Author: claimsbot

1. A computer-implemented method for determining whether an electronic check image is suitable for image quality analysis, comprising the steps of:
reading, by a computer, an electronic check image comprising a plurality of tags;
determining, by the computer, whether the plurality of tags meet a tag standard;
in response to determining that the plurality of tags do not meet the tag standard, determining, by the computer, that the electronic check image is not suitable for image quality analysis;
in response to determining that the plurality of tags meet the tag standard, determining, by the computer, that the electronic check image is suitable for image quality analysis and performing an image quality analysis on the electronic check image to produce an image quality value;
determining, by the computer, an intended purpose of the electronic check image;
reading, by the computer, an image quality threshold based on the intended purpose of the electronic check image;
comparing, by the computer, the image quality threshold with the image quality value;
in response to determining that the image quality value does not meet the image quality threshold, performing, by the computer, an image usability analysis on the electronic check image and reading an image confidence score based on the image usability analysis; and
creating, by the computer, an image composite score based on the image confidence score and the image quality value.
2. The method according to claim 1, wherein the step of determining whether the plurality of tags meet the tag standard comprises the steps of:
determining, by the computer, whether the plurality of tags comprise a predetermined selection of at least one mandatory tag; and
in response to determining that the plurality of tags do not comprise the predetermined selection of at least one mandatory tag, determining, by the computer, that the plurality of tags do not meet the tag standard.
3. A computer-implemented method for determining whether an electronic check image is suitable for image quality analysis, comprising the steps of:
reading, by a computer, an electronic check image comprising a plurality of tags;
determining, by the computer, whether the plurality of tags meet a tag standard; and
in response to determining that the plurality of tags do not meet the tag standard, determining, by the computer, that the electronic check image is not suitable for image quality analysis, wherein determining whether the plurality of tags meet the tag standard comprises
determining, by the computer, whether the plurality of tags comprise any optional tags;
in response to determining that the plurality of tags comprise any optional tags, determining, by the computer, whether any optional tag in the plurality of tags is invalid; and
in response to determining that any optional tag in the plurality of tags is invalid, determining, by the computer, that the plurality of tags do not meet the tag standard.
4. The method according to claim 3, further comprising the step of:
in response to determining that no optional tag in the plurality of tags is invalid, determining, by the computer, that the plurality of tags meet the tag standard.
5. The method according to claim 1, wherein the step of determining that the electronic check image is not suitable for image quality analysis further comprises the step of assigning, by the computer, a failure value to the electronic check image.
6. The method according to claim 5, further comprising the step of reporting, by the computer, the failure value to an entity that created the electronic check image.
7. The method according to claim 5, further comprising the step of storing, by the computer, the failure value in a database.
8. A computer-implemented method for determining whether an electronic check image is suitable for image quality analysis, comprising the steps of:
reading, by a computer, an electronic check image comprising a plurality of tags;
determining, by the computer, whether the plurality of tags comprise a predetermined selection of at least one mandatory tag;
in response to determining that the plurality of tags do not comprise the predetermined selection of at least one mandatory tag, determining, by the computer, that the electronic check image is not suitable for image quality analysis;
in response to determining that the plurality of tags comprise the predetermined selection of at least one mandatory tag, determining, by the computer, that the electronic check image is suitable for image quality analysis and performing an image quality analysis on the electronic check image to produce an image quality value;
determining, by the computer, an intended purpose of the electronic check image;
reading, by the computer, an image quality threshold based on the intended purpose of the electronic check image;
comparing, by the computer, the image quality threshold with the image quality value;
in response to determining that the image quality value does not meet the image quality threshold, performing, by the computer, an image usability analysis on the electronic check image and reading an image confidence score based on the image usability analysis; and
creating, by the computer, an image composite score based on the image confidence score and the image quality value.
9. A computer-implemented method for determining whether an electronic check image is suitable for image quality analysis, comprising the steps of:
reading, by a computer, an electronic check image comprising a plurality of tags;
determining, by the computer, whether the plurality of tags comprise a predetermined selection of at least one mandatory tag;
in response to determining that the plurality of tags do not comprise the predetermined selection of at least one mandatory tag, determining, by the computer, that the electronic check image is not suitable for image quality analysis;
in response to determining that the plurality of tags comprise the predetermined selection of at least one mandatory tag, determining, by the computer, whether the plurality of tags comprise any optional tags;
in response to determining that the plurality of tags comprise any optional tags, determining, by the computer, whether any optional tag in the plurality of tags is invalid; and
in response to determining that any optional tag in the plurality of tags is invalid, determining, by the computer, that the electronic check image is not suitable for image quality analysis.
10. The method according to claim 9, further comprising the steps of:
in response to determining that no optional tag in the plurality of tags is invalid, determining, by the computer, that the electronic check image is suitable for image quality analysis.
11. The method according to claim 8, wherein the step of determining not to perform an image quality analysis on the electronic check image further comprises the step of assigning, by the computer, a failure value to the electronic check image.
12. The method according to claim 11, further comprising the step of reporting, by the computer, the failure value to an entity that created the electronic check image.
13. The method according to claim 11, further comprising the step of storing, by the computer, the failure value in a database.
14. A system for determining whether an electronic check image is suitable for image quality analysis, comprising:
a communications network; and
a processor configured to
receive an electronic check image via the communications network, the electronic check image comprising a plurality of tags,
determine whether the plurality of tags comprise any optional tags,
in response to determining that the plurality of tags comprise any optional tags, determine whether any optional tag in the plurality of tags is invalid,
in response to determining that any optional tag in the plurality of tags is invalid, determine that the plurality of tags do not meet the tag standard, and
in response to determining that the plurality of tags do not meet the tag standard, determine that the electronic check image is not suitable for image quality analysis.
15. The system according to claim 14, wherein the processor is further configured to, in response to determining that no optional tag in the plurality of tags is invalid, determine that the plurality of tags meet the tag standard.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An ion implanting system comprising:
an x-axis rotating part for rotating a main surface of a wafer holder about an x-axis;
a y-axis rotating part for rotating the main surface of the wafer holder about a y-axis;
a first angle measuring device structured to be moved along with the main surface of the wafer holder, the first angle measuring device for measuring a tilt angle with respect to the x-axis of the main surface of the wafer holder, the first angle measuring device comprising:
a first faraday cup having a slot and a beam sensing region corresponding to the slot, the first faraday cup mounted on the x-axis rotating part at an angle that is offset by an amount equal to a target tilt angle, from a line perpendicular to the main surface of the wafer,
a first meter for measuring an amount of current provided to the beam sensing region, the current in the beam sensing region for controlling and neutralizing secondary electrons generated by collisions of an ion beam with the beam sensing region of first faraday cup;

a second angle measuring device structured to be moved along with the main surface of the wafer holder, the second angle measuring device for measuring a rotation angle with respect to the y-axis of the main surface of the wafer holder; and
a controller coupled to the first angle measuring device and the second angle measuring device, the controller structured to, when the measured tilt and measured rotation angles are different from the target tilt angle and a target rotation angle, control the x- and y-axis rotating parts until the measured tilt and measured rotation angles are equal to the target tilt and target rotation angles.
2. The system as claimed in claim 1 wherein the beam sensing region of the first faraday cup is perpendicular to the ion beam when the main surface of the wafer holder is tilted to the target tilt angle.
3. The system as claimed in claim 1, wherein the controller, when the ion beam is projected perpendicularly against an entire surface of the beam sensing region of the first faraday cup, is structured to control the x-axis rotating part based on the current measured by the first meter.
4. The system as claimed in claim 1, wherein the second angle measuring device comprises:
a second faraday cup having a slot and a beam sensing region corresponding to the slot; and
a second meter for measuring an amount of current provided to the beam sensing region of the second faraday cup, the current in the beam sensing region for controlling and neutralizing secondary electrons generated by collisions of an ion beam with the beam sensing region of the second faraday cup.
5. The system as claimed in claim 4, wherein the second faraday cup is fixedly mounted to either the y-axis rotating part or the x-axis rotating part.
6. The system as claimed in claim 4, wherein the beam sensing region of the second faraday cup is perpendicular to the ion beam when the main surface of the wafer is tilted to the target tilt angle.
7. The system as claimed in claim 4, wherein the beam sensing region of the second faraday cup is parallel to the main surface of the wafer holder on the x-axis.
8. The system as claimed in claim 4, wherein the controller, when the ion beam is projected perpendicularly against the entire surface of the beam sensing region of the second faraday cup, is structured to control the y-axis rotating part based on the current measured by the second meter.
9. The system as claimed in claim 1, wherein a wafer is affixed to the wafer holder.
10. The system as claimed in claim 9, wherein the wafer holder is fixed to the x-axis rotating part.
11. A wafer holding apparatus for an ion implanting system comprising:
a holding member to which a wafer can be affixed;
an x-axis rotating part for tilting the holding member on an x-axis with respect to an incidence direction of an ion beam;
a y-axis rotating part for rotating the holding member on a y-axis with respect to the incidence direction of the ion beam;
a measuring system for measuring the ion beam and mounted so as to be moved along with the holding member by the x- and y-axis rotating parts, the measuring system comprising:
a first faraday cup having a slot and a conductive plate against which the ion beam can be projected through the slot, the first faraday cup fixed to and mounted on the x-axis rotating part, wherein when a main surface of the wafer is tilted from the ion beam by an incidence angle \u03b1, the conductive plate in the first faraday cup is perpendicular to the ion beam,
a second faraday cup having a slot and a conductive plate against which the ion beam can be projected through the slot, the second faraday cup fixed to and mounted on the y-axis rotating part,
a first meter for measuring an amount of current provided to the conductive plate of the first faraday cup, the current in the conductive plate for controlling and neutralizing secondary electrons generated by collisions of an ion beam with the conductive plate of the first faraday cup, and
a second meter for measuring an amount of current provided to the conductive plate of the second faraday cup, the current in the conductive plate for controlling and neutralizing secondary electrons generated by collisions of the ion beam with the conductive plate of the second faraday cup; and

a controller for comparing data measured by the measuring system to pre-set data and, according to the result of the comparison, compensating a position of the holding member relative to the ion beam.
12. The apparatus as claimed in claim 11, wherein the controller, when the ion beam is projected perpendicularly against the conductive plate of the first faraday cup, is structured to control the x-axis rotating part such that a current value measured by the first meter reaches a first reference value.
13. The apparatus as claimed in claim 12, wherein the controller, when the ion beam is projected perpendicularly against the conductive plate of the second faraday cup, is structured to control the y-axis rotating part such that a current value measured by the second meter reaches a second reference value.
14. The apparatus as claimed in claim 11, wherein the controller, during an ion implantation into the wafer, compares accumulated current values, obtained by accumulating the current values measured by the first and second meters, to pre-set data.
15. The apparatus as claimed in claim 11, wherein the first and second faraday cups are respectively mounted on the x-axis and y-axis rotating parts so as to be parallel to the ion beam when the wafer holding apparatus is at a desired position relative to the ion beam.
16. The apparatus as claimed in claim 15, wherein, when the wafer holding apparatus is positioned to the desired position, the ion beam is projected perpendicularly against the conductive plates of the first and second faraday cups.
17. The apparatus as claimed in claim 11, wherein the second faraday cup is parallel on the y-axis to a main surface of the wafer fixed to the wafer holding apparatus.
18. The apparatus as claimed in claim 11, wherein the first faraday cup is mounted at a predetermined angle with respect to the x-axis.
19. The apparatus as claimed in claim 18, wherein the first faraday cup is tilted on the x-axis by an angle equal to an incidence angle \u03b1 of the ion beam against the main surface of the wafer.
20. The apparatus as claimed in claim 19, wherein the first faraday cup is tilted by between about 2 to 8 degrees.
21. An ion implantation system, comprising:
a wafer holder having a wafer holding surface structured to hold a wafer in an ion beam, the wafer holder tiltable on an x-axis and rotatable on a y-axis relative to the ion beam;
a measuring system mounted to the wafer holder and structured to measure a number of ions striking a beam sensor and to generate a measuring signal; and
a feedback controller coupled to the measuring system and structured to tilt and rotate the wafer holder based on the measuring signal.
22. An ion implantation system, comprising:
a wafer holder having a wafer holding surface structured to hold a wafer in an ion beam, the wafer holder tiltable on an x-axis and rotatable on a y-axis relative to the ion beam, wherein, when the wafer holder is in a target position, the wafer holding surface is tilted from a line perpendicular to the ion beam by an incidence angle \u03b1;
a faraday cup having an opening and structured to measure a number of ions striking a beam sensor that is mounted in the faraday cup perpendicular to the opening and to generate a measuring signal, wherein the faraday cup is mounted such that, when the wafer holding surface of the wafer holder is tilted, the faraday cup is also tilted; and
a feedback controller coupled to the beam sensor and structured to tilt and rotate the wafer holder based on the measuring signal.
23. The ion implantation system of claim 22, wherein, when the wafer holder is in the target position, the beam sensor is perpendicular to the ion beam.
24. The ion implantation system of claim 22, further comprising a second faraday cup.
25. The ion implantation system of claim 22, wherein, when the wafer holder is rotated, the second faraday cup is also rotated.
26. A method for performing an ion implantation into a wafer held by a wafer holder that is tiltable and rotatable, the method comprising;
generating ions and directing them toward the wafer holder;
measuring an amount of ions falling on a first beam sensor that is mounted to the wafer holder, wherein the first beam sensor is mounted such that, when the wafer holding surface of the wafer holder is tilted, the first beam sensor is also tilted, and when the wafer holder is in a target position, the wafer holding surface is tilted from a line perpendicular to the ion beam by an incidence angle \u03b1; and
moving the wafer holder based on the measured amount of ions.
27. The method of claim 26 wherein moving the wafer holder comprises tilting, rotating, or both tilting and rotating.
28. The method of claim 26, further comprising comparing the measured amount of ions to a pre-stored value.
29. The method of claim 28 wherein the pre-stored value indicates a maximum amount of ions falling on the first beam sensor.
30. The method of claim 26, wherein moving the wafer holder also comprises moving the first beam sensor.
31. The method of claim 30, further comprising, moving a second beam sensor.
32. The method of claim 31, wherein the first beam sensor is mounted to a first axis mover, and wherein the second beam sensor is mounted to a second axis mover.
33. The method of claim 32, wherein the wafer holder is coupled to the first axis mover and the second axis mover.
34. An ion implanting system comprising:
an x-axis rotating part for rotating a main surface of a wafer holder about an x-axis,
a y-axis rotating part for rotating the main surface of the wafer holder about a y-axis;
a first faraday cup having a slot and a beam sensing region corresponding to the slot, the first faraday cup fixed to and mounted on the x-axis rotating part at an angle that is offset by an amount equal to a target tilt angle, from a line perpendicular to the main surface of the wafer, the first faraday cup for measuring a tilt angle with respect to the x-axis of the main surface of the wafer holder;
a first meter for measuring an amount of current provided to the beam sensing region, the current in the beam sensing region for controlling and neutralizing secondary electrons generated by collisions of an ion beam with the beam sensing region of the first faraday cup;
a second angle measuring device structured to be moved along with the main surface of the wafer holder, the second angle measuring device for measuring a rotation angle with respect to the y-axis of the main surface of the wafer holder; and
a controller coupled to the first meter and the second angle measuring device, the controller structured to, when the measured tilt and measured rotation angles are different from target tilt and target rotation angles, controlling the x- and y-axis rotating parts until the measured tilt and measured rotation angles are equal to the target tilt and target rotation angles.
35. The ion implanting system of claim 34, wherein the beam sensing region of the first faraday cup is perpendicular to the ion beam when the main surface of the water holder is tilted to the target tilt angle.
36. A wafer holding apparatus for an ion implanting system comprising:
a holding member to which a wafer can be affixed;
an x-axis rotating part for tilting the holding member on an x-axis with respect to an incidence direction of an ion beam;
a y-axis rotating part for rotating the holding member on a y-axis with respect to the incidence direction of the ion beam;
a first faraday cup having a slot and a conductive plate against which the ion beam can be projected through the slot, the first faraday cup fixed to and mounted on the x-axis rotating part, the conductive plate in the first faraday cup is perpendicular to the ion beam when a main surface of the wafer is tilted from the ion beam by an incidence angle \u03b1;
a second faraday cup having a slot and a conductive plate against which the ion beam can be projected through the slot, the second faraday cup fixed to and mounted on the y-axis rotating part;
a first meter for measuring an amount of current provided to the conductive plate of the first faraday cup, the current provided to the conductive plate for controlling and neutralizing secondary electrons generated by collisions of an ion beam with the conductive plate of the first faraday cup;
a second meter for measuring an amount current provided to the conductive plate of the second faraday cup, the current provided to the conductive plate for controlling and neutralizing secondary electrons generated by collisions of the ion beam with the conductive plate of the second faraday cup; and
a controller for comparing data measured by the first meter and the second meter to pre-set data and, according to the result of the comparison, compensating a position of the holding member relative to the ion beam.
37. The apparatus as claimed in claim 36 wherein the incidence angle \u03b1 is between about 2 to 8 degrees.
38. An ion implantation system, comprising:
a wafer holder having a wafer holding surface structured to hold a wafer in an ion beam, the wafer holder tiltable on an x-axis and rotatable on a y-axis relative to the ion beam, the wafer holding surface tilted from a line perpendicular to the ion beam by an incidence angle \u03b1 when the wafer holder is in a target position;
a faraday cup having an opening and structured to measure a number of ions striking a beam sensor that is mounted in the faraday cup perpendicular to the opening and to generate a measuring signal, the faraday cup mounted such that, when the wafer holding surface of the wafer holder is tilted, the faraday cup is also tilted; and
a feedback controller coupled to the measuring system and structured to tilt and rotate the wafer holder based on the measuring signal.

1. A hearing aid, comprising:
a housing formed with an opening, a recess, an undercut, and an abutment;
each of said recess, said undercut, and said abutment being connected to said opening,
said abutment and said undercut being arranged on mutually opposite sides of said opening;
said opening, said recess, said undercut, and said abutment being configured to enable a retaining lug of an audio shoe to be inserted into the undercut through said opening and said recess by a rotational movement around a side of said opening in a vicinity of said undercut;
said abutment being configured to enable the retaining lug, which has been inserted into said undercut, to be removed from said undercut by a rotational movement around the side of the opening in the vicinity of said undercut; and
a lock configured for locking a locking component of an audio shoe inserted into said undercut against a rotational movement out of said undercut around the side of the opening in the vicinity of said undercut.
2. The hearing aid according to claim 1, which comprises electrical contact surfaces disposed to be accessed through said opening and said undercut, said contact surfaces being arranged in a vicinity of said undercut on an inner side of an exterior housing wall.
3. The hearing aid according to claim 1, wherein said lock comprises a notch with a latching lug.
4. The hearing aid according to claim 1, wherein said recess has an arc-shaped configuration around a side of said opening in the vicinity of said undercut.
5. An audio shoe, comprising:
a retaining lug configured for insertion into an undercut formed in a housing of a hearing aid according to claim 1, by rotational movement around a side of the opening in a vicinity of the undercut; and
a locking component configured for engagement with and interlocking with a lock of the hearing aid according to claim 1.
6. The audio shoe according to claim 5, wherein said retaining lug is formed with electrical contact surfaces disposed and configured to be brought into contact with electrical contacts, arranged in an undercut, of the hearing aid according to claim 2, when said retaining lug is inserted into the undercut of the housing of the hearing aid.
7. The audio shoe according to claim 5, wherein said locking component is brought into engagement with the lock by being actuated by an elastic force when the audio shoe with said retaining lug has been inserted into an undercut of the housing of the hearing aid according to claim 1.
8. The audio shoe according to claim 5, wherein the recess in the housing of the hearing aid has an arc-shaped configuration around a side of the opening in the vicinity of the undercut, and said retaining lug is formed with a convex arc-shaped surface on the side thereof oriented toward said recess during an insertion thereof into the undercut in the housing of the hearing aid.
9. A hearing aid system, comprising:
a hearing aid according to claim 1; and
an audio shoe including:
a retaining lug configured for insertion into said undercut formed in said housing of the hearing aid, by rotational movement around a side of said opening in a vicinity of said undercut; and
a locking component configured for engagement with and interlocking with the lock of the hearing aid.
10. A hearing aid, comprising:
a housing formed with an opening, a recess, an undercut, and an abutment, said housing having an exterior wall with an inner side;
each of said recess, said undercut, and said abutment being connected to said opening,
said abutment and said undercut being arranged on mutually opposite sides of said opening;
said opening, said recess, said undercut, and said abutment being configured to enable a retaining lug of an audio shoe to be inserted into the undercut through said opening and said recess by a rotational movement around a side of said opening in a vicinity of said undercut;
said abutment being configured to enable the retaining lug, which has been inserted into said undercut, to be removed from said undercut by a rotational movement around the side of the opening in the vicinity of said undercut;
a lock configured for locking a locking component of an audio shoe inserted into said undercut against a rotational movement out of said undercut around the side of the opening in the vicinity of said undercut; and
electrical contact surfaces disposed on said inner side of said exterior housing wall in a vicinity of said undercut, wherein said electrical contact surfaces are accessible through said opening and said undercut.
11. An audio shoe, comprising:
a retaining lug configured for insertion into an undercut formed in a housing of a hearing aid according to claim 10, by rotational movement around a side of the opening in a vicinity of the undercut; and
a locking component configured for engagement with and interlocking with a lock of the hearing aid according to claim 10;
said retaining lug carrying electrical contact surfaces disposed and configured to be brought into contact with said electrical contacts of the hearing aid according to claim 10 when said retaining lug is inserted into the undercut of the housing of the hearing aid.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A router bit for use with a rotary tool; said router bit comprising:
a body having an upper end and a lower end;
a collar extending outwardly from the lower end of the body; said collar joining the body at a transition point and terminating a distance therefrom in an end face; and wherein the distance between the transition point and end face constitutes the height of the collar;
a shaft extending outwardly from the end face of the collar; said shaft being of a smaller diameter than the collar; said shaft being adapted to be received within a bore of a chuck of the rotary tool; and wherein said end face of the collar is adapted to abut an outer surface of the chuck when the shaft is so received;
at least one unobstructed channel extending from the upper end of the body to the end face of the collar;
at least one cutter blade mounted on the body adjacent the at least one channel and terminating a distance inwardly from the end face of the collar and proximate the transition point; said at least one cutter blade being adapted to cut a profile into a workpiece.
2. The router bit of claim 1, wherein the transition point comprises a stepped shoulder that is of a diameter greater than the collar.
3. The router bit of claim 2, wherein the end face of the collar is adapted to rest on an upper surface of a router bit chuck when the shaft is received within a bore of the chuck; whereby the cutter blade is disposed substantially at least the height of the collar away from the upper surface of the chuck.
4. The router bit of claim 3, wherein the shaft has a terminal end and the terminal end is of a smaller diameter than is the shaft.
5. The router bit of claim 1, wherein the body, collar and shaft are integrally formed.
6. The router bit of claim 1, further comprising a roller guide bearing rotatably mounted to the upper end of the body.
7. In combination:
(a) a router having:
a motor; a drive shaft driven by the motor; and a chuck connected to the drive shaft; said chuck having an upper surface and defining a bore therein;

(b) a first router bit selectively connectable to the chuck, the first router bit comprising:
a first body having an upper end and a lower end;
a first collar extending outwardly from the lower end of the first body; said first collar joining the first body at a first transition point and terminating a distance therefrom in a first end face; and wherein the distance between the first transition point and the first end face constitutes the height of the first collar;
a first shaft extending outwardly from the first end face of the first collar; said first shaft being of a smaller diameter than the first collar; said first shaft being sized to be received within the bore of the chuck; and when so received, the first end face of the first collar rests on the upper surface of the chuck;

at least one unobstructed first channel extending from the upper end of the first body to the first end face of the first collar;
at least one first cutter blade mounted on the first body adjacent the at least one first channel and terminating proximate the first transition point; said at least one first cutter blade being adapted to cut a first profile into a first workpiece at a depth that is substantially equivalent to the height of the first collar;
c) a second router bit selectively connectable to the chuck, the second bit comprising:
a second body having an upper end and a lower end;
a second collar extending outwardly from the lower end of the second body; said second collar joining the second body at a second transition point and terminating a distance therefrom in a second end face; and wherein the distance between the second transition point and the second end face constitutes the height of the second collar;
a second shaft extending outwardly from the second end face of the second collar; said second shaft being of a smaller diameter than the second collar; said second shaft being sized to be received within the bore of the chuck; and when so received, the second end face of the second collar rests on the upper surface of the chuck;

at least one unobstructed second channel extending from the upper end of the second body to the second end face of the second collar;
at least one second cutter blade mounted on the second body adjacent the at least one second channel and terminating proximate the second transition point; said at least one second cutter blade being configured to be complementary in shape to the at least one first cutter blade; said at least one second cutter blade being adapted to cut a second profile into a second workpiece at a depth that is substantially equivalent to the height of the second collar; and wherein the respective heights of the first and second collars are complementary, so that when the first and second router bits are used to cut the respective first and second profiles in the first and second workpieces, an outer surface of the first workpiece is disposed substantially coplanar with an outer surface of the second workpiece when the first and second workpieces are interlockingly engaged with each other.
8. The combination of claim 7, wherein the first transition point comprises a first stepped shoulder that is of a diameter greater than the first collar.
9. The combination of claim 7, wherein the second transition point comprises a second stepped shoulder that is of a diameter greater than the second collar.
10. The combination of claim 7, wherein the first end face of the first collar is adapted to rest on an upper surface of the router bit chuck when the first shaft is received within the bore of the chuck; whereby the at least one first cutter blade is disposed at substantially at least the height of the first collar away from the upper surface of the chuck.
11. The combination of claim 10, wherein the second end face of the second collar is adapted to rest on an upper surface of the router bit chuck when the second shaft is received within the bore of the chuck; whereby the at least one second cutter blade is disposed at substantially at least the height of the second collar away from the upper surface of the chuck.
12. The combination of claim 7, wherein the heights of the first and second collars are substantially equal.
13. The combination of claim 7, wherein the first shaft terminates in a first terminal end and the first terminal end of the first shaft is smaller in diameter than is the first shaft.
14. The combination of claim 7, wherein the second shaft terminates in a second terminal end; and the second terminal end of the second shaft is smaller in diameter than the second shaft.
15. The combination of claim 7, wherein the first body, first collar and first shaft of the first router bit are integrally formed.
16. The combination of claim 7, wherein the second body, second collar and second shaft of the second router bit are integrally formed.
17. The combination of claim 7, further comprising a first roller guide bearing rotatably mounted to the upper end of the first body of the first router bit.
18. The combination of claim 7, further comprising a second roller guide bearing rotatably mounted to the upper end of the second body of the second router bit.
19. A router bit, comprising:
a body having an upper end and a lower end;
a collar extending outwardly from the lower end of the body; said collar joining the body at a transition point and terminating a distance therefrom in an end face; and wherein the distance between the transition point and end face constitutes the height of the collar; and wherein the transition point comprises a stepped shoulder that is of a diameter greater than the collar;
a shaft extending outwardly from the end face of the collar; said shaft being of a smaller diameter than the collar;
at least one unobstructed channel extending from the upper end of the body to the end face of the collar;
at least one cutter blade mounted on the body adjacent the at least one channel and terminating proximate the transition point; said at least one cutter blade being adapted to cut a profile into a workpiece; and wherein the end face of the collar is adapted to rest on an upper surface of a router bit chuck when the shaft is received within a bore of the chuck; whereby the at least one cutter blade is disposed substantially at least the height of the collar away from the upper surface of the chuck.
20. The router bit of claim 19, wherein the shaft has a terminal end and the terminal end is of a smaller diameter than is the shaft.
21. The router bit of claim 19, wherein the body, collar and shaft are integrally formed.
22. The router bit of claim 19, further comprising a roller guide bearing rotatably mounted to the upper end of the body.
23. A router bit kit for use with a rotary cutting tool and comprising:
a first router bit having:
a first cutter blade adapted to cut a first profile in a first workpiece;
a first position stop disposed a first distance from the first cutter blade; said first position stop being adapted to abut an outer surface of a chuck of the rotary tool when the first router bit is engaged therewith and to thereby hold the first cutter blade the first distance away from the outer surface of the chuck;

a second router bit having:
a second cutter blade adapted to cut a second profile in the second workpiece; whereby said second profile is complementary to the first profile in the first workpiece;
a second position stop disposed a second distance from the second cutter blade; said second position stop being adapted to abut the outer surface of the chuck when the second router bit is engaged therewith and to thereby hold the second cutter blade the second distance away from the outer surface of the chuck; whereby an outer surface of the first workpiece is aligned with an outer surface of the second workpiece when the first and second profiles on the first and second workpieces are butted together.
24. The router bit kit as defined in claim 23 wherein the first router bit further includes a continuous first chip channel that runs alongside the first cutter blade and terminates at a chuck-engaging surface of the first position stop.
25. The router bit kit as defined in claim 23 wherein the second router bit further includes a continuous second chip channel that runs alongside the second cutter blade and terminates at a chuck-engaging surface of the second position stop.