Author: claimsbot

1. An electronic device comprising a leadframe attached to a die and embedded in a mold packaging, said leadframe with wires bonded to said die for electrical interconnection therebetween, said leadframe further comprises
a) at least one predetermined bonding surface with said wires bonded thereon;
b) at least one predetermined soldering surface exposed to the exterior of said mold packaging and adapted for soldering connection with an external circuit;
c) at least one predetermined mold adhesion surface whereon said mold is attached thereto; and
d) at least one predetermined die attachment surface whereon said die is attached thereto; wherein said soldering surface and said bonding surface are non-roughened and nickel palladium gold is deposited onto the surface of said leadframe at said soldering surface and said bonding surface; and said mold adhesion surface and said die attachment surface are free of metal plating and roughened to increase the surface area for attachment to said mold and said die respectively such that adhesion is enhanced.
2. The device according to claim 1 wherein a roughening agent is used for roughening said leadframe material; and said roughening agent is non-reactive with said nickel palladium gold.
3. The device according to claim 1 wherein said leadframe further comprises at least one predetermined exposed surface provided outside said mold packaging for connecting said leadframe to an external circuit, wherein said exposed surface is plated with nickel palladium gold.
4. The device according to claim 1 wherein side edges of said leadframe are roughened to increase the surface area for attachment to said mold such that adhesion is enhanced.
5. A leadframe for electrical connection in a die packaging comprising
a) at least one predetermined bonding surface for wire bonding thereon;
b) at least one predetermined soldering surface adapted for exposure to the exterior of said packaging for solder connection with an external circuit;
c) at least one predetermined mold adhesion surface for adhesion of packaging mold thereto; and
d) at least one predetermined die attachment surface for attachment of said die thereto; wherein said soldering surface and said bonding surface are non-roughened and nickel palladium gold is deposited onto the surface of said leadframe material at said soldering surface and said bonding surface; said mold adhesion surface and said die attachment surface are free of metal plating and roughened to increase the surface area for attachment to said mold and said die respectively such that adhesion is enhanced.
6. The leadframe according to claim 5 wherein a roughening agent is used for roughening said leadframe material; and said roughening agent is non-reactive with said nickel palladium gold.
7. The leadframe according to claim 5 wherein said leadframe further comprises at least one predetermined exposed surface provided outside said mold packaging for connecting said leadframe to an external circuit, wherein said exposed surface is plated with nickel palladium gold.
8. The leadframe according to claim 5 wherein side edges of said leadframe are roughened to increase the surface area for attachment to said mold such that adhesion is enhanced.
9. In an electronic device according to claim 1, a method of treating said leadframe for enhanced attachability to said mold package and said die comprising
a) selectively protecting the molding and die attachment surfaces from plating;
b) selectively plating the wire bonding surface of said leadframe with nickel palladium gold; and
c) selectively roughening said contact surfaces of said leadframe with said die and said mold packaging.
10. The method according to claim 9 further comprising the step of selectively plating said soldering surface with nickel palladium gold.
11. The method according to claim 9 wherein said selective plating step comprises the steps of coating said leadframe with a protective material; selectively removing said protecting material from preselected surfaces of said leadframe on which said nickel palladium gold plating is desired; and plating said nickel palladium gold layer onto said preselected surfaces.
12. An electronic device according to claim 1 characterized in that said leadframe adheres to said mold packaging with sufficient strength to remain laminated for at least one year at a minimum temperature of 30\xb0 C. and a minimum relative humidity of 60%.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A bearing-positioning tool set comprising:
a grip (1) having a hammering end opposite an inner end which is fixed with a combining rod (10) extending outward, said combining rod bored with a combining threaded hole (11);
one positioning press block (2), said positioning press block to be fitted with said grip being bored with an insert hole (20) in a center of said positioning press block, each said positioning press block (2) formed with a first circular fitting member (21), a first circular holding edge (22), a second circular fitting member (23) and a second circular holding edge (24) which are arranged sequentially; wherein said first circular fitting member (21) has a conic shape with a large bottom near said first circular holding edge (22); and said second circular fitting member (23) has a conic shape with a large bottom near said second circular holding edge (24); and said first circular holding edge (22) has an outer diameter greater than that of said first circular fitting member (21) and also greater than that of said second circular fitting member (23); and an outer diameter of said first circular holding edge 22 is greater than that of said second circular holding edge (24); a circular protruding portion is formed between the first circular edge (22) and said second circular holding edge (24);
three through holes formed around said insert hole (20) and formed in said positioning press block (22);
a combining member (3) threadably combined with said combining threaded hole (11) of said grip (1) for fixing said positioning press block (2) in position; and
wherein in operation, said combining rod (10) of said grip (1) is inserted through said insert hole (20) of said positioning press block (2) and then said combining member (3) is threadably combined with said combining threaded hole (11) of said grip (1) to fix said positioning press block (2) in position; a bearing is positioned to be assembled in the receiving hole of an axle when one of said first fitting member 21 and said second fitting member 23 closely contacts with an inner wall of said bearing with a respective one of said first holding edge (22) and said second holding edge (23) closely and horizontally resting on an upper edge of said bearing, and then said bearing can be driven into said receiving hole by striking said hammering end (12) of said grip (1) with a hammering tool; therefore, said bearing can smoothly and quickly be assembled and positioned in the receiving hole.
2. The bearing positioning tool set as claimed in claim 1, wherein a toolbox is provided for depositing and storing the members of said tool set.

1. A method for time release delivery of chromium complex 2
Cr3O(carboxylate)6(H2O)3+\u2003\u2003(2)

comprising:
administering to a subject in need thereof a time release composition, comprising:
a chromium complex having formula 3
Cr3O(carboxylate)6(ligand)3+\u2003\u2003(3)
wherein carboxylate is a C2-C5 alkyl carboxylate and wherein the ligand is a ligand that (i) renders the chromium complex insoluble or only slightly soluble in water and (ii) is acid labile, being readily displaced under acidic conditions below pH=4 and replaced by water to make the resulting water soluble complex 2
Cr3O(carboxylate)6(H2O)3+\u2003\u2003(2).
2. The method of claim 1 wherein the time release composition further comprises a carrier.
3. The method of claim 1 wherein the time release composition further comprises a single dose of chromium complex 2.
4. The method of claim 1, wherein carboxylate is acetate or propionate.
5. The method of claim 1, wherein ligand is a nitrogen containing heterocycle.
6. The method of claim 5, wherein ligand is a member selected from pyridine, pyrrolidone, piperazine and imidazole.
7. The method of claim 4, wherein ligand is pyridine.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An assembly for inhibiting propagation of a detonation wave in a combustible fuel delivery system, the assembly comprising:
a detonation wave deflector configured to deflect the detonation wave towards a burst membrane, wherein the burst membrane is configured to break in the presence of the detonation wave and configured to at least partially surround the detonation wave deflector; and
a shut-off valve removably attached to the burst membrane, wherein the shut-off valve is configured to stop a flow of a combustible fluid through the assembly upon a rupture in the burst membrane.
2. The assembly of claim 1, wherein the detonation wave deflector and the burst membrane are further configured to form a series of flow paths between the detonation wave deflector and the burst membrane for the flow of the combustible fluid.
3. The assembly of claim 1, wherein the detonation wave deflector is further configured as a single mass comprising:
a multi-sided base mass portion; and
a conical mass portion attached to a top of the multi-sided base mass portion and extending towards an apex thereof.
4. The assembly of claim 3, wherein the detonation wave deflector includes a series of grooves at a base of the multi-sided base mass portion.
5. The assembly of claim 4, further comprising:
a porous media element configured to be located adjacent to the groves at the base of the multi-sided base mass portion.
6. The assembly of claim 5, wherein the porous media element is located adjacent to the groves at the base of the multi-sided base mass portion to create a plurality of radial paths for the flow of the combustible fluid.
7. The assembly of claim 5, further comprising:
a flame-arrestor structure;
a cap structure; and
a connector mechanism adapted to connect the flame-arrestor structure and the cap structure in a manner that holds the detonation wave deflector and the burst membrane between the flame-arrestor structure and the cap structure.
8. The assembly of claim 7, wherein the flame-arrestor structure includes a receptor structure to hold the porous media element.
9. The assembly of claim 1, wherein the shut-off valve is located in the path of the combustible fluid.
10. The assembly of claim 1, wherein at least one part of the burst membrane towards its center has a thinner wall as compared to a thickness of the burst membrane towards its edges.
11. The assembly of claim 1, wherein the burst membrane further comprises:
a plurality of circumferential grooves along a length of the burst membrane.
12. The assembly of claim 11, wherein a thickness of the circumferential grooves varies along a length of the burst membrane.
13. The assembly of claim 1, further comprising:
a casing surrounding the burst membrane.
14. The assembly of claim 5, wherein the detonation wave deflector has a thermal mass that prevents dissipation of heat generated from the detonation wave from reaching the porous media element.
15. A method of inhibiting propagation of a detonation wave in a combustible fuel delivery system, the method comprising:
locating a flashback arrestor assembly in a path of the detonation wave;
deflecting the detonation wave from a detonation wave deflector towards a burst membrane that at least partially surrounds the detonation wave deflector, wherein the burst membrane is configured to break in the presence of the detonation wave; and
stopping a flow of a combustible fluid through the flashback arrestor assembly by closing a shut-off valve located in a path of the combustible fluid and removably attached to the burst membrane upon a rupture in the burst membrane.
16. The method of claim 15, further comprising:
locating a porous media element adjacent to a base of a multi-sided base mass portion of the detonation wave deflector.
17. The method of claim 15, wherein the detonation wave deflector has a thermal mass that prevents dissipation of heat generated from the detonation wave from reaching the porous media element.
18. A detonation wave arrestor, comprising:
a detonation wave deflector located in a path of a combustible fluid;
a burst membrane configured to at least partially surround the detonation wave deflector, wherein the burst membrane is configured to allow dissipation of a detonation wave away from the detonation wave deflector; and
a shut-off valve removably attached to the burst membrane, wherein the shut-off valve is configured to stop a flow of a combustible fluid upon a rupture in the burst membrane.
19. The detonation wave arrestor of claim 18, further comprising:
a porous media element of varying porous density located adjacent to a base of the detonation wave deflector.
20. The detonation wave arrestor of claim 19, wherein the porous media element is made of aluminum.
21. The detonation wave arrestor of claim 20, wherein a thermal mass of the detonation wave deflector prevents dissipation of heat generated from the detonation wave from reaching the porous media element.
22. The assembly of claim 5, wherein the porous media element is made of aluminum.
23. The detonation wave arrestor of claim 20, wherein the porous media element is made of a plurality of aluminum media elements, with at least two of the plurality of aluminum media elements having different porosity.
24. The detonation wave arrestor of claim 19, wherein the porous media element is made of at least one of a ferrous material, a non-ferrous material, and a refractory material.
25. The detonation wave arrestor of claim 18, wherein the detonation wave deflector is made of at least one of a ferrous material, a non-ferrous material, a refractory material, carbon, and a carbon composite.