Author: claimsbot

1. A fluid ejection system, comprising:
first and second fluid supplies;
first and second fluid restrictions communicated with respective of the first and second fluid supplies; and
first and second fluid chambers communicated with respective of the first and second fluid restrictions,
wherein the first fluid restriction has a width in a range of 8 microns to 10 microns and a length in a range of 10 microns to 20 microns, and the second fluid restriction has a width in a range of 10 microns to 16 microns and a length in a range of 5 microns to 10 microns.
2. The fluid ejection system of claim 1, further comprising:
first and second fluid feed slots communicated with respective of the first and second fluid supplies and respective of the first and second fluid chambers via respective of the first and second fluid restrictions,
wherein a distance from an edge of the first fluid feed slot to a center of the first fluid chamber is in a range of 61 microns to 71 microns, and a distance from an edge of the second fluid feed slot to a center of the second fluid chamber is in a range of 51 microns to 61 microns.
3. The fluid ejection system of claim 1, further comprising:
first and second resistors formed within respective of the first and second fluid chambers, wherein the first resistor has an area of 400 square microns and the second resistor has an area of 450 square microns.
4. The fluid ejection system of claim 1, further comprising:
first and second orifices communicated with respective of the first and second fluid chambers,
wherein the first orifice has a diameter of 14 microns and the second orifice has a diameter of 15 microns.
5. The fluid ejection system of claim 1, wherein fluid of the first fluid supply has a surface tension of 58 dynescentimeter and a viscosity of 1.8 centipoise, and fluid of the second fluid supply has a surface tension of 29 dynescentimeter and a viscosity of 2.5 centipoise.
6. The fluid ejection system of claim 1, wherein the system is adapted to eject drops of fluid of the first fluid supply from the first fluid chamber at a frequency up to at least 24 kilohertz with each of the drops having a weight of 6 nanograms, and eject drops of fluid of the second fluid supply from the second fluid chamber at a frequency up to at least 36 kilohertz with each of the drops having a weight of 5 nanograms.
7. The fluid ejection system of claim 1, wherein the first fluid supply includes a black ink and the second fluid supply includes a colored ink.
8. A fluid ejection system, comprising:
first and second fluid supplies;
first and second fluid restrictions communicated with respective of the first and second fluid supplies;
first and second fluid chambers communicated with respective of the first and second fluid restrictions; and
first and second fluid feed slots communicated with respective of the first and second fluid supplies and respective of the first and second fluid chambers via respective of the first and second fluid restrictions,
wherein a distance from an edge of the first fluid feed slot to a center of the first fluid chamber is in a range of 61 microns to 71 microns, and a distance from an edge of the second fluid feed slot to a center of the second fluid chamber is in a range of 51 microns to 61 microns, and
wherein the first fluid restriction has a width in a range of 8 microns to 10 microns and a length in a range of 10 microns to 20 microns, and the second fluid restriction has a width in a range of 10 microns to 16 microns and a length in a range of 5 microns to 10 microns.
9. The fluid ejection system of claim 8, further comprising:
first and second resistors formed within respective of the first and second fluid chambers, wherein the first resistor has an area of 400 square microns and the second resistor has an area of 450 square microns.
10. The fluid ejection system of claim 8, further comprising:
first and second orifices communicated with respective of the first and second fluid chambers,
wherein the first orifice has a diameter of 14 microns and the second orifice has a diameter of 15 microns.
11. The fluid ejection system of claim 8, wherein fluid of the first fluid supply has a surface tension of 58 dynescentimeter and a viscosity of 1.8 centipoise, and fluid of the second fluid supply has a surface tension of 29 dynescentimeter and a viscosity of 2.5 centipoise.
12. The fluid ejection system of claim 8, wherein the system is adapted to eject drops of fluid of the first fluid supply from the first fluid chamber at a frequency up to at least 24 kilohertz with each of the drops having a weight of 6 nanograms, and eject drops of fluid of the second fluid supply from the second fluid chamber at a frequency up to at least 36 kilohertz with each of the drops having a weight of 5 nanograms.
13. The fluid ejection system of claim 8, wherein the first fluid supply includes a black ink and the second fluid supply includes a colored ink.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for packaging non-volatile memory, comprising:
selecting, from a set of non-volatile memory die, a plurality of non-volatile memory die on which predefined die-level and sub-die level tests have been deferred until after packaging, in accordance with predefined criteria and predefined statistical die performance information corresponding to the set of non-volatile memory die;
packaging the selected plurality of non-volatile memory die into a memory device; and
after said packaging, performing a set of tests on the plurality of non-volatile memory die in the memory device to identify respective units of memory within the non-volatile memory die in the memory device that meet predefined validity criteria, wherein the set of tests performed include the deferred predefined die-level and sub-die level tests.
2. The method of claim 1, wherein the selecting includes selecting the plurality of non-volatile memory die in accordance with wafer positions of the plurality of non-volatile memory die.
3. The method of claim 1, wherein the selecting includes selecting the plurality of non-volatile memory die in accordance with wafer positions of the plurality of non-volatile memory die and statistical die performance information corresponding to the wafer positions.
4. The method of claim 1, further including:
deferring at least until the selected plurality of non-volatile memory die are packaged into the memory device, or forgoing entirely, performance of at least one of the following tests: a wafer sort test, a memory component test, a known good die test, and a burn-in test.
5. The method of claim 1, wherein the selecting includes:
in accordance with the predefined statistical die performance information, selecting a number of die so as to over-provision the memory device to guarantee, within a predefined statistical tolerance, a minimum amount of programmableerasable memory in the memory device.
6. The method of claim 1, further including:
after packaging the plurality of non-volatile memory die into the memory device, determining an amount of programmableerasable memory in the memory device.
7. The method of claim 1, further including:
after packaging the plurality of non-volatile memory die into the memory device, during initialization of the memory device, performing an initialization procedure that includes determining a validity state of one or more units of memory of the plurality of non-volatile memory die, the validity state being one of a valid state or an invalid state; and
using physical-to-physical address remapping to redirect a readwrite request addressed to a respective unit of memory having an invalid state to a unit of memory having a valid state.
8. The method of claim 7, wherein determining a validity state of the one or more units of memory includes:
determining a validity metric of the one or more units of memory; and
comparing the validity metric to a predefined threshold to determine the validity state of the one or more units of memory.
9. The method of claim 8, wherein the validity metric is a bit error rate (BER) of the one or more units of memory during initialization.
10. The method of claim 8, further including:
writing to the plurality of non-volatile memory die in accordance with a wear leveling algorithm that accounts for the validity metric determined during initialization.
11. The method of claim 1, wherein the set of non-volatile memory die comprises flash memory.
12. The method of claim 1, wherein a median number of programerase (PE) cycles performed on units of memory of the plurality of non-volatile memory die prior to the packaging is less than fifty PE cycles.
13. A storage system, comprising:
an interface for operatively coupling the storage system with a host system; and
a plurality of non-volatile memory die selected, packaged, and tested in accordance with the method of claim 1.

1. A computer-implemented method for points-to analysis using at least three levels of subtyping in an optimizing compiler, comprising:
assigning a first location type to one of a variable and an expression in a computer program, wherein the assigning of the first location type includes assigning a first location type that has exactly one location type supertype representing the abstract locations represented by the first location type, and wherein the location type supertype represents other memory locations that are not represented by the first location type;
assigning a supertype component to a data constructor associated with the first location type, wherein the supertype component has the location type representing the set of abstract location represented by the first location type, and wherein the location type supertype represents other memory location that are not represented by the first location type;
assigning a reader component to a data constructor associated with the first location type, whereby the reader component has a second location type; and
assigning a writer component to a data constructor associated with the first location type, whereby the writer component has a third location type.
2. The method of claim 1, wherein the assigning of the first location type includes assigning a first location type that represents a complex set of abstract locations.
3. The method of claim 2, wherein the assigning of the first location type includes assigning a first location type that is a subtype of a second location type that is arranged to represent a complex set of abstract locations that includes the set of abstract locations that are represented by the first location type.
4. The method of claim 3, wherein the assigning of the first location type includes assigning the first location type to a first set of memory locations that has a subset relationship to a second set of memory locations having the second location type such that the subset relationship of the first and second sets reflects a subtype relationship between program types.
5. The method of claim 3, wherein the assigning of the first location type includes assigning a first location type wherein the subset relationship between the sets of memory locations that are represented by the first and second location types is arranged to reflect the program typographical appearance of the abstract locations.
6. The method of claim 1, wherein the assigning of the reader component includes assigning a reader component that has a location type that represents one of an empty set, a singleton set that represents a single abstract location, and a complex set that represents multiple abstract locations.
7. The method of claim 6, wherein the assigning of the writer component includes assigning a writer component that has a location type that represents one of an empty set, a singleton set that represents a single abstract location, and a complex set that represents multiple abstract locations.
8. An apparatus for performing points-to analysis, comprising:
means for assigning a first location type to one of a variable and an expression in a computer program, wherein the first location type is arranged to represent exactly one abstract location in a computer program and wherein the first location type has exactly one location type supertype representing the set of abstract location represented by the first location type, and wherein the location type;
means for assigning a reader component to a data constructor associated with the first location type, whereby the reader component has a second location type; and
means for assigning a writer component to the data constructor associated with the first location type, whereby the writer component has a third location type,
wherein the first location type has exactly one location type supertype representing the set of abstract location represented by the first location type, and wherein the location type supertype is arranged to represent other memory locations that are not represented by the first location type.
9. The apparatus of claim 8, further comprising means for assigning a supertype component to a data constructor associated with the first location type, wherein the supertype component has the location type representing the set of abstract location represented by the first location type, and wherein the location type supertype is arranged to represent other memory locations that are not represented by the first location type.
10. The apparatus of claim 9, wherein the assigning of the first location type is arranged to represent a complex set of abstract locations.
11. The apparatus of claim 10, wherein the first location type is a subtype of a fourth location type that is arranged to represent a complex set of abstract locations that includes the set of abstract locations that are represented by the first location type.
12. The method of claim 11, wherein the first location type is arranged to represent a first set of memory locations that has a subset relationship to a second set of memory locations having the fourth location type such that the subset relationship of the first and fourth sets reflects a subtype relationship between program types.
13. The method of claim 11, wherein the first location type is arranged to represent a subset relationship between the sets of memory locations that are represented by the first and fourth location types such that the subset relationship reflects the program typographical appearance of the abstract locations.
14. The apparatus of claim 9, wherein the reader component has a location type that is arranged to represent one of an empty set, a singleton set that represents one abstract location, and a complex set that represents multiple abstract locations.
15. The apparatus of claim 14, wherein the writer component has a location type that is arranged to represent one of an empty set, a singleton set that represents one abstract location, and a complex set that represents multiple abstract locations.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An isolator sub for use in a wellbore of a subterranean wellbore of a subterranean formation, the isolator sub comprising:
a first rod comprising at least one first rod wall forming a first rod cavity, wherein the first rod further comprises a first coupling feature disposed at a first end;
a second rod comprising at least one second rod wall forming a second rod cavity, wherein the second rod further comprises a second coupling feature disposed at a first end, wherein the second rod is electrically conductive;
an isolator comprises an electrically non-conductive material, at least one isolator wall, a first complementary coupling feature, and a second complementary coupling feature, wherein the at least one isolator wall forms an isolator cavity, wherein the first coupling feature couples to the first complementary coupling feature, and wherein the second coupling feature couples to the second complementary coupling feature; and
an outer housing disposed around and coupled to the first rod, the second rod, and the isolator, wherein the outer housing is electrically conductive and comprises at least one third coupling feature, wherein the at least one third coupling feature is configured to electrically couple to an electrical cable,
wherein the isolator physically separates the first rod and the second rod, and wherein the isolator prevents direct electrical and physical communication between the first rod and the second rod.
2. The isolator sub of claim 1, wherein the outer housing comprises:
a cylinder comprising a first outer housing coupling feature; and
an end nut mechanically coupled to the cylinder and comprising a second outer housing coupling feature, wherein the second outer housing coupling feature mechanically couples to the first outer housing coupling feature.
3. The isolator sub of claim 2, wherein the at least one third coupling feature is disposed on the end nut.
4. The isolator sub of claim 2, further comprising:
a spacer disposed between the cylinder, the end nut, and a spacer coupling feature disposed on the first rod, wherein the spacer is electrically non-conductive.
5. The isolator sub of claim 2, wherein the second rod further comprises a cylinder coupling feature that couples to a complementary cylinder coupling feature disposed on the cylinder.
6. The isolator sub of claim 1, wherein the first rod avoids direct electrical contact with the outer housing.
7. The isolator sub of claim 1, wherein the first rod cavity, the second rod cavity, and the isolator cavity form a continuous isolator sub cavity along an assembled length of the first rod, the isolator, and the second rod.
8. The isolator sub of claim 1, wherein the first rod cavity, the second rod cavity, and the isolator cavity each have a substantially uniform similar cross-sectional shape and size relative to each other.
9. The isolator sub of claim 1, wherein the first rod further comprises a first tubing coupling feature disposed at a second end, wherein the first tubing coupling feature is configured to mechanically couple to a first tubing pipe.
10. The isolator sub of claim 9, wherein the second rod further comprises a second tubing coupling feature disposed at a second end, wherein the second tubing coupling feature is configured to mechanically couple to a second tubing pipe.
11. The isolator sub of claim 10, wherein the second tubing pipe is electrically conductive, and wherein electrical power received by the outer housing from the electrical cable flows through the second rod to the second tubing pipe.
12. The isolator sub of claim 10, wherein the second tubing pipe is electrically conductive, and wherein electrical power received by the second rod from the second tubing pipe flows through the outer housing to the electrical cable.
13. The isolator sub of claim 1, wherein the isolator comprises at least one material that withstands high amounts of force, wherein the first complementary coupling feature and the second complementary coupling feature of the isolator can withstand a torque of approximately 2400 pound-feet during a field operation, wherein the torque is measured rotationally around a length of the isolator.
14. The isolator sub of claim 1, wherein the first rod is electrically non-conductive.
15. A system for applying power into a wellbore within a subterranean formation, the system comprising:
a casing disposed within the wellbore having a first cavity running therethrough, wherein the casing is electrically conductive;
a tubing string disposed within the first cavity, wherein the tubing string comprises a top neutral section positioned proximate to an entry point of the wellbore and a power-transmitting section positioned below the top neutral section;
a first isolator sub positioned between the top neutral section and the power-transmitting section of the tubing string, wherein the first isolator sub comprises:
a first rod mechanically coupled to the top neutral section, wherein the first rod comprises a first coupling feature disposed at a first distal end;
a second rod mechanically coupled to the power-transmitting section, wherein the second rod comprises a second coupling feature disposed at a second proximal end, wherein the second rod is electrically conductive;
a first isolator comprises an electrically non-conductive material, a first complementary coupling feature and a second complementary coupling feature, wherein the first coupling feature couples to the first complementary coupling feature, and wherein the second coupling feature couples to the second complementary coupling feature; and
a first outer housing coupled to the first rod, the second rod, and the first isolator, wherein the outer housing is electrically conductive and comprises at least one third coupling feature;

a power source positioned above the entry point and electrically coupled to the outer housing using the at least one third coupling feature; and
an electrical load electrically coupled to the power-transmitting section of the tubing string and disposed within the wellbore,
wherein the isolator physically separates the first rod and the second rod, and wherein the isolator prevents direct electrical and physical communication between the first rod and the second rod.
16. The system of claim 15, further comprising:
a second isolator sub positioned between a bottom neutral section and the power-transmitting section of the tubing string, wherein the first isolator sub comprises:
a third rod mechanically coupled to the bottom neutral section of the tubing string, wherein the third rod comprises a fourth coupling feature disposed at a third distal end;
a fourth rod mechanically coupled to the power-transmitting section, wherein the fourth rod comprises a fifth coupling feature disposed at a fourth proximal end, wherein the fourth rod is electrically conductive;
a second isolator comprises the electrically non-conductive material, a fourth complementary coupling feature, and a fifth complementary coupling feature, wherein the fifth coupling feature couples to the fifth complementary coupling feature, and wherein the fourth coupling feature couples to the fourth complementary coupling feature; and
a second outer housing coupled to the third rod, the fourth rod, and the second isolator, wherein the outer housing is electrically conductive and comprises at least one sixth coupling feature,
wherein the second isolator sub is inverted relative to the first isolator sub.
17. The system of claim 15, wherein the wellbore reaches a pressure of approximately 15,000 pounds per square inch.
18. The system of claim 15, wherein the power-transmitting section of the tubing string weighs approximately 200,000 pounds.
19. The system of claim 15, wherein the wellbore has an ambient temperature of approximately 625\xb0 F.
20. The system of claim 15, wherein the wellbore contains hydrogen sulfide.