1.-25. (canceled)
26. A method performed by a computing device, the method comprising:
receiving, by the computing device, an accounts payable data file for a client that pays a plurality of creditors, wherein the account payable data file includes a plurality of accounts payable entries;
determining, by the computing device, payment schemes for the plurality of accounts payable entries, wherein the payment schemes are determined based on the received accounts payable data file and a stored payables profile for the client;
initiating, by the computing device, payment transactions for the plurality of accounts payable entries, wherein the payment transactions are initiated in accordance with the determined payment schemes;
receiving, by the computing device, payment remittance information for the initiated payment transactions;
consolidating, by the computing device, the payment remittance information and the accounts payable data file to generate consolidated payment data, wherein the consolidating comprises determining whether the plurality of accounts payable entries were paid in accordance with the determined payment schemes; and
generating, by the computing device, a report based on the consolidated payment data.
27. The method of claim 26, wherein the computing device is a payment entity device configured to facilitate payment and reconciliation of accounts payable.
28. The method of claim 26, wherein the computing device is a client device operated by the client.
29. The method of claim 26, wherein the payment schemes include one or more of: a credit account, a debit account, a funds transfer, commercial paper, and monetary consideration.
30. The method of claim 26, further comprising:
comparing the consolidated payment data to payment program data; and
determining a more optimal payment scheme based on the payment program data.
31. The method of claim 30, wherein the payment program data includes a list of financial institutions and corresponding payment types processed by the financial institutions.
32. The method of claim 31, wherein the payment program data further includes one or more of: processing fees, interest rates, reward programs, and rebates associated with the payment types processed by the financial institutions.
33. The method of claim 30, further comprising:
transmitting the report to the client, wherein the report includes the more optimal payment scheme.
34. The method of claim 30, further comprising:
transmitting the report to a creditor in the plurality of creditors, wherein the report includes the more optimal payment scheme.
35. The method of claim 31, further comprising:
transmitting the report to a financial institution in the list of financial institutions, wherein the financial institution is associated with the more optimal payment scheme.
36. A computing device comprising:
a processor; and
a memory coupled to the processor, wherein the memory comprises code executable by the processor for implementing a method comprising:
receiving, by the computing device, an accounts payable data file for a client that pays a plurality of creditors, wherein the account payable data file includes a plurality of accounts payable entries;
determining, by the computing device, payment schemes for the plurality of accounts payable entries, wherein the payment schemes are determined based on the received accounts payable data file and a stored payables profile for the client;
initiating, by the computing device, payment transactions for the plurality of accounts payable entries, wherein the payment transactions are initiated in accordance with the determined payment schemes;
receiving, by the computing device, payment remittance information for the initiated payment transactions;
consolidating, by the computing device, the payment remittance information and the accounts payable data file to generate consolidated payment data, wherein the consolidating comprises determining whether the plurality of accounts payable entries were paid in accordance with the determined payment schemes; and
generating, by the computing device, a report based on the consolidated payment data.
37. The computing device of claim 36, wherein the computing device is a payment entity device configured to facilitate payment and reconciliation of accounts payable.
38. The computing device of claim 36, wherein the computing device is a client device operated by the client.
39. The computing device of claim 36, wherein the payment schemes include one or more of: a credit account, a debit account, a funds transfer, commercial paper, and monetary consideration.
40. The computing device of claim 36, wherein the memory further comprises code executable by the processor for implementing a method comprising:
comparing the consolidated payment data to payment program data; and
determining a more optimal payment scheme based on the payment program data.
41. The computing device of claim 40, wherein the payment program data includes a list of financial institutions and corresponding payment types processed by the financial institutions.
42. The computing device of claim 41, wherein the payment program data further includes one or more of: processing fees, interest rates, reward programs, and rebates associated with the payment types processed by the financial institutions.
43. The computing device of claim 40, wherein the memory further comprises code executable by the processor for implementing a method comprising:
transmitting the report to the client, wherein the report includes the more optimal payment scheme.
44. The computing device of claim 40, wherein the memory further comprises code executable by the processor for implementing a method comprising:
transmitting the report to a creditor in the plurality of creditors, wherein the report includes the more optimal payment scheme.
45. The computing device of claim 41, wherein the memory further comprises code executable by the processor for implementing a method comprising:
transmitting the report to a financial institution in the list of financial institutions, wherein the financial institution is associated with the more optimal payment scheme.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multilayered structure forming method comprising:
disposing a dummy post on a first insulating pattern as a first inkjet process;
disposing a second insulating pattern on the first insulating pattern so as to allow the second insulating pattern to surround a side surface of the dummy post as a second inkjet process; and
disposing a first conductive pattern on the second insulating pattern so as to connect the first conductive pattern to the dummy post as a third inkjet process; wherein the first inkjet process includes a process for ejecting a functional liquid containing a first conductive material having high adhesiveness to the first conductive pattern onto the first insulating pattern.
2. The multilayered structure forming method according to claim 1, wherein the second inkjet process includes a process for ejecting one of a functional liquid containing a predetermined insulating material having high adhesiveness to the first insulating pattern and a functional liquid containing a precursor of the predetermined insulating material having high adhesiveness to the first insulating pattern onto the first insulating pattern.
3. The multilayered structure forming method according to claim 2, further comprising: disposing the first insulating pattern on an object surface as a fourth inkjet process.
4. The multilayered structure forming method according to claim 2, wherein the first insulating pattern is comprised of a same material as the predetermined insulating material.
5. The multilayered structure forming method according to claim 1, wherein the first conductive material is same as a material of the first conductive pattern.
6. The multilayered structure forming method according to claim 1, wherein the first conductive material includes a same metal as the first conductive pattern.
7. The multilayered structure forming method according to claim 3, further comprising:
disposing a conductive post on a second conductive pattern disposed on the object surface as a fifth inkjet process;
disposing the first insulating pattern on the object surface as the fourth inkjet process so as to allow the first insulating pattern to cover the second conductive pattern and surround a lower part of a side surface of the conductive post;
insulating pattern on the first insulating pattern as the second inkjet process so as to allow the second insulating pattern to surround a remaining part of the side surface of the conductive post and the side surface of the dummy post; and
disposing the first conductive pattern on the second insulating pattern as the third inkjet process so as to connect the first conductive pattern to the conductive post and the dummy post.
8. The multilayered structure forming method according to claim 1, wherein the third inkjet process includes a process for disposing a connection land as the first conductive pattern.
9. The multilayered structure forming method according to claim 1, wherein the third inkjet process includes a process for disposing a top surface layer of a multilayered structure as the first conductive pattern.
10. A multilayered structure forming method comprising:
disposing a dummy post and a second insulating pattern surrounding a side surface of the dummy post as a first inkjet process; and
disposing a first conductive pattern on the second insulating pattern as second inkjet process so as to connect the first conductive pattern to the dummy post, wherein the first inkjet process includes:
(a) forming a layer of a functional liquid by ejecting one of the functional liquid containing a predetermined insulating material and the functional liquid containing a precursor of the predetermined insulating material onto a first insulating pattern as a first process; and
(b) forming a dummy post precursor by ejecting a functional liquid containing a first conductive material having high adhesiveness to the dummy post onto the layer of the functional liquid as a second process
11. The multilayered structure forming method according to claim 10, wherein the first inkjet process further includes:
(c) activating the layer of the functional liquid and the dummy post precursor simultaneously so as to obtain the second insulating pattern from the layer of the functional liquid and the dummy post from the dummy post precursor, respectively as a third process.
12. The multilayered structure forming method according to claim 10, wherein the first process includes a process for ejecting one of the functional liquid containing the predetermined insulating material having high adhesiveness to the first insulating pattern and the functional liquid containing the precursor of the predetermined insulating material having high adhesiveness to the first insulating pattern onto the first insulating pattern.
13. The multilayered structure forming method according to claim 12, further comprising a third inkjet process for disposing the first insulating pattern on an object surface.
14. The multilayered structure forming method according to claim 12, wherein the first insulating pattern is comprised of a same material as the predetermined insulating material.
15. The multilayered structure forming method according to claim 10, wherein the first conductive material is same as a material of the first conductive pattern.
16. The multilayered structure forming method according to claim 10, wherein the first conductive material includes a same metal as the first conductive pattern.
17. A multilayered structure forming method comprising:
disposing an uneven pattern on a conductive pattern disposed on a surface of a substrate and comprised of a first conductive material as a first inkjet process; and
disposing an insulating pattern covering the conductive pattern and the uneven pattern as a second inkjet process.