muffler outlet is in fluid tight communication with the suction port on the valve plate.
8. A method of mounting a muffler directly in a cylinder head of a hermetically sealed compressor comprising the steps of:
i forming a projection tongue on the muffler tube;
ii forming a slot on the cylinder head complementary to the projection formed on the muffler tube; and
iii mounting the muffler in the cylinder head by press fitting the projection on the muffler tube into the slot in the cylinder head.
9. A hermetically sealed compressor which comprises a motor compressor assembly mounted in a shell which includes a cylinder head and a muffler in which the muffler is fitted to the cylinder head by means of a male projection formed on the muffler tube and a complementary slot formation provided in the cylinder head and clamped over by the pressure of a valve plate.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of providing a retrofit component for an appliance comprising the steps of:
removing a mechanical component from an appliance; and
replacing the removed mechanical component with a new mechanical component that is operable to provide power to a separate electrical device.
2. The method of providing a retrofit component as claimed in claim 1, further comprising another step of providing an interface for receiving power.
3. The method of providing a retrofit component as claimed in claim 1, further comprising another step of providing an electrical service.
4. The method of providing a retrofit component as claimed in claim 1, further comprising another consumer electronic device independently operable from said new mechanical component.
5. The method of providing a retrofit component as claimed in claim 1, further comprising the step of offering said new mechanical component for sale to a customer.
6. The method of providing a retrofit component as claimed in claim 1, wherein said separate electrical device is a portable consumer electric device.
7. The method of providing a retrofit component as claimed in claim 1, further comprising the step of supplying documentation about the retrofit component to a customer.
8. The method of providing a retrofit component as claimed in claim 1, wherein said new mechanical component has a function that is in addition to a function of the mechanical component.
9. The method of providing a retrofit component as claimed in claim 1, wherein the new mechanical component is one of a handle, a hinge, an appliance surface, trim component, drip pan, ice dispenser, and badge.
10. A method of providing a retrofit component for an appliance comprising the steps of:
offering a retrofit component for sale to a customer;
supplying the retrofit component to a customer; and
wherein the retrofit component is a mechanical component that is configured to have a consumer electronic device associated therewith.
11. The method of providing a retrofit component as claimed in claim 10, further comprising the step of supplying information to a customer about how to install the retrofit component.
12. The method of providing a retrofit component as claimed in claim 10, wherein the retrofit component is one of a handle, trim member, water dispenser, a hinge, an appliance surface, and a logo.
13. The method of providing a retrofit component as claimed in claim 10, further comprising the step of providing an electrical source in communication with said retrofit component.
14. The method of providing a retrofit component as claimed in claim 10, further comprising the step of providing another consumer electric device.
15. A method of providing a retrofit component for a host comprising the steps of:
removing a mechanical component from a host; and
replacing the removed mechanical component with a new mechanical component that is operable to provide power to a consumer electronic device.
16. The method of providing a retrofit component as claimed in claim 15, wherein said host is an appliance.
17. The method of providing a retrofit component as claimed in claim 15, wherein said new mechanical component includes an adapter for receiving said consumer electronic device.
18. The method of providing a retrofit component as claimed in claim 15, further comprising the step of providing an electrical source in communication with said new mechanical component.
19. The method of providing a retrofit component as claimed in claim 15, further comprising the step of providing instructions to a consumer so as to inform the consumer on how to replace the removed mechanical component with a new mechanical component.
20. The method of providing a retrofit component as claimed in claim 15, further comprising the step of providing another consumer electronic device that receives a service from said new mechanical component.
21. A method of providing a retrofit component for a component of an appliance having a useful function comprising the steps of:
offering a retrofit component for sale to a customer;
supplying the retrofit component to a customer;
supplying information to a customer about how to install the retrofit component; and
wherein the retrofit component supplies the useful function and a different user function unrelated to the appliance.
22. The method of claim 21 wherein the useful function is one of delivering media content, component holding, component charging, and component storage.
23. The method of claim 22 further comprising the steps of:
offering other components for sale that can be affixed to the retrofit component;
supplying the other components to a customer; and
supplying information to a customer about how to affix the other component to the retrofit component.