1. Unshaped refractories consisting essentially of:
fine particles having a diameter less than 0.75mm; and,
aggregate mixed into the fine particles having a diameter between 0.75mm and 10mm;
wherein the fine particles have MgO content between 10 mass % and 35 mass % of the entire amount of the fine particles,
wherein the fine particles have Al2O3 and MgO content as sum total mass %, being between 90% and 100% of the entire amount of the fine particles,
wherein the fine particles consist essentially of particles made of 0.5-10 mass % of alumina cement based on the total mass of the unshared refractories and periclase-spinel as a mineral-phase in a raw material used as a source of MgO containing 40-8 0 mass % of MgO and the main remainder of Al2O3, to total mass 100% of the raw material used as the source of MgO, and wherein content of the particle of the periclase-spinel is between 5 mass % and 40 mass, to 100% of the whole amount of the unshaped refractories, and
wherein the aggregate consists essentially of at least one particle selected from the group consisting of alumina and spinel.
2. Unshaped refractories consisting of:
fine particles having a diameter less than 0.75mm; and,
aggregate mixed into the fine particles having a diameter between 0.75mm and 10mm;
wherein the fine particles have MgO content between 10 mass % and 35 mass % of the entire amount of the fine particles,
wherein the fine particles have Al2O3 and MgO content as sum total mass %, being between 90% and 100% of the entire amount of the fine particles,
wherein the fine particles consist essentially of particles made of 0.5-10 mass % of alumina cement based on the total mass of the unshaped refractories and periclase-spinel as a mineral-phase in a raw material used as a source of MgO containing 40-80 mass % of MgO and the main remainder of Al2O3, to total mass 100% of the raw material used as the source of MgO, and wherein content of the particle of the periclase-spinel is between 5 mass % and 40 mass, to 100% of the whole amount of the unshaped refractories, and
wherein the aggregate consists essentially of at least one particle selected from the group consisting of alumina and spinel.
3. The unshaped refractories according to claim 1, wherein the fine particles further include 0.2-2 mass % of amorphous silica based on the total mass of the unshaped refractories.
4. The unshaped refractories according to claim 2, wherein the fine particles further include 0.2-2 mass % of amorphous silica based on the total mass of the unshaped refractories.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An inkjet printhead comprising:
a plurality of inkjet nozzles arranged in nozzle rows, each nozzle row having a respective row of drive transistors, wherein drive transistors corresponding to one nozzle row are interleaved with drive transistors corresponding to an adjacent nozzle row.
2. The inkjet printhead of claim 1, wherein each inkjet nozzle comprises a nozzle chamber and an associated actuator for ejection of ink from the nozzle chamber, wherein each actuator is supplied with power by a respective one of said drive transistors.
3. The inkjet printhead of claim 1, wherein each drive transistor extends away from a respective nozzle chamber.
4. The inkjet printhead of claim 1, wherein said plurality of inkjet nozzles are arranged in pairs of nozzle rows, each pair of nozzle rows being spaced apart from an adjacent pair of nozzle rows.
5. The inkjet printhead of claim 4, wherein each pair of nozzle rows comprises opposed pairs of nozzle chambers, each opposed pair of nozzle chambers having a respective pair of drive transistors extending away from either side of said opposed pair of nozzle chambers.
6. The inkjet printhead of claim 4, wherein all nozzles in one pair of nozzle rows are supplied with a same colored ink.
7. The inkjet printhead of claim 1, which is comprised of MEMS inkjet nozzles disposed on a passivation layer of a substrate.
8. The inkjet printhead of claim 7, wherein said drive transistors are disposed in a CMOS layer of said substrate.
9. The inkjet printhead of claim 8, wherein a plurality of ink supply channels are defined through a thickness of said substrate for supplying ink to said plurality of inkjet nozzles.
10. The inkjet printhead of claim 1, which is comprised of a plurality of abutting printhead integrated circuits.